{"id":"https://openalex.org/W1992198214","doi":"https://doi.org/10.1109/smelec.2006.380784","title":"Studies on A New Sela-FIB Sample Preparation Method and Its Application in Failure Analysis of Wafer Fabrication for 110nm Technology Node and Beyond","display_name":"Studies on A New Sela-FIB Sample Preparation Method and Its Application in Failure Analysis of Wafer Fabrication for 110nm Technology Node and Beyond","publication_year":2006,"publication_date":"2006-11-01","ids":{"openalex":"https://openalex.org/W1992198214","doi":"https://doi.org/10.1109/smelec.2006.380784","mag":"1992198214"},"language":"en","primary_location":{"id":"doi:10.1109/smelec.2006.380784","doi":"https://doi.org/10.1109/smelec.2006.380784","is_oa":false,"landing_page_url":"https://doi.org/10.1109/smelec.2006.380784","pdf_url":null,"source":{"id":"https://openalex.org/S4306418714","display_name":"IEEE International Conference on Semiconductor Electronics","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2006 IEEE International Conference on Semiconductor Electronics","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111694896","display_name":"Zhao Siping","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Zhao Siping","raw_affiliation_strings":["Chartered Semiconductor Mfg Ltd, Singapore","Member, IEEE, Chartered Semiconductor Mfg Ltd, Woodlands Industrial Park D, Street 2, Singapore 738406. Email: zhaosp@charteredsemi.com"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chartered Semiconductor Mfg Ltd, Singapore","institution_ids":[]},{"raw_affiliation_string":"Member, IEEE, Chartered Semiconductor Mfg Ltd, Woodlands Industrial Park D, Street 2, Singapore 738406. Email: zhaosp@charteredsemi.com","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109336090","display_name":"Younan Hua","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Hua Younan","raw_affiliation_strings":["Chartered Semiconductor Mfg Ltd, Singapore","Chartered Semiconductor Mfg Ltd, Woodlands Industrial Park D, Street 2, Singapore 738406"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chartered Semiconductor Mfg Ltd, Singapore","institution_ids":[]},{"raw_affiliation_string":"Chartered Semiconductor Mfg Ltd, Woodlands Industrial Park D, Street 2, Singapore 738406","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108518680","display_name":"Eddie Er","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Er Eddie","raw_affiliation_strings":["Chartered Semiconductor Mfg Ltd, Singapore","Chartered Semiconductor Mfg Ltd, Woodlands Industrial Park D, Street 2, Singapore 738406"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chartered Semiconductor Mfg Ltd, Singapore","institution_ids":[]},{"raw_affiliation_string":"Chartered Semiconductor Mfg Ltd, Woodlands Industrial Park D, Street 2, Singapore 738406","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5049366749","display_name":"Ley Hong Khoo","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Khoo Ley Hong","raw_affiliation_strings":["Chartered Semiconductor Mfg Ltd, Singapore","Chartered Semiconductor Mfg Ltd, Woodlands Industrial Park D, Street 2, Singapore 738406"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chartered Semiconductor Mfg Ltd, Singapore","institution_ids":[]},{"raw_affiliation_string":"Chartered Semiconductor Mfg Ltd, Woodlands Industrial Park D, Street 2, Singapore 738406","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.5275,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.54991201,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"15","issue":null,"first_page":"977","last_page":"980"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9833999872207642,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9833999872207642,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13552","display_name":"Advanced Materials Characterization Techniques","score":0.011900000274181366,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.0008999999845400453,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/sem-sample-preparation","display_name":"SEM sample preparation","score":0.875}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7473270297050476},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6729698181152344},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.6438698172569275},{"id":"https://openalex.org/C2778576202","wikidata":"https://www.wikidata.org/wiki/Q2540164","display_name":"Sample preparation","level":2,"score":0.5995160341262817},{"id":"https://openalex.org/C198531522","wikidata":"https://www.wikidata.org/wiki/Q485146","display_name":"Sample (material)","level":2,"score":0.5343469977378845},{"id":"https://openalex.org/C35750839","wikidata":"https://www.wikidata.org/wiki/Q7959421","display_name":"Wafer fabrication","level":3,"score":0.44834771752357483},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.4397764801979065},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.38840144872665405},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.35533830523490906},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16746607422828674},{"id":"https://openalex.org/C43617362","wikidata":"https://www.wikidata.org/wiki/Q170050","display_name":"Chromatography","level":1,"score":0.13615119457244873},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.09458422660827637},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.059788793325424194},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/smelec.2006.380784","doi":"https://doi.org/10.1109/smelec.2006.380784","is_oa":false,"landing_page_url":"https://doi.org/10.1109/smelec.2006.380784","pdf_url":null,"source":{"id":"https://openalex.org/S4306418714","display_name":"IEEE International Conference on Semiconductor Electronics","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2006 IEEE International Conference on Semiconductor Electronics","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W2487522434","https://openalex.org/W4285719527"],"related_works":["https://openalex.org/W3128660443","https://openalex.org/W3044103783","https://openalex.org/W2909455394","https://openalex.org/W2790985241","https://openalex.org/W3113725086","https://openalex.org/W2950286755","https://openalex.org/W4416874064","https://openalex.org/W3114639424","https://openalex.org/W2545634457","https://openalex.org/W2792855441"],"abstract_inverted_index":{"In":[0],"this":[1,31],"paper,":[2],"a":[3],"novel":[4],"sample":[5,28],"preparation":[6],"method":[7],"for":[8,26],"obtaining":[9],"high-resolution":[10,34],"SEM":[11,27,37],"profile":[12],"is":[13],"proposed.":[14],"Both":[15],"Sela":[16],"fine":[17],"cleave":[18],"and":[19],"FIB":[20],"slice":[21],"techniques":[22],"have":[23],"been":[24,43],"used":[25],"preparation.":[29],"Using":[30],"new":[32],"method,":[33],"90":[35],"degrees":[36],"micrographs":[38],"are":[39],"provided.":[40],"It":[41],"has":[42],"applied":[44],"in":[45],"failure":[46],"analysis":[47,63],"to":[48,60],"check":[49],"Via":[50],"gouging":[51],"information":[52],"without":[53],"any":[54],"charging":[55],"problem,":[56],"which":[57],"helps":[58],"us":[59],"reduce":[61],"TEM":[62],"samples.":[64]},"counts_by_year":[],"updated_date":"2026-10-12T09:40:04.860316","created_date":"2016-06-24T00:00:00"}