{"id":"https://openalex.org/W1998449850","doi":"https://doi.org/10.1016/j.microrel.2011.05.007","title":"Low temperature fabricated conductive lines on flexible substrate by inkjet printing","display_name":"Low temperature fabricated conductive lines on flexible substrate by inkjet printing","publication_year":2011,"publication_date":"2011-06-25","ids":{"openalex":"https://openalex.org/W1998449850","doi":"https://doi.org/10.1016/j.microrel.2011.05.007","mag":"1998449850"},"language":"en","primary_location":{"id":"doi:10.1016/j.microrel.2011.05.007","doi":"https://doi.org/10.1016/j.microrel.2011.05.007","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2011.05.007","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100376627","display_name":"Yufeng Liu","orcid":"https://orcid.org/0000-0003-2248-8134","observed_orcids":["https://orcid.org/0000-0003-2248-8134"]},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yu-Feng Liu","raw_affiliation_strings":["Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, ROC","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111682650","display_name":"Weng\u2010Sing Hwang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Weng-Sing Hwang","raw_affiliation_strings":["Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, ROC","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036588501","display_name":"Yen-Fang Pai","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yen-Fang Pai","raw_affiliation_strings":["Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, ROC","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5028400765","display_name":"Ming-Hsu Tsai","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Ming-Hsu Tsai","raw_affiliation_strings":["Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, ROC","institution_ids":["https://openalex.org/I91807558"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I91807558"],"apc_list":{"value":2280,"currency":"USD","value_usd":2280},"apc_paid":null,"fwci":0.6502,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":{"value":0.72409629,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":96},"biblio":{"volume":"52","issue":"2","first_page":"391","last_page":"397"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11382","display_name":"Fluid Dynamics and Heat Transfer","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/inkjet-printing","display_name":"inkjet printing","score":0.9950000047683716},{"id":"https://openalex.org/keywords/conductive-lines","display_name":"conductive lines","score":0.8299999833106995},{"id":"https://openalex.org/keywords/silver-nitrate-solution","display_name":"silver nitrate solution","score":0.8759999871253967},{"id":"https://openalex.org/keywords/polyimide-substrate","display_name":"polyimide substrate","score":0.984000027179718},{"id":"https://openalex.org/keywords/flexible-electronics","display_name":"flexible electronics","score":0.7490000128746033},{"id":"https://openalex.org/keywords/low-temperature-processing","display_name":"low-temperature processing","score":0.8510000109672546},{"id":"https://openalex.org/keywords/droplet-coverage","display_name":"droplet coverage","score":0.9950000047683716}],"concepts":[{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.7756791710853577},{"id":"https://openalex.org/C2987330114","wikidata":"https://www.wikidata.org/wiki/Q95474715","display_name":"Inkjet printing","level":3,"score":0.7459570169448853},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.717059850692749},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6718671917915344},{"id":"https://openalex.org/C25435620","wikidata":"https://www.wikidata.org/wiki/Q1497629","display_name":"Printed electronics","level":3,"score":0.5211177468299866},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.48643064498901367},{"id":"https://openalex.org/C109693293","wikidata":"https://www.wikidata.org/wiki/Q1496072","display_name":"Inkwell","level":2,"score":0.4326780438423157},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.4306586682796478},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.32729846239089966},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1016/j.microrel.2011.05.007","doi":"https://doi.org/10.1016/j.microrel.2011.05.007","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2011.05.007","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.871.2502","doi":null,"is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.871.2502","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://ir.lib.ncku.edu.tw/retrieve/124271/Low%2BTemperature%2BFabricated%2BConductive%2BLines%2Bon%2BFlexible%2BSubstrate%2Bby%2BInkjet%2BPrinting.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W1562752335","https://openalex.org/W1973370070","https://openalex.org/W1991257851","https://openalex.org/W2006823338","https://openalex.org/W2016093670","https://openalex.org/W2020172200","https://openalex.org/W2053289708","https://openalex.org/W2067650857","https://openalex.org/W2069319309","https://openalex.org/W2070920957","https://openalex.org/W2079784264","https://openalex.org/W2095343910","https://openalex.org/W2103224141","https://openalex.org/W2117004579","https://openalex.org/W2126589092","https://openalex.org/W2332717414","https://openalex.org/W2521556624"],"related_works":["https://openalex.org/W3096522562","https://openalex.org/W2090725357","https://openalex.org/W4408602870","https://openalex.org/W2568599271","https://openalex.org/W2240617092","https://openalex.org/W2009116453","https://openalex.org/W2066098842","https://openalex.org/W1524834415","https://openalex.org/W2082309433","https://openalex.org/W2789792178"],"abstract_inverted_index":null,"counts_by_year":[{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":2}],"updated_date":"2026-10-16T09:59:22.235173","created_date":"2016-06-24T00:00:00"}