{"id":"https://openalex.org/W1988226672","doi":"https://doi.org/10.1557/jmr.1999.0295","title":"Indentation plastic displacement field: Part I. The case of soft films on hard substrates","display_name":"Indentation plastic displacement field: Part I. The case of soft films on hard substrates","publication_year":1999,"publication_date":"1999-06-01","ids":{"openalex":"https://openalex.org/W1988226672","doi":"https://doi.org/10.1557/jmr.1999.0295","mag":"1988226672"},"language":"en","primary_location":{"id":"doi:10.1557/jmr.1999.0295","doi":"https://doi.org/10.1557/jmr.1999.0295","is_oa":false,"landing_page_url":"https://doi.org/10.1557/jmr.1999.0295","pdf_url":null,"source":{"id":"https://openalex.org/S19730638","display_name":"Journal of materials research/Pratt's guide to venture capital sources","issn_l":"0884-1616","issn":["0884-1616","0884-2914","1091-8876","1092-8928","2044-5326"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Materials Research","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5043068272","display_name":"Ting Y. Tsui","orcid":"https://orcid.org/0000-0001-6291-9870","observed_orcids":["https://orcid.org/0000-0001-6291-9870"]},"institutions":[{"id":"https://openalex.org/I4210137977","display_name":"Advanced Micro Devices (United States)","ror":"https://ror.org/04kd6c783","country_code":"US","type":"company","lineage":["https://openalex.org/I4210137977"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"T. Y. Tsui","raw_affiliation_strings":["Advanced Micro Devices, One AMD Place, 94088, Sunnyvale, California, USA","Advanced Micro Devices, One AMD Place, Sunnyvale, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Micro Devices, One AMD Place, 94088, Sunnyvale, California, USA","institution_ids":["https://openalex.org/I4210137977"]},{"raw_affiliation_string":"Advanced Micro Devices, One AMD Place, Sunnyvale, USA","institution_ids":["https://openalex.org/I4210137977"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007802191","display_name":"Joost J. Vlassak","orcid":"https://orcid.org/0000-0002-2166-6288","observed_orcids":["https://orcid.org/0000-0002-2166-6288"]},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Joost Vlassak","raw_affiliation_strings":["Department of Materials Science and Engineering, Stanford University, 94305, Stanford, California, USA","Department of Materials science and engineering, Stanford University, Stanford, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, Stanford University, 94305, Stanford, California, USA","institution_ids":["https://openalex.org/I97018004"]},{"raw_affiliation_string":"Department of Materials science and engineering, Stanford University, Stanford, USA","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110117081","display_name":"William D. Nix","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"William D. Nix","raw_affiliation_strings":["Department of Materials Science and Engineering, Stanford University, 94305, Stanford, California, USA","Department of Materials science and engineering, Stanford University, Stanford, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, Stanford University, 94305, Stanford, California, USA","institution_ids":["https://openalex.org/I97018004"]},{"raw_affiliation_string":"Department of Materials science and engineering, Stanford University, Stanford, USA","institution_ids":["https://openalex.org/I97018004"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5043068272"],"corresponding_institution_ids":["https://openalex.org/I4210137977"],"apc_list":{"value":3490,"currency":"USD","value_usd":3490},"apc_paid":null,"fwci":16.5552,"has_fulltext":false,"cited_by_count":159,"citation_normalized_percentile":{"value":0.99711017,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":99},"biblio":{"volume":"14","issue":"6","first_page":"2196","last_page":"2203"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11799","display_name":"Adhesion, Friction, and Surface Interactions","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10923","display_name":"Force Microscopy Techniques and Applications","score":0.0,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/knoop-indentation","display_name":"Knoop indentation","score":0.8849999904632568},{"id":"https://openalex.org/keywords/plastic-deformation","display_name":"plastic deformation","score":0.7200000286102295},{"id":"https://openalex.org/keywords/pile-up","display_name":"pile-up","score":0.8339999914169312},{"id":"https://openalex.org/keywords/silicon-substrate","display_name":"silicon substrate","score":0.7300000190734863},{"id":"https://openalex.org/keywords/pore-closure","display_name":"pore closure","score":0.6380000114440918},{"id":"https://openalex.org/keywords/densification","display_name":"densification","score":0.7599999904632568},{"id":"https://openalex.org/keywords/focused-ion-beam-milling","display_name":"focused