{"id":"https://openalex.org/W1998402992","doi":"https://doi.org/10.1016/j.microrel.2014.07.080","title":"Magnetic Field Imaging for non destructive 3D IC testing","display_name":"Magnetic Field Imaging for non destructive 3D IC testing","publication_year":2014,"publication_date":"2014-08-16","ids":{"openalex":"https://openalex.org/W1998402992","doi":"https://doi.org/10.1016/j.microrel.2014.07.080","mag":"1998402992"},"language":"en","primary_location":{"id":"doi:10.1016/j.microrel.2014.07.080","doi":"https://doi.org/10.1016/j.microrel.2014.07.080","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2014.07.080","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5019808670","display_name":"Jan O. Gaudestad","orcid":"https://orcid.org/0009-0008-1777-3073","observed_orcids":["https://orcid.org/0009-0008-1777-3073"]},"institutions":[{"id":"https://openalex.org/I4210141219","display_name":"Neocera (United States)","ror":"https://ror.org/03exvmb50","country_code":"US","type":"company","lineage":["https://openalex.org/I4210141219"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"J. Gaudestad","raw_affiliation_strings":["Neocera, LLC, 10000 Virginia Manor Road, Beltsville, MD 20705, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Neocera, LLC, 10000 Virginia Manor Road, Beltsville, MD 20705, USA","institution_ids":["https://openalex.org/I4210141219"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5075572496","display_name":"Antonio Orozco","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210141219","display_name":"Neocera (United States)","ror":"https://ror.org/03exvmb50","country_code":"US","type":"company","lineage":["https://openalex.org/I4210141219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Orozco","raw_affiliation_strings":["Neocera, LLC, 10000 Virginia Manor Road, Beltsville, MD 20705, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Neocera, LLC, 10000 Virginia Manor Road, Beltsville, MD 20705, USA","institution_ids":["https://openalex.org/I4210141219"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5019808670"],"corresponding_institution_ids":["https://openalex.org/I4210141219"],"apc_list":{"value":2280,"currency":"USD","value_usd":2280},"apc_paid":null,"fwci":0.1725,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.58179038,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":96},"biblio":{"volume":"54","issue":"9-10","first_page":"2093","last_page":"2098"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.8349999785423279,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.8349999785423279,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.12280000001192093,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12169","display_name":"Non-Destructive Testing Techniques","score":0.009399999864399433,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/magnetic-field-imaging","display_name":"magnetic field imaging","score":0.9990000128746033},{"id":"https://openalex.org/keywords/3d-integrated-circuits","display_name":"3D integrated circuits","score":0.8209999799728394},{"id":"https://openalex.org/keywords/through-silicon-vias","display_name":"through-silicon vias","score":0.9559999704360962},{"id":"https://openalex.org/keywords/non-destructive-testing","display_name":"non-destructive testing","score":0.8199999928474426},{"id":"https://openalex.org/keywords/leakage-current-detection","display_name":"leakage current detection","score":0.5170000195503235}],"concepts":[{"id":"https://openalex.org/C2987888538","wikidata":"https://www.wikidata.org/wiki/Q2986369","display_name":"Semiconductor industry","level":2,"score":0.7209996581077576},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.6983388662338257},{"id":"https://openalex.org/C115260700","wikidata":"https://www.wikidata.org/wiki/Q11408","display_name":"Magnetic field","level":2,"score":0.6085195541381836},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5924225449562073},{"id":"https://openalex.org/C148043351","wikidata":"https://www.wikidata.org/wiki/Q4456944","display_name":"Current (fluid)","level":2,"score":0.586425244808197},{"id":"https://openalex.org/C2777735758","wikidata":"https://www.wikidata.org/wiki/Q817765","display_name":"Path (computing)","level":2,"score":0.532414436340332},{"id":"https://openalex.org/C9652623","wikidata":"https://www.wikidata.org/wiki/Q190109","display_name":"Field (mathematics)","level":2,"score":0.478193998336792},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4614834189414978},{"id":"https://openalex.org/C108225325","wikidata":"https://www.wikidata.org/wiki/Q11456","display_name":"Semiconductor","level":2,"score":0.4260058104991913},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.42348480224609375},{"id":"https://openalex.org/C56529433","wikidata":"https://www.wikidata.org/wiki/Q626700","display_name":"Nondestructive testing","level":2,"score":0.4140131175518036},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3667011260986328},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.34028202295303345},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3371025323867798},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.32844340801239014},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.32298335433006287},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.3158758878707886},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.14932182431221008},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.0},{"id":"https://openalex.org/C202444582","wikidata":"https://www.wikidata.org/wiki/Q837863","display_name":"Pure mathematics","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.microrel.2014.07.080","doi":"https://doi.org/10.1016/j.microrel.2014.07.080","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2014.07.080","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":16,"referenced_works":["https://openalex.org/W1964947097","https://openalex.org/W1969743282","https://openalex.org/W2011219689","https://openalex.org/W2017282985","https://openalex.org/W2025516544","https://openalex.org/W2055429396","https://openalex.org/W2066876292","https://openalex.org/W2132930806","https://openalex.org/W2168094804","https://openalex.org/W2493581502","https://openalex.org/W2540265647","https://openalex.org/W3113401378","https://openalex.org/W3114659541","https://openalex.org/W3116573032","https://openalex.org/W3116626063","https://openalex.org/W3121135120"],"related_works":["https://openalex.org/W2254229503","https://openalex.org/W3096297987","https://openalex.org/W2188116662","https://openalex.org/W2762667199","https://openalex.org/W2587094639","https://openalex.org/W4289886529","https://openalex.org/W2529680047","https://openalex.org/W2522069395","https://openalex.org/W2528048130","https://openalex.org/W2288905094"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":2},{"year":2020,"cited_by_count":2},{"year":2014,"cited_by_count":1}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2016-06-24T00:00:00"}