{"id":"https://openalex.org/W1998463295","doi":"https://doi.org/10.1109/ipfa.2013.6599137","title":"Fast 3D tomography at package level by using Xe plasma focused ion beam","display_name":"Fast 3D tomography at package level by using Xe plasma focused ion beam","publication_year":2013,"publication_date":"2013-07-01","ids":{"openalex":"https://openalex.org/W1998463295","doi":"https://doi.org/10.1109/ipfa.2013.6599137","mag":"1998463295"},"language":"en","primary_location":{"id":"doi:10.1109/ipfa.2013.6599137","doi":"https://doi.org/10.1109/ipfa.2013.6599137","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ipfa.2013.6599137","pdf_url":null,"source":{"id":"https://openalex.org/S7407086221","display_name":"IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"T. Hrncir","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I105419764","display_name":"Tescan (Czechia)","ror":"https://ror.org/0556an218","country_code":"CZ","type":"company","lineage":["https://openalex.org/I105419764"]}],"countries":["CZ"],"is_corresponding":false,"raw_author_name":"T. Hrncir","raw_affiliation_strings":["Tescan A.S., Brno, Czech Republic"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tescan A.S., Brno, Czech Republic","institution_ids":["https://openalex.org/I105419764"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057526581","display_name":"Luk\u00e1\u0161 Hlad\u00edk","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I105419764","display_name":"Tescan (Czechia)","ror":"https://ror.org/0556an218","country_code":"CZ","type":"company","lineage":["https://openalex.org/I105419764"]}],"countries":["CZ"],"is_corresponding":false,"raw_author_name":"L. Hladik","raw_affiliation_strings":["Tescan A.S., Brno, Czech Republic"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tescan A.S., Brno, Czech Republic","institution_ids":["https://openalex.org/I105419764"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059156989","display_name":"M. Zadra\u017eil","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I105419764","display_name":"Tescan (Czechia)","ror":"https://ror.org/0556an218","country_code":"CZ","type":"company","lineage":["https://openalex.org/I105419764"]}],"countries":["CZ"],"is_corresponding":false,"raw_author_name":"M. Zadrazil","raw_affiliation_strings":["Tescan A.S., Brno, Czech Republic"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tescan A.S., Brno, Czech Republic","institution_ids":["https://openalex.org/I105419764"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I105419764"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.08852365,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":null,"issue":null,"first_page":"112","last_page":"115"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.8320000171661377,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.8320000171661377,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13552","display_name":"Advanced Materials Characterization Techniques","score":0.1624000072479248,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12166","display_name":"Ion-surface interactions and analysis","score":0.0010999999940395355,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/3d-tomography","display_name":"3D tomography","score":0.9449999928474426},{"id":"https://openalex.org/keywords/fib-sem","display_name":"FIB-SEM","score":0.8059999942779541},{"id":"https://openalex.org/keywords/solder-bumps","display_name":"solder bumps","score":0.5580000281333923},{"id":"https://openalex.org/keywords/failure-analysis","display_name":"failure analysis","score":0.8019999861717224},{"id":"https://openalex.org/keywords/backscattered-electron-imaging","display_name":"backscattered electron imaging","score":0.8539999723434448},{"id":"https://openalex.org/keywords/3d-reconstruction","display_name":"3D reconstruction","score":0.8479999899864197},{"id":"https://openalex.org/keywords/material-interfaces","display_name":"material interfaces","score":0.44699999690055847}],"concepts":[{"id":"https://openalex.org/C2776190703","wikidata":"https://www.wikidata.org/wiki/Q488148","display_name":"Slicing","level":2,"score":0.7658286094665527},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7606202363967896},{"id":"https://openalex.org/C161866238","wikidata":"https://www.wikidata.org/wiki/Q258563","display_name":"Focused ion beam","level":3,"score":0.6801109910011292},{"id":"https://openalex.org/C82706917","wikidata":"https://www.wikidata.org/wiki/Q10251","display_name":"Plasma","level":2,"score":0.5659674406051636},{"id":"https://openalex.org/C20556612","wikidata":"https://www.wikidata.org/wiki/Q4469374","display_name":"Volume (thermodynamics)","level":2,"score":0.5249680876731873},{"id":"https://openalex.org/C163716698","wikidata":"https://www.wikidata.org/wiki/Q841267","display_name":"Tomography","level":2,"score":0.5205653309822083},{"id":"https://openalex.org/C145148216","wikidata":"https://www.wikidata.org/wiki/Q36496","display_name":"Ion","level":2,"score":0.4609198570251465},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.2712317109107971},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.15432733297348022},{"id":"https://openalex.org/C121684516","wikidata":"https://www.wikidata.org/wiki/Q7600677","display_name":"Computer graphics (images)","level":1,"score":0.11325973272323608},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.09843769669532776},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.06906339526176453},{"id":"https://openalex.org/C185544564","wikidata":"https://www.wikidata.org/wiki/Q81197","display_name":"Nuclear physics","level":1,"score":0.0553530752658844},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ipfa.2013.6599137","doi":"https://doi.org/10.1109/ipfa.2013.6599137","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ipfa.2013.6599137","pdf_url":null,"source":{"id":"https://openalex.org/S7407086221","display_name":"IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W2029189855","https://openalex.org/W2081407955","https://openalex.org/W2123634595"],"related_works":["https://openalex.org/W2471640590","https://openalex.org/W2534348129","https://openalex.org/W2340990927","https://openalex.org/W2603177340","https://openalex.org/W2134737650","https://openalex.org/W4200215990","https://openalex.org/W2065748188","https://openalex.org/W3149820184","https://openalex.org/W2344393267","https://openalex.org/W2487850012"],"abstract_inverted_index":{"Xe":[0],"plasma":[1],"FIB":[2,71],"offers":[3],"the":[4,25,32,45,54,68,74,83,95,101,105],"milling":[5],"rate":[6],"at":[7,44],"least":[8],"50":[9],"times":[10],"higher":[11],"than":[12],"common":[13],"Ga":[14],"FIB.":[15],"This":[16],"makes":[17],"many":[18],"failure":[19],"analysis":[20,33],"tasks":[21],"much":[22],"faster,":[23],"or":[24],"analysed":[26,60],"volume":[27,47],"might":[28],"increase,":[29],"while":[30],"keeping":[31],"time.":[34],"3D":[35,62,92],"tomography":[36,63],"by":[37,66,70,76],"FIB-SEM":[38],"takes":[39],"advantage":[40],"of":[41,56,82],"this;":[42],"results":[43],"increased":[46],"are":[48],"demonstrated.":[49],"The":[50,78],"solder":[51],"bump":[52,69,106],"with":[53,94],"diameter":[55],"100":[57],"pm":[58],"was":[59,64],"and":[61,72,98,107],"performed":[65],"slicing":[67],"imaging":[73],"slices":[75,84],"SEM.":[77],"distinct":[79],"material":[80],"contrast":[81],"on":[85],"backscattered":[86],"electron":[87],"images":[88],"allowed":[89],"to":[90,99],"perform":[91],"reconstruction":[93],"sufficient":[96],"resolution":[97],"resolve":[100],"different":[102],"materials":[103],"in":[104],"their":[108],"interfaces":[109],"clearly.":[110]},"counts_by_year":[{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2016-06-24T00:00:00"}