{"id":"https://openalex.org/W1990406492","doi":"https://doi.org/10.1147/rd.121.0110","title":"Shear Stresses in a Notched Circular Disk","display_name":"Shear Stresses in a Notched Circular Disk","publication_year":1968,"publication_date":"1968-01-01","ids":{"openalex":"https://openalex.org/W1990406492","doi":"https://doi.org/10.1147/rd.121.0110","mag":"1990406492"},"language":"en","primary_location":{"id":"doi:10.1147/rd.121.0110","doi":"https://doi.org/10.1147/rd.121.0110","is_oa":false,"landing_page_url":"https://doi.org/10.1147/rd.121.0110","pdf_url":null,"source":{"id":"https://openalex.org/S4210219925","display_name":"IBM Journal of Research and Development","issn_l":"0018-8646","issn":["0018-8646","2151-8556"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320652","host_organization_name":"IBM","host_organization_lineage":["https://openalex.org/P4310320652"],"host_organization_lineage_names":["IBM"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IBM Journal of Research and Development","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5110102894","display_name":"T. C. Ku","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"T. C. Ku","raw_affiliation_strings":["Systems Development Division, Endicott, New York#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Systems Development Division, Endicott, New York#TAB#","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067373421","display_name":"Shigeaki So","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"S. S. So","raw_affiliation_strings":["Systems Development Division, Endicott, New York#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Systems Development Division, Endicott, New York#TAB#","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059904127","display_name":"Wayne E. Nickola","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"W. E. Nickola","raw_affiliation_strings":["Photolastic Inc., Malvern, Pennsylvania#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Photolastic Inc., Malvern, Pennsylvania#TAB#","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.22138837,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"12","issue":"1","first_page":"110","last_page":"112"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10396","display_name":"Fatigue and fracture mechanics","score":0.39890000224113464,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10396","display_name":"Fatigue and fracture mechanics","score":0.39890000224113464,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13261","display_name":"Elasticity and Wave Propagation","score":0.15809999406337738,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","score":0.14169999957084656,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/shear-stress","display_name":"shear stress","score":0.9110000133514404},{"id":"https://openalex.org/keywords/crystal-damage","display_name":"crystal damage","score":0.6869999766349792},{"id":"https://openalex.org/keywords/dislocation-density","display_name":"dislocation density","score":0.9490000009536743},{"id":"https://openalex.org/keywords/grinding-damage","display_name":"grinding damage","score":0.5609999895095825},{"id":"https://openalex.org/keywords/integrated-circuits","display_name":"integrated circuits","score":0.7419999837875366},{"id":"https://openalex.org/keywords/mechanical-stress-distribution","display_name":"mechanical stress distribution","score":0.3240000009536743}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6425886154174805},{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.6165252923965454},{"id":"https://openalex.org/C2777571299","wikidata":"https://www.wikidata.org/wiki/Q3680646","display_name":"Grinding","level":2,"score":0.5741098523139954},{"id":"https://openalex.org/C159122135","wikidata":"https://www.wikidata.org/wiki/Q737571","display_name":"Dislocation","level":2,"score":0.5294002294540405},{"id":"https://openalex.org/C96035792","wikidata":"https://www.wikidata.org/wiki/Q43606218","display_name":"Shear (geology)","level":2,"score":0.5212025046348572},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.4806291460990906},{"id":"https://openalex.org/C21141959","wikidata":"https://www.wikidata.org/wiki/Q657936","display_name":"Shear stress","level":2,"score":0.4227803945541382},{"id":"https://openalex.org/C198082294","wikidata":"https://www.wikidata.org/wiki/Q3399648","display_name":"Position (finance)","level":2,"score":0.4117549657821655},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.38086849451065063},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3674447238445282},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22646808624267578},{"id":"https://openalex.org/C10138342","wikidata":"https://www.wikidata.org/wiki/Q43015","display_name":"Finance","level":1,"score":0.0},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1147/rd.121.0110","doi":"https://doi.org/10.1147/rd.121.0110","is_oa":false,"landing_page_url":"https://doi.org/10.1147/rd.121.0110","pdf_url":null,"source":{"id":"https://openalex.org/S4210219925","display_name":"IBM Journal of Research and Development","issn_l":"0018-8646","issn":["0018-8646","2151-8556"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320652","host_organization_name":"IBM","host_organization_lineage":["https://openalex.org/P4310320652"],"host_organization_lineage_names":["IBM"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IBM Journal of Research and Development","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W637079380","https://openalex.org/W2067419286","https://openalex.org/W2094597120"],"related_works":["https://openalex.org/W2510734704","https://openalex.org/W2360169225","https://openalex.org/W615646452","https://openalex.org/W2731277679","https://openalex.org/W2313276075","https://openalex.org/W4392905161","https://openalex.org/W6991774234","https://openalex.org/W4232358820","https://openalex.org/W2887780847","https://openalex.org/W2127935434"],"abstract_inverted_index":{"In":[0],"the":[1,20,29,44,48,51,61,69,78,83,87,94],"dicing":[2],"of":[3,50,63,80,96],"a":[4,23,36],"silicon":[5],"disk":[6,21,84],"into":[7],"separate":[8],"integrated":[9],"circuit":[10,65],"chips,":[11],"an":[12],"alignment":[13],"notch":[14,32],"is":[15,33,74],"commonly":[16],"used":[17],"to":[18,43,76],"maintain":[19],"in":[22,35,47,55,68,82],"precise":[24],"and":[25],"stable":[26],"position":[27],"throughout":[28],"process.":[30],"This":[31],"formed":[34],"grinding":[37],"operation":[38],"which":[39],"causes":[40],"mechanical":[41],"damage":[42,81],"crystal":[45,56],"structure":[46],"vicinity":[49],"notch.":[52],"The":[53],"increase":[54],"dislocation":[57],"density":[58],"will":[59],"degrade":[60],"performance":[62],"any":[64],"chips":[66],"located":[67],"damaged":[70],"area.":[71],"Hence,":[72],"it":[73],"important":[75],"learn":[77],"extent":[79],"so":[85],"that":[86],"affected":[88],"region":[89],"can":[90],"be":[91],"avoided":[92],"during":[93],"production":[95],"chips.":[97]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2016-06-24T00:00:00"}