{"id":"https://openalex.org/W1990599591","doi":"https://doi.org/10.1007/s12541-011-0076-x","title":"Investigation of durability of TSV interconnect by numerical thermal fatigue analysis","display_name":"Investigation of durability of TSV interconnect by numerical thermal fatigue analysis","publication_year":2011,"publication_date":"2011-07-28","ids":{"openalex":"https://openalex.org/W1990599591","doi":"https://doi.org/10.1007/s12541-011-0076-x","mag":"1990599591"},"language":"en","primary_location":{"id":"doi:10.1007/s12541-011-0076-x","doi":"https://doi.org/10.1007/s12541-011-0076-x","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s12541-011-0076-x","pdf_url":null,"source":{"id":"https://openalex.org/S130039360","display_name":"International Journal of Precision Engineering and Manufacturing","issn_l":"1229-8557","issn":["1229-8557","2005-4602","2234-7593"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","kci-registered","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal of Precision Engineering and Manufacturing","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"http://doi.org/10.1007/s12541-011-0076-x","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5040582796","display_name":"Sung\u2010Hoon Choa","orcid":"https://orcid.org/0000-0001-5736-8357","observed_orcids":["https://orcid.org/0000-0001-5736-8357"]},"institutions":[{"id":"https://openalex.org/I118373667","display_name":"Seoul National University of Science and Technology","ror":"https://ror.org/00chfja07","country_code":"KR","type":"education","lineage":["https://openalex.org/I118373667"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Sung-Hoon Choa","raw_affiliation_strings":["Graduate School of NID Fusion Technology, Seoul National University of Science and Technology, 172 Gongneung-2 Dong, Nowon-Gu, Seoul, South Korea, 139-743","Seoul National University of Science and Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate School of NID Fusion Technology, Seoul National University of Science and Technology, 172 Gongneung-2 Dong, Nowon-Gu, Seoul, South Korea, 139-743","institution_ids":["https://openalex.org/I118373667"]},{"raw_affiliation_string":"Seoul National University of Science and Technology","institution_ids":["https://openalex.org/I118373667"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030195507","display_name":"Cha Gyu Song","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I118373667","display_name":"Seoul National University of Science and Technology","ror":"https://ror.org/00chfja07","country_code":"KR","type":"education","lineage":["https://openalex.org/I118373667"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Cha Gyu Song","raw_affiliation_strings":["Graduate School of NID Fusion Technology, Seoul National University of Science and Technology, 172 Gongneung-2 Dong, Nowon-Gu, Seoul, South Korea, 139-743","Seoul National University of Science and Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate School of NID Fusion Technology, Seoul National University of Science and Technology, 172 Gongneung-2 Dong, Nowon-Gu, Seoul, South Korea, 139-743","institution_ids":["https://openalex.org/I118373667"]},{"raw_affiliation_string":"Seoul National University of Science and Technology","institution_ids":["https://openalex.org/I118373667"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5109086674","display_name":"Haeng Soo Lee","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I116631150","display_name":"Ulsan College","ror":"https://ror.org/02tec3785","country_code":"KR","type":"education","lineage":["https://openalex.org/I116631150"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Haeng Soo Lee","raw_affiliation_strings":["Department of Digital Mechanics, Ulsan College, San 29, Nam-gu, Ulsan, South Korea, 680-749","Ulsan college"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Digital Mechanics, Ulsan College, San 29, Nam-gu, Ulsan, South Korea, 680-749","institution_ids":["https://openalex.org/I116631150"]},{"raw_affiliation_string":"Ulsan college","institution_ids":["https://openalex.org/I116631150"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5040582796"],"corresponding_institution_ids":["https://openalex.org/I118373667"],"apc_list":{"value":3090,"currency":"USD","value_usd":3090},"apc_paid":null,"fwci":1.7337,"has_fulltext":false,"cited_by_count":30,"citation_normalized_percentile":{"value":0.84756227,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":97},"biblio":{"volume":"12","issue":"4","first_page":"589","last_page":"596"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/through-silicon-vias","display_name":"through-silicon vias","score":0.9629999995231628},{"id":"https://openalex.org/keywords/thermal-fatigue","display_name":"thermal fatigue","score":0.949999988079071},{"id":"https://openalex.org/keywords/thermomechanical-reliability","display_name":"thermo-mechanical reliability","score":0.9340000152587891},{"id":"https://openalex.org/keywords/3d-packaging","display_name":"3D packaging","score":0.7730000019073486},{"id":"https://openalex.org/keywords/plastic-strain","display_name":"plastic strain","score":0.7620000243186951},{"id":"https://openalex.org/keywords/thermal-cycling","display_name":"thermal cycling","score":0.8899999856948853},{"id":"https://openalex.org/keywords/underfill-materials","display_name":"underfill