{"id":"https://openalex.org/W1997147137","doi":"https://doi.org/10.1117/12.284483","title":"Automotive applications for micromachining","display_name":"Automotive applications for micromachining","publication_year":1997,"publication_date":"1997-09-05","ids":{"openalex":"https://openalex.org/W1997147137","doi":"https://doi.org/10.1117/12.284483","mag":"1997147137"},"language":"en","primary_location":{"id":"doi:10.1117/12.284483","doi":"https://doi.org/10.1117/12.284483","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.284483","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111584672","display_name":"Douglas R. Sparks","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Douglas R. Sparks","raw_affiliation_strings":["Delco Electronics Corp. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Delco Electronics Corp. (United States)","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111555037","display_name":"Shih\u2212Chia Chang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I118136607","display_name":"General Motors (United States)","ror":"https://ror.org/05addee68","country_code":"US","type":"company","lineage":["https://openalex.org/I118136607"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Shih-Chia Chang","raw_affiliation_strings":["General Motors Research and Development Ctr. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"General Motors Research and Development Ctr. (United States)","institution_ids":["https://openalex.org/I118136607"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.2997,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.74747964,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"3223","issue":null,"first_page":"218","last_page":"222"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13436","display_name":"Space Technology and Applications","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/mems","display_name":"MEMS","score":0.8149999976158142},{"id":"https://openalex.org/keywords/automotive-applications","display_name":"automotive applications","score":0.7459999918937683},{"id":"https://openalex.org/keywords/silicon-micromachining","display_name":"silicon micromachining","score":0.9890000224113464},{"id":"https://openalex.org/keywords/vehicle-sensors","display_name":"automotive sensors","score":0.7599999904632568},{"id":"https://openalex.org/keywords/plasma-etching","display_name":"plasma etching","score":0.9079999923706055},{"id":"https://openalex.org/keywords/wet-etching","display_name":"wet etching","score":0.9959999918937683},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"wafer bonding","score":0.996999979019165},{"id":"https://openalex.org/keywords/liga","display_name":"LIGA","score":0.9559999704360962},{"id":"https://openalex.org/keywords/circuit-integration","display_name":"circuit integration","score":0.8090000152587891},{"id":"https://openalex.org/keywords/mems-packaging","display_name":"MEMS packaging","score":0.9200000166893005}],"concepts":[{"id":"https://openalex.org/C145667562","wikidata":"https://www.wikidata.org/wiki/Q7646003","display_name":"Surface micromachining","level":4,"score":0.9240219593048096},{"id":"https://openalex.org/C145695476","wikidata":"https://www.wikidata.org/wiki/Q1638483","display_name":"LIGA","level":4,"score":0.8161881566047668},{"id":"https://openalex.org/C526921623","wikidata":"https://www.wikidata.org/wiki/Q190117","display_name":"Automotive industry","level":2,"score":0.7619819641113281},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.6853358745574951},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.606802225112915},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.5751422643661499},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5377509593963623},{"id":"https://openalex.org/C41075158","wikidata":"https://www.wikidata.org/wiki/Q4996485","display_name":"Bulk micromachining","level":5,"score":0.45834633708000183},{"id":"https://openalex.org/C2778520156","wikidata":"https://www.wikidata.org/wiki/Q449343","display_name":"Automotive electronics","level":3,"score":0.4297822415828705},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.427584171295166},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.37408459186553955},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.36498531699180603},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3316277265548706},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3304927349090576},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.293321430683136},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20515793561935425},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.13488489389419556},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.09962731599807739},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.284483","doi":"https://doi.org/10.1117/12.284483","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.284483","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W1883968382","https://openalex.org/W2255833311","https://openalex.org/W1574920134","https://openalex.org/W1997503236","https://openalex.org/W2260493769","https://openalex.org/W2898901001","https://openalex.org/W234153364","https://openalex.org/W2188022060","https://openalex.org/W171526048","https://openalex.org/W994601251"],"abstract_inverted_index":{"High":[0],"volume":[1],"silicon":[2],"micromachining":[3,33],"has":[4],"been":[5],"employed":[6],"by":[7],"the":[8,25,30],"automotive":[9,36],"industry":[10],"for":[11],"20":[12],"years.":[13],"This":[14],"paper":[15],"examines":[16],"past,":[17],"current":[18],"and":[19,29,44,52],"future":[20],"applications":[21],"of":[22,32],"MEMS":[23],"to":[24,34],"automobile.":[26],"Both":[27],"sensor":[28],"application":[31],"other":[35],"areas":[37],"are":[38,54],"covered.":[39],"Technologies":[40],"such":[41],"as":[42],"wet":[43],"plasma":[45],"etching,":[46],"wafer":[47],"bonding,":[48],"LIGA,":[49],"circuit":[50],"integration":[51],"packaging":[53],"discussed.":[55]},"counts_by_year":[],"updated_date":"2026-09-22T06:50:58.402377","created_date":"2016-06-24T00:00:00"}