ion beam milling","score":0.7350000143051147},{"id":"https://openalex.org/keywords/film-substrate-interface","display_name":"film-substrate interface","score":0.7329999804496765},{"id":"https://openalex.org/keywords/normal-compression","display_name":"normal compression","score":0.6000000238418579},{"id":"https://openalex.org/keywords/inhomogeneous-deformation","display_name":"inhomogeneous deformation","score":0.6460000276565552},{"id":"https://openalex.org/keywords/indentation-depth","display_name":"indentation depth","score":0.4560000002384186}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.934589147567749},{"id":"https://openalex.org/C2780902562","wikidata":"https://www.wikidata.org/wiki/Q1154141","display_name":"Indentation","level":2,"score":0.8941521644592285},{"id":"https://openalex.org/C184498911","wikidata":"https://www.wikidata.org/wiki/Q2451025","display_name":"Knoop hardness test","level":4,"score":0.8424971103668213},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.6994178295135498},{"id":"https://openalex.org/C204366326","wikidata":"https://www.wikidata.org/wiki/Q3027650","display_name":"Deformation (meteorology)","level":2,"score":0.55440753698349},{"id":"https://openalex.org/C49326732","wikidata":"https://www.wikidata.org/wiki/Q1549892","display_name":"Nanoindentation","level":2,"score":0.5146589875221252},{"id":"https://openalex.org/C506065880","wikidata":"https://www.wikidata.org/wiki/Q716","display_name":"Titanium","level":2,"score":0.4805643856525421},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.4707525372505188},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.43344977498054504},{"id":"https://openalex.org/C513153333","wikidata":"https://www.wikidata.org/wiki/Q663","display_name":"Aluminium","level":2,"score":0.4128516912460327},{"id":"https://openalex.org/C165720898","wikidata":"https://www.wikidata.org/wiki/Q3150000","display_name":"Indentation hardness","level":3,"score":0.3516538739204407},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.16750413179397583},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.1608271598815918},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1557/jmr.1999.0295","doi":"https://doi.org/10.1557/jmr.1999.0295","is_oa":false,"landing_page_url":"https://doi.org/10.1557/jmr.1999.0295","pdf_url":null,"source":{"id":"https://openalex.org/S19730638","display_name":"Journal of materials research/Pratt's guide to venture capital sources","issn_l":"0884-1616","issn":["0884-1616","0884-2914","1091-8876","1092-8928","2044-5326"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Materials Research","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"sustainable_development_goals_aurora":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320306084","display_name":"U.S. Department of Energy","ror":"https://ror.org/01bj3aw27"},{"id":"https://openalex.org/F4320307757","display_name":"Advanced Micro Devices","ror":"https://ror.org/04kd6c783"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":25,"referenced_works":["https://openalex.org/W45744911","https://openalex.org/W1573952179","https://openalex.org/W1574793313","https://openalex.org/W1595115393","https://openalex.org/W1595283676","https://openalex.org/W1604427421","https://openalex.org/W1966316715","https://openalex.org/W1982910523","https://openalex.org/W1992017967","https://openalex.org/W1995043522","https://openalex.org/W1996563727","https://openalex.org/W2003980459","https://openalex.org/W2008632424","https://openalex.org/W2028182879","https://openalex.org/W2032318548","https://openalex.org/W2037537205","https://openalex.org/W2073630122","https://openalex.org/W2076997794","https://openalex.org/W2086933933","https://openalex.org/W2119680087","https://openalex.org/W2131116015","https://openalex.org/W2134466831","https://openalex.org/W2158972608","https://openalex.org/W2490080698","https://openalex.org/W3213435136"],"related_works":["https://openalex.org/W2694472533","https://openalex.org/W2025646320","https://openalex.org/W2146539764","https://openalex.org/W4229782748","https://openalex.org/W2127202777","https://openalex.org/W2377817240","https://openalex.org/W1974147899","https://openalex.org/W2013868533","https://openalex.org/W2079451325","https://openalex.org/W1969814548"],"abstract_inverted_index":null,"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":4},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":8},{"year":2016,"cited_by_count":5},{"year":2015,"cited_by_count":5},{"year":2014,"cited_by_count":5},{"year":2013,"cited_by_count":4},{"year":2012,"cited_by_count":3}],"updated_date":"2026-10-12T09:40:04.860316","created_date":"2025-10-10T00:00:00"}