materials","score":0.8700000047683716},{"id":"https://openalex.org/keywords/fatigue-life","display_name":"fatigue life","score":0.7860000133514404}],"concepts":[{"id":"https://openalex.org/C104304963","wikidata":"https://www.wikidata.org/wiki/Q5316114","display_name":"Durability","level":2,"score":0.9075227975845337},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8220812082290649},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.7112991213798523},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.6982392072677612},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6934210658073425},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.6912143230438232},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.5475077629089355},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5418800115585327},{"id":"https://openalex.org/C57528182","wikidata":"https://www.wikidata.org/wiki/Q1271842","display_name":"Miniaturization","level":2,"score":0.4952625334262848},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.4821140766143799},{"id":"https://openalex.org/C2984904865","wikidata":"https://www.wikidata.org/wiki/Q1425130","display_name":"Thermal fatigue","level":3,"score":0.4624412953853607},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.45401233434677124},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.45014387369155884},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.36824506521224976},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.3097972869873047},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.2395043969154358},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.19750142097473145},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.07822969555854797},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.07649898529052734},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1007/s12541-011-0076-x","doi":"https://doi.org/10.1007/s12541-011-0076-x","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s12541-011-0076-x","pdf_url":null,"source":{"id":"https://openalex.org/S130039360","display_name":"International Journal of Precision Engineering and Manufacturing","issn_l":"1229-8557","issn":["1229-8557","2005-4602","2234-7593"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","kci-registered","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal of Precision Engineering and Manufacturing","raw_type":"journal-article"},{"id":"pmh:oai:oak:2014.oak/459","doi":null,"is_oa":true,"landing_page_url":"http://doi.org/10.1007/s12541-011-0076-x","pdf_url":null,"source":{"id":"https://openalex.org/S4306400611","display_name":"Korean Studies Service Information System (Chonbuk National University)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I80611190","host_organization_name":"Jeonbuk National University","host_organization_lineage":["https://openalex.org/I80611190"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-nc-nd","license_id":"https://openalex.org/licenses/cc-by-nc-nd","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"\uc5f0\uad6c\ub17c\ubb38"},{"id":"mag:3188306227","doi":null,"is_oa":false,"landing_page_url":"http://dspace.kci.go.kr/handle/kci/1702641","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null}],"best_oa_location":{"id":"pmh:oai:oak:2014.oak/459","doi":null,"is_oa":true,"landing_page_url":"http://doi.org/10.1007/s12541-011-0076-x","pdf_url":null,"source":{"id":"https://openalex.org/S4306400611","display_name":"Korean Studies Service Information System (Chonbuk National University)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I80611190","host_organization_name":"Jeonbuk National University","host_organization_lineage":["https://openalex.org/I80611190"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-nc-nd","license_id":"https://openalex.org/licenses/cc-by-nc-nd","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"\uc5f0\uad6c\ub17c\ubb38"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.7207000255584717}],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321640","display_name":"Ministry of Knowledge Economy","ror":"https://ror.org/008nkqk13"},{"id":"https://openalex.org/F4320322066","display_name":"Korea Research Council for Industrial Science and Technology","ror":"https://ror.org/039fwba89"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W586922167","https://openalex.org/W1964120767","https://openalex.org/W2016993958","https://openalex.org/W2026691684","https://openalex.org/W2069822079","https://openalex.org/W2081935581","https://openalex.org/W2096440239","https://openalex.org/W2096571799","https://openalex.org/W2098161174","https://openalex.org/W2103567833","https://openalex.org/W2143926454","https://openalex.org/W2145790809","https://openalex.org/W2161828806","https://openalex.org/W2169739755"],"related_works":["https://openalex.org/W2055265072","https://openalex.org/W2216564937","https://openalex.org/W2287587132","https://openalex.org/W2035148151","https://openalex.org/W2511915976","https://openalex.org/W3107654684","https://openalex.org/W1982702051","https://openalex.org/W2540194857","https://openalex.org/W1973622144","https://openalex.org/W2086765918"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":4},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":1},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":3},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":2}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2016-06-24T00:00:00"}