{"id":"https://openalex.org/W1991656652","doi":"https://doi.org/10.4028/www.scientific.net/msf.449-452.317","title":"Fabrication of Copper Clad Aluminum Wire (CCAW) by Indirect Extrusion and Drawing","display_name":"Fabrication of Copper Clad Aluminum Wire (CCAW) by Indirect Extrusion and Drawing","publication_year":2004,"publication_date":"2004-03-15","ids":{"openalex":"https://openalex.org/W1991656652","doi":"https://doi.org/10.4028/www.scientific.net/msf.449-452.317","mag":"1991656652"},"language":"en","primary_location":{"id":"doi:10.4028/www.scientific.net/msf.449-452.317","doi":"https://doi.org/10.4028/www.scientific.net/msf.449-452.317","is_oa":false,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/msf.449-452.317","pdf_url":null,"source":{"id":"https://openalex.org/S87940674","display_name":"Materials science forum","issn_l":"0255-5476","issn":["0255-5476","1662-9752","1662-9760"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","poland-20"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Science Forum","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109154622","display_name":"Hyouk Chon Kwon","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I89004649","display_name":"Korea Institute of Industrial Technology","ror":"https://ror.org/04qfph657","country_code":"KR","type":"other","lineage":["https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098","https://openalex.org/I89004649"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyouk Chon Kwon","raw_affiliation_strings":["Korea Institute of Industrial Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Korea Institute of Industrial Technology","institution_ids":["https://openalex.org/I89004649"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109547365","display_name":"Taek Kyun Jung","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I191879574","display_name":"Inha University","ror":"https://ror.org/01easw929","country_code":"KR","type":"education","lineage":["https://openalex.org/I191879574"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Taek Kyun Jung","raw_affiliation_strings":["Inha University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Inha University","institution_ids":["https://openalex.org/I191879574"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071757863","display_name":"Sung\u2010Chul Lim","orcid":"https://orcid.org/0000-0001-6179-691X","observed_orcids":["https://orcid.org/0000-0001-6179-691X"]},"institutions":[{"id":"https://openalex.org/I89004649","display_name":"Korea Institute of Industrial Technology","ror":"https://ror.org/04qfph657","country_code":"KR","type":"other","lineage":["https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098","https://openalex.org/I89004649"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sung Chul Lim","raw_affiliation_strings":["Korea Institute of Industrial Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Korea Institute of Industrial Technology","institution_ids":["https://openalex.org/I89004649"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5064294256","display_name":"Mok Soon Kim","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I191879574","display_name":"Inha University","ror":"https://ror.org/01easw929","country_code":"KR","type":"education","lineage":["https://openalex.org/I191879574"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Mok Soon Kim","raw_affiliation_strings":["Inha University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Inha University","institution_ids":["https://openalex.org/I191879574"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.9998,"has_fulltext":false,"cited_by_count":19,"citation_normalized_percentile":{"value":0.84748907,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":98},"biblio":{"volume":"449-452","issue":null,"first_page":"317","last_page":"320"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","score":0.8144999742507935,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","score":0.8144999742507935,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11201","display_name":"Metallurgy and Material Forming","score":0.03959999978542328,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10204","display_name":"Microstructure and mechanical properties","score":0.031300000846385956,"subfield":{"id":"https://openalex.org/subfields/2506","display_name":"Metals and Alloys"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/indirect-extrusion","display_name":"indirect extrusion","score":0.9559999704360962},{"id":"https://openalex.org/keywords/wire-drawing","display_name":"wire drawing","score":0.8679999709129333},{"id":"https://openalex.org/keywords/extrusion-temperature","display_name":"extrusion temperature","score":0.9190000295639038},{"id":"https://openalex.org/keywords/extrusion-ratio","display_name":"extrusion