{"id":"https://openalex.org/W1997884573","doi":"https://doi.org/10.1115/ipack2005-73393","title":"Heat Spreading Analysis of a Heat Sink Base Embedded With a Heat Pipe","display_name":"Heat Spreading Analysis of a Heat Sink Base Embedded With a Heat Pipe","publication_year":2005,"publication_date":"2005-01-01","ids":{"openalex":"https://openalex.org/W1997884573","doi":"https://doi.org/10.1115/ipack2005-73393","mag":"1997884573"},"language":"en","primary_location":{"id":"doi:10.1115/ipack2005-73393","doi":"https://doi.org/10.1115/ipack2005-73393","is_oa":false,"landing_page_url":"https://doi.org/10.1115/ipack2005-73393","pdf_url":null,"source":{"id":"https://openalex.org/S7407088218","display_name":"ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advances in Electronic Packaging, Parts A, B, and C","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5088125021","display_name":"Brian V. Borgmeyer","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I76835614","display_name":"University of Missouri","ror":"https://ror.org/02ymw8z06","country_code":"US","type":"education","lineage":["https://openalex.org/I76835614"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Brian V. Borgmeyer","raw_affiliation_strings":["University of Missouri at Columbia, Columbia, MO"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Missouri at Columbia, Columbia, MO","institution_ids":["https://openalex.org/I76835614"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5043145009","display_name":"Hongbin Ma","orcid":"https://orcid.org/0000-0003-0930-517X","observed_orcids":["https://orcid.org/0000-0003-0930-517X"]},"institutions":[{"id":"https://openalex.org/I76835614","display_name":"University of Missouri","ror":"https://ror.org/02ymw8z06","country_code":"US","type":"education","lineage":["https://openalex.org/I76835614"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"H. B. Ma","raw_affiliation_strings":["University of Missouri at Columbia, Columbia, MO"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Missouri at Columbia, Columbia, MO","institution_ids":["https://openalex.org/I76835614"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I76835614"],"apc_list":null,"apc_paid":null,"fwci":2.1347,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.85186495,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"553","last_page":"556"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":0.5741999745368958,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":0.5741999745368958,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.39309999346733093,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13116","display_name":"Heat Transfer and Numerical Methods","score":0.017000000923871994,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/heat-pipes","display_name":"heat pipes","score":0.8100000023841858},{"id":"https://openalex.org/keywords/heat-spreading","display_name":"heat spreading","score":0.9419999718666077},{"id":"https://openalex.org/keywords/heat-transfer-performance","display_name":"heat transfer performance","score":0.7059999704360962},{"id":"https://openalex.org/keywords/flat-plate-model","display_name":"flat plate model","score":0.7960000038146973},{"id":"https://openalex.org/keywords/thermal-management","display_name":"thermal management","score":0.48399999737739563}],"concepts":[{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.9367754459381104},{"id":"https://openalex.org/C29700514","wikidata":"https://www.wikidata.org/wiki/Q634340","display_name":"Heat transfer coefficient","level":3,"score":0.6843975186347961},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.6546685695648193},{"id":"https://openalex.org/C48632124","wikidata":"https://www.wikidata.org/wiki/Q617088","display_name":"Heat spreader","level":3,"score":0.6171116232872009},{"id":"https://openalex.org/C37728375","wikidata":"https://www.wikidata.org/wiki/Q600568","display_name":"Heat pipe","level":3,"score":0.61257404088974},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5624464154243469},{"id":"https://openalex.org/C39420092","wikidata":"https://www.wikidata.org/wiki/Q17075298","display_name":"Plate fin heat exchanger","level":4,"score":0.528588056564331},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.5113343596458435},{"id":"https://openalex.org/C41231900","wikidata":"https://www.wikidata.org/wiki/Q918227","display_name":"Convective heat transfer","level":3,"score":0.4639861583709717},{"id":"https://openalex.org/C32375409","wikidata":"https://www.wikidata.org/wiki/Q261231","display_name":"Plate heat exchanger","level":3,"score":0.46332472562789917},{"id":"https://openalex.org/C10899652","wikidata":"https://www.wikidata.org/wiki/Q160329","display_name":"Convection","level":2,"score":0.42546558380126953},{"id":"https://openalex.org/C2780411076","wikidata":"https://www.wikidata.org/wiki/Q5462653","display_name":"Fluent","level":3,"score":0.4231265187263489},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.4216604232788086},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.40909677743911743},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3577684164047241},{"id":"https://openalex.org/C1633027","wikidata":"https://www.wikidata.org/wiki/Q815820","display_name":"Computational fluid dynamics","level":2,"score":0.24778491258621216},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22863465547561646},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10034629702568054}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1115/ipack2005-73393","doi":"https://doi.org/10.1115/ipack2005-73393","is_oa":false,"landing_page_url":"https://doi.org/10.1115/ipack2005-73393","pdf_url":null,"source":{"id":"https://openalex.org/S7407088218","display_name":"ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advances in Electronic Packaging, Parts A, B, and C","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W1977927964","https://openalex.org/W3085392297","https://openalex.org/W7098474168","https://openalex.org/W2152436995","https://openalex.org/W7019305241","https://openalex.org/W2378724004","https://openalex.org/W2061673460","https://openalex.org/W1965965304","https://openalex.org/W2885646923","https://openalex.org/W2061729874"],"abstract_inverted_index":{"A":[0],"simplified":[1],"theoretical":[2],"model":[3],"predicting":[4],"the":[5,27,45,72],"heat":[6,11,18,36,43,47,64],"transfer":[7,65],"performance":[8],"of":[9],"a":[10,16,41,53,57],"sink":[12,37,48],"base":[13],"embedded":[14,39],"with":[15,40,56,71],"flat":[17,54],"pipe":[19],"is":[20,69],"developed.":[21],"Numerical":[22],"analysis":[23],"was":[24],"performed":[25],"using":[26],"commercial":[28],"software":[29],"FLUENT.":[30],"The":[31,67],"investigation":[32],"indicates":[33],"that":[34],"for":[35],"bases":[38],"typical":[42],"pipe,":[44],"entire":[46],"can":[49],"be":[50],"modeled":[51],"as":[52],"plate":[55],"uniform":[58],"temperature":[59],"and":[60],"an":[61],"effective":[62],"convection":[63],"coefficient.":[66],"prediction":[68],"compared":[70],"experimental":[73],"data":[74],"obtained":[75],"previously.":[76]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2013,"cited_by_count":1}],"updated_date":"2026-10-26T11:51:55.731654","created_date":"2016-06-24T00:00:00"}