{"id":"https://openalex.org/W1985807245","doi":"https://doi.org/10.1007/s11837-009-0087-6","title":"Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates","display_name":"Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates","publication_year":2009,"publication_date":"2009-06-01","ids":{"openalex":"https://openalex.org/W1985807245","doi":"https://doi.org/10.1007/s11837-009-0087-6","mag":"1985807245"},"language":"en","primary_location":{"id":"doi:10.1007/s11837-009-0087-6","doi":"https://doi.org/10.1007/s11837-009-0087-6","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s11837-009-0087-6","pdf_url":null,"source":{"id":"https://openalex.org/S116826539","display_name":"JOM","issn_l":"0148-6608","issn":["0148-6608","1047-4838","1543-1851"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","norway-1","poland-100","russia-white-list-2","vabb-shw"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"JOM","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5034916578","display_name":"Kazuhiro Nogita","orcid":"https://orcid.org/0000-0002-0721-6600","observed_orcids":["https://orcid.org/0000-0002-0721-6600"]},"institutions":[{"id":"https://openalex.org/I165143802","display_name":"The University of Queensland","ror":"https://ror.org/00rqy9422","country_code":"AU","type":"education","lineage":["https://openalex.org/I165143802"]},{"id":"https://openalex.org/I98285908","display_name":"The University of Osaka","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["AU","JP"],"is_corresponding":true,"raw_author_name":"K. Nogita","raw_affiliation_strings":["Materials Engineering Division at the University of Queensland, Brisbane, Australia","Osaka University, Osaka, Japan","Materials Engineering Division at the University of Queensland","Osaka University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Materials Engineering Division at the University of Queensland, Brisbane, Australia","institution_ids":["https://openalex.org/I165143802"]},{"raw_affiliation_string":"Osaka University, Osaka, Japan","institution_ids":["https://openalex.org/I98285908"]},{"raw_affiliation_string":"Materials Engineering Division at the University of Queensland","institution_ids":["https://openalex.org/I165143802"]},{"raw_affiliation_string":"Osaka University","institution_ids":["https://openalex.org/I98285908"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076577900","display_name":"C.M. Gourlay","orcid":"https://orcid.org/0000-0002-4588-6007","observed_orcids":["https://orcid.org/0000-0002-4588-6007"]},"institutions":[{"id":"https://openalex.org/I47508984","display_name":"Imperial College London","ror":"https://ror.org/041kmwe10","country_code":"GB","type":"education","lineage":["https://openalex.org/I47508984"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"C. M. Gourlay","raw_affiliation_strings":["Imperial College London, London, UK","Imperial College London,#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Imperial College London, London, UK","institution_ids":["https://openalex.org/I47508984"]},{"raw_affiliation_string":"Imperial College London,#TAB#","institution_ids":["https://openalex.org/I47508984"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5108660760","display_name":"T. Nishimura","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405269390","display_name":"NIHON SUPERIOR CO., LTD. (Japan)","ror":"https://ror.org/04148t214","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405269390"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T. Nishimura","raw_affiliation_strings":["Nihon Superior Company Ltd., Osaka, Japan","Nihon Superior Company Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nihon Superior Company Ltd., Osaka, Japan","institution_ids":["https://openalex.org/I4405269390"]},{"raw_affiliation_string":"Nihon Superior Company Ltd","institution_ids":["https://openalex.org/I4405269390"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5034916578"],"corresponding_institution_ids":["https://openalex.org/I165143802","https://openalex.org/I98285908"],"apc_list":{"value":3790,"currency":"USD","value_usd":3790},"apc_paid":null,"fwci":8.5941,"has_fulltext":false,"cited_by_count":155,"citation_normalized_percentile":{"value":0.98033404,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":96,"max":99},"biblio":{"volume":"61","issue":"6","first_page":"45","last_page":"51"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14128","display_name":"Metallurgical and Alloy Processes","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cu6sn5-intermetallic-compound","display_name":"Cu6Sn5 intermetallic","score":0.8500000238418579},{"id":"https://openalex.org/keywords/sn-cu-ni-solder","display_name":"Sn-Cu-Ni solder","score":0.7730000019073486},{"id":"https://openalex.org/keywords/lead-free-solder","display_name":"lead-free solder","score":0.7820000052452087},{"id":"https://openalex.org/keywords/solder-cracking","display_name":"solder cracking","score":0.5339999794960022},{"id":"https://openalex.org/keywords/crack-prevention","display_name":"crack