ratio","score":0.9980000257492065},{"id":"https://openalex.org/keywords/bond-strength","display_name":"bond strength","score":0.8180000185966492},{"id":"https://openalex.org/keywords/annealing-temperature","display_name":"annealing temperature","score":0.8330000042915344},{"id":"https://openalex.org/keywords/intermetallic-compounds","display_name":"intermetallic compounds","score":0.9670000076293945},{"id":"https://openalex.org/keywords/electrical-conductivity","display_name":"electrical conductivity","score":0.8560000061988831},{"id":"https://openalex.org/keywords/copper-sheath","display_name":"copper sheath","score":0.48899999260902405},{"id":"https://openalex.org/keywords/aluminum-core","display_name":"aluminum core","score":0.9700000286102295}],"concepts":[{"id":"https://openalex.org/C2778958987","wikidata":"https://www.wikidata.org/wiki/Q139143","display_name":"Extrusion","level":2,"score":0.9620107412338257},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.9119930863380432},{"id":"https://openalex.org/C2777855556","wikidata":"https://www.wikidata.org/wiki/Q4339544","display_name":"Annealing (glass)","level":2,"score":0.6726186275482178},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.6679950952529907},{"id":"https://openalex.org/C513153333","wikidata":"https://www.wikidata.org/wiki/Q663","display_name":"Aluminium","level":2,"score":0.6496960520744324},{"id":"https://openalex.org/C136478896","wikidata":"https://www.wikidata.org/wiki/Q898288","display_name":"Brittleness","level":2,"score":0.6317040920257568},{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.627168595790863},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.5961243510246277},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.5722797513008118},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5304787755012512},{"id":"https://openalex.org/C2988571348","wikidata":"https://www.wikidata.org/wiki/Q2811078","display_name":"Copper wire","level":3,"score":0.4420521557331085},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.4357575476169586},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.10034596920013428},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.4028/www.scientific.net/msf.449-452.317","doi":"https://doi.org/10.4028/www.scientific.net/msf.449-452.317","is_oa":false,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/msf.449-452.317","pdf_url":null,"source":{"id":"https://openalex.org/S87940674","display_name":"Materials science forum","issn_l":"0255-5476","issn":["0255-5476","1662-9752","1662-9760"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","poland-20"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Science Forum","raw_type":"journal-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.866.747","doi":null,"is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.866.747","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.scientific.net/MSF.449-452.317.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W1978093590","https://openalex.org/W6600518474"],"related_works":["https://openalex.org/W1994433185","https://openalex.org/W2378176712","https://openalex.org/W1999026606","https://openalex.org/W2079098916","https://openalex.org/W4404971777","https://openalex.org/W7092604853","https://openalex.org/W3035245925","https://openalex.org/W768809795","https://openalex.org/W2287626052","https://openalex.org/W2380599647"],"abstract_inverted_index":{"The":[0,53,66,94],"optimized":[1],"extrusion":[2,10,16,22,51,60,64],"conditions":[3],"from":[4],"the":[5,9,15,21,26,37,43,47,59,63,72,82],"present":[6],"research":[7],"were":[8,92],"temperature":[11,23,61],"of":[12,18,24,28,39,88,96],"573~623K":[13],"and":[14,46,62,84],"ratio(A0/A)":[17],"21.39.":[19],"Above":[20],"623K,":[25],"fracture":[27],"sheath":[29,44],"material":[30,45,49],"was":[31,101],"observed.":[32],"It":[33],"is":[34],"due":[35],"to":[36],"difference":[38],"flow":[40],"stress":[41],"between":[42],"core":[48],"during":[50],"process.":[52],"bonding":[54,67],"strength":[55,68],"increased":[56,69],"with":[57,70],"increasing":[58,71],"ratio.":[65],"annealing":[73],"temperature.":[74],"However,":[75],"over":[76],"573K,":[77],"it":[78],"decreased":[79],"abruptly":[80],"since":[81],"thick":[83],"brittle":[85],"intermetallic":[86],"compounds":[87],"larger":[89],"than":[90],"3\u00b5m":[91],"formed.":[93],"electricalconductivity":[95],"copper":[97],"clad":[98],"aluminum":[99],"wire":[100],"about":[102],"70%IACS":[103],"without":[104],"annealing.":[105]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":2},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":5},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2015,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2016-06-24T00:00:00"}