{"id":"https://openalex.org/W1998115285","doi":"https://doi.org/10.1109/mwsym.2007.380306","title":"Small Form-Factor Integrated Passive Devices for SiP Applications","display_name":"Small Form-Factor Integrated Passive Devices for SiP Applications","publication_year":2007,"publication_date":"2007-06-01","ids":{"openalex":"https://openalex.org/W1998115285","doi":"https://doi.org/10.1109/mwsym.2007.380306","mag":"1998115285"},"language":"en","primary_location":{"id":"doi:10.1109/mwsym.2007.380306","doi":"https://doi.org/10.1109/mwsym.2007.380306","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mwsym.2007.380306","pdf_url":null,"source":{"id":"https://openalex.org/S4210185519","display_name":"IEEE MTT-S International Microwave Symposium digest","issn_l":"0149-645X","issn":["0149-645X","2576-7216"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2007 IEEE/MTT-S International Microwave Symposium","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100399797","display_name":"Kai Liu","orcid":"https://orcid.org/0000-0001-5865-7724","observed_orcids":["https://orcid.org/0000-0001-5865-7724","https://orcid.org/0009-0008-4157-463X"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Kai Liu","raw_affiliation_strings":["STATS ChipPAC, Inc., Tempe, AZ, USA","STATS ChipPAC Inc., Tempe"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STATS ChipPAC, Inc., Tempe, AZ, USA","institution_ids":[]},{"raw_affiliation_string":"STATS ChipPAC Inc., Tempe","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5034108283","display_name":"Robert C. Frye","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Robert C Frye","raw_affiliation_strings":["RF Design Consulting Limited Liability Company, Berkeley Heights, NJ, USA","RF Design Consulting, LLC, Berkeley Heights, NJ, 08854, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"RF Design Consulting Limited Liability Company, Berkeley Heights, NJ, USA","institution_ids":[]},{"raw_affiliation_string":"RF Design Consulting, LLC, Berkeley Heights, NJ, 08854, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":6.0275,"has_fulltext":false,"cited_by_count":27,"citation_normalized_percentile":{"value":0.97003932,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"2117","last_page":"2120"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.6855000257492065,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.6855000257492065,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.22390000522136688,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.03060000017285347,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/integrated-passive-devices","display_name":"integrated passive devices","score":0.9879999756813049},{"id":"https://openalex.org/keywords/system-in-package","display_name":"system-in-package","score":0.9409999847412109},{"id":"https://openalex.org/keywords/low-pass-filter","display_name":"low-pass filter","score":0.7839999794960022},{"id":"https://openalex.org/keywords/flip-chip","display_name":"flip-chip packaging","score":0.8050000071525574},{"id":"https://openalex.org/keywords/electromagnetic-simulation","display_name":"electromagnetic simulation","score":0.8339999914169312}],"concepts":[{"id":"https://openalex.org/C2776844852","wikidata":"https://www.wikidata.org/wiki/Q106872782","display_name":"HFSS","level":4,"score":0.8276153206825256},{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.7193106412887573},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6118878126144409},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5279330611228943},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4804639220237732},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.44671720266342163},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.4416927695274353},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.43139001727104187},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.4246668815612793},{"id":"https://openalex.org/C19527686","wikidata":"https://www.wikidata.org/wiki/Q1665453","display_name":"System integration","level":2,"score":0.4143153429031372},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.37739142775535583},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.32611340284347534},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2686387300491333},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21859753131866455},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.16132372617721558},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.11337050795555115},{"id":"https://openalex.org/C21822782","wikidata":"https://www.wikidata.org/wiki/Q131214","display_name":"Antenna (radio)","level":2,"score":0.0},{"id":"https://openalex.org/C170349913","wikidata":"https://www.wikidata.org/wiki/Q13402882","display_name":"Microstrip antenna","level":3,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mwsym.2007.380306","doi":"https://doi.org/10.1109/mwsym.2007.380306","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mwsym.2007.380306","pdf_url":null,"source":{"id":"https://openalex.org/S4210185519","display_name":"IEEE MTT-S International Microwave Symposium digest","issn_l":"0149-645X","issn":["0149-645X","2576-7216"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2007 IEEE/MTT-S International Microwave Symposium","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.4943999946117401,"display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1998163686","https://openalex.org/W2050438295","https://openalex.org/W2067860995","https://openalex.org/W2110204343","https://openalex.org/W2114341432","https://openalex.org/W2132897136","https://openalex.org/W2137865244","https://openalex.org/W2158543053"],"related_works":["https://openalex.org/W2281977192","https://openalex.org/W2344972961","https://openalex.org/W2250215707","https://openalex.org/W2895948869","https://openalex.org/W2354813444","https://openalex.org/W2905085975","https://openalex.org/W2092483944","https://openalex.org/W1998163686","https://openalex.org/W2288774623","https://openalex.org/W2144146763"],"abstract_inverted_index":{"Higher":[0],"level":[1],"of":[2,11,18,86,108],"integration":[3],"has":[4],"been":[5],"seen":[6],"to":[7,51,61],"be":[8],"the":[9,30,87,105],"trend":[10],"package":[12],"for":[13,33],"wireless":[14],"communication":[15],"products.":[16],"Integration":[17],"passive":[19,44],"components":[20],"(e.g.":[21],"RCL":[22],"and":[23,80,128,136],"filters)":[24],"plays":[25],"a":[26],"significant":[27],"role":[28],"in":[29,35,71,117],"overall":[31],"size-reduction":[32],"system":[34],"packaging":[36],"(SiP)":[37],"applications.":[38],"We":[39],"have":[40,77],"developed":[41],"an":[42],"integrated":[43],"device":[45],"(IPD)":[46],"process":[47],"using":[48,124],"silicon":[49],"technology":[50],"make":[52],"miniaturized":[53],"RF":[54],"components.":[55],"Advanced":[56],"design":[57,64,141],"methodology":[58],"was":[59,120],"used":[60],"realize":[62],"fast":[63],"cycle-time.":[65],"Some":[66],"example":[67],"IPDs":[68],"are":[69],"described":[70],"this":[72],"paper.":[73],"The":[74,84,111],"manufactured":[75],"samples":[76],"small":[78],"form-factors":[79],"excellent":[81],"electrical":[82],"performance.":[83],"size":[85],"LPF":[88],"IPD":[89,107,115],"working":[90],"at":[91],"850":[92],"MHz":[93],"is":[94,102,116],"1.1":[95],"times":[96,98],"0.85":[97],"0.35":[99],"mm3,":[100],"which":[101],"by":[103],"far":[104],"smallest":[106],"its":[109],"kind.":[110],"board":[112],"effect":[113],"when":[114],"flip-chip":[118],"configuration":[119],"extensively":[121],"investigated":[122],"through":[123],"HFSS":[125],"EM":[126],"simulation":[127],"experimental":[129],"verification.":[130],"Very":[131],"good":[132],"agreement":[133],"between":[134],"simulated":[135],"measured":[137],"results":[138],"validates":[139],"our":[140],"process.":[142]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":2},{"year":2016,"cited_by_count":2},{"year":2014,"cited_by_count":2},{"year":2012,"cited_by_count":4}],"updated_date":"2026-10-06T10:28:23.643775","created_date":"2016-06-24T00:00:00"}