prevention","score":0.6489999890327454},{"id":"https://openalex.org/keywords/phase-transformation","display_name":"phase transformation","score":0.6650000214576721},{"id":"https://openalex.org/keywords/phase-stability","display_name":"phase stability","score":0.5299999713897705},{"id":"https://openalex.org/keywords/copper-substrate","display_name":"copper substrate","score":0.49000000953674316},{"id":"https://openalex.org/keywords/reaction-layer","display_name":"reaction layer","score":0.6850000023841858},{"id":"https://openalex.org/keywords/hydrostatic-stress","display_name":"hydrostatic stress","score":0.5889999866485596}],"concepts":[{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.8372691869735718},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7918224334716797},{"id":"https://openalex.org/C61276311","wikidata":"https://www.wikidata.org/wiki/Q624543","display_name":"Monoclinic crystal system","level":3,"score":0.6485282778739929},{"id":"https://openalex.org/C39519442","wikidata":"https://www.wikidata.org/wiki/Q904893","display_name":"Differential scanning calorimetry","level":2,"score":0.6430979371070862},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.592726469039917},{"id":"https://openalex.org/C58396970","wikidata":"https://www.wikidata.org/wiki/Q212749","display_name":"Cracking","level":2,"score":0.5758877992630005},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.5700801014900208},{"id":"https://openalex.org/C504270822","wikidata":"https://www.wikidata.org/wiki/Q744","display_name":"Nickel","level":2,"score":0.5372651815414429},{"id":"https://openalex.org/C44280652","wikidata":"https://www.wikidata.org/wiki/Q104837","display_name":"Phase (matter)","level":2,"score":0.5162122845649719},{"id":"https://openalex.org/C21368211","wikidata":"https://www.wikidata.org/wiki/Q689863","display_name":"Synchrotron","level":2,"score":0.4776096045970917},{"id":"https://openalex.org/C115645028","wikidata":"https://www.wikidata.org/wiki/Q902629","display_name":"Rietveld refinement","level":3,"score":0.42878130078315735},{"id":"https://openalex.org/C8010536","wikidata":"https://www.wikidata.org/wiki/Q160398","display_name":"Crystallography","level":1,"score":0.35920652747154236},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.295306533575058},{"id":"https://openalex.org/C115624301","wikidata":"https://www.wikidata.org/wiki/Q895901","display_name":"Crystal structure","level":2,"score":0.2284347414970398},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.13747161626815796},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.12982869148254395},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.07745823264122009},{"id":"https://openalex.org/C185544564","wikidata":"https://www.wikidata.org/wiki/Q81197","display_name":"Nuclear physics","level":1,"score":0.0},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/s11837-009-0087-6","doi":"https://doi.org/10.1007/s11837-009-0087-6","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s11837-009-0087-6","pdf_url":null,"source":{"id":"https://openalex.org/S116826539","display_name":"JOM","issn_l":"0148-6608","issn":["0148-6608","1047-4838","1543-1851"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","norway-1","poland-100","russia-white-list-2","vabb-shw"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"JOM","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W330672864","https://openalex.org/W1982597676","https://openalex.org/W1983588469","https://openalex.org/W1985766858","https://openalex.org/W2000049237","https://openalex.org/W2004871803","https://openalex.org/W2026929603","https://openalex.org/W2029267562","https://openalex.org/W2037850962","https://openalex.org/W2038564026","https://openalex.org/W2048911256","https://openalex.org/W2057106889","https://openalex.org/W2061687441","https://openalex.org/W2070482919","https://openalex.org/W2079941136","https://openalex.org/W2083937419","https://openalex.org/W2087085099","https://openalex.org/W2119897080","https://openalex.org/W2121795765","https://openalex.org/W2156416303","https://openalex.org/W4285719527","https://openalex.org/W6605249264"],"related_works":["https://openalex.org/W190318463","https://openalex.org/W2019398047","https://openalex.org/W207194377","https://openalex.org/W3125707998","https://openalex.org/W2038564026","https://openalex.org/W2045160004","https://openalex.org/W2383783922","https://openalex.org/W144279815","https://openalex.org/W2034117368","https://openalex.org/W2275802046"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":11},{"year":2025,"cited_by_count":9},{"year":2024,"cited_by_count":9},{"year":2023,"cited_by_count":6},{"year":2022,"cited_by_count":6},{"year":2021,"cited_by_count":11},{"year":2020,"cited_by_count":4},{"year":2019,"cited_by_count":10},{"year":2018,"cited_by_count":11},{"year":2017,"cited_by_count":11},{"year":2016,"cited_by_count":10},{"year":2015,"cited_by_count":8},{"year":2014,"cited_by_count":11},{"year":2013,"cited_by_count":4},{"year":2012,"cited_by_count":14}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2016-06-24T00:00:00"}