{"id":"https://openalex.org/W1984792258","doi":"https://doi.org/10.1109/estc.2006.280051","title":"Conductive Microstructures and Connections for Microelectronics Made by Ink-Jet Technology","display_name":"Conductive Microstructures and Connections for Microelectronics Made by Ink-Jet Technology","publication_year":2006,"publication_date":"2006-09-01","ids":{"openalex":"https://openalex.org/W1984792258","doi":"https://doi.org/10.1109/estc.2006.280051","mag":"1984792258"},"language":"en","primary_location":{"id":"doi:10.1109/estc.2006.280051","doi":"https://doi.org/10.1109/estc.2006.280051","is_oa":false,"landing_page_url":"https://doi.org/10.1109/estc.2006.280051","pdf_url":null,"source":{"id":"https://openalex.org/S4306497785","display_name":"Electronic System-Integration Technology Conference (ESTC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2006 1st Electronic Systemintegration Technology Conference","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5097032014","display_name":"Andrzej Mooscicki","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2801633905","display_name":"MPC Computers (United States)","ror":"https://ror.org/03kv7mk61","country_code":"US","type":"company","lineage":["https://openalex.org/I2801633905"]},{"id":"https://openalex.org/I4405262974","display_name":"Contemporary Amperex Technology Co., Limited.","ror":"https://ror.org/00tr9az64","country_code":"CN","type":"company","lineage":["https://openalex.org/I4405262974"]}],"countries":["CN","US"],"is_corresponding":false,"raw_author_name":"Andrzej Mooscicki","raw_affiliation_strings":["AMEPOX Microelectronics, Ltd., 90-268 \u0141\u00f3d\u017a; Jaracza str. 6; Poland, Smoluchowskiego25, 50-372 Wroc\u0142aw, e-mail: amepox@amepox.com.pl","AMEPOX Microelectronics, Ltd., 90-268 \u0141\u00f3d\u017a","Jaracza str. 6"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AMEPOX Microelectronics, Ltd., 90-268 \u0141\u00f3d\u017a; Jaracza str. 6; Poland, Smoluchowskiego25, 50-372 Wroc\u0142aw, e-mail: amepox@amepox.com.pl","institution_ids":[]},{"raw_affiliation_string":"AMEPOX Microelectronics, Ltd., 90-268 \u0141\u00f3d\u017a","institution_ids":["https://openalex.org/I2801633905","https://openalex.org/I4405262974"]},{"raw_affiliation_string":"Jaracza str. 6","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022365250","display_name":"Jan Felba","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I11923345","display_name":"Wroc\u0142aw University of Science and Technology","ror":"https://ror.org/008fyn775","country_code":"PL","type":"education","lineage":["https://openalex.org/I11923345"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Jan Felba","raw_affiliation_strings":["Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Wroclaw, Poland","Wroclaw University of Technology Faculty of Microsystem Electronics and Photonics, Grabiszynska 97, 53-439 Wroclaw, Poland, Smoluchowskiego25, 50-372 Wroc\u00bfaw, e-mail: jan.felba@pwr.wroc.pl"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Wroclaw, Poland","institution_ids":["https://openalex.org/I11923345"]},{"raw_affiliation_string":"Wroclaw University of Technology Faculty of Microsystem Electronics and Photonics, Grabiszynska 97, 53-439 Wroclaw, Poland, Smoluchowskiego25, 50-372 Wroc\u00bfaw, e-mail: jan.felba@pwr.wroc.pl","institution_ids":["https://openalex.org/I11923345"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5041060318","display_name":"W. Dudzi\u0144ski","orcid":"https://orcid.org/0000-0002-6308-1472","observed_orcids":["https://orcid.org/0000-0002-6308-1472"]},"institutions":[{"id":"https://openalex.org/I11923345","display_name":"Wroc\u0142aw University of Science and Technology","ror":"https://ror.org/008fyn775","country_code":"PL","type":"education","lineage":["https://openalex.org/I11923345"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Wlodzimierz Dudzinski","raw_affiliation_strings":["Wroclaw University of Technology, Faculty of Mechanical Engineering, Smoluchowskiego25, 50-372 Wroc\u0142aw, e-mail: wlodzimierz.dudzinski@pwr.wroc.pl","Wroclaw University of Technology, Faculty of Mechanical Engineering, Smoluchowskiego25, 50-372 Wroc\u00bfaw, e-mail: wlodzimierz.dudzinski@pwr.wroc.pl"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Wroclaw University of Technology, Faculty of Mechanical Engineering, Smoluchowskiego25, 50-372 Wroc\u0142aw, e-mail: wlodzimierz.dudzinski@pwr.wroc.pl","institution_ids":["https://openalex.org/I11923345"]},{"raw_affiliation_string":"Wroclaw University of Technology, Faculty of Mechanical Engineering, Smoluchowskiego25, 50-372 Wroc\u00bfaw, e-mail: wlodzimierz.dudzinski@pwr.wroc.pl","institution_ids":["https://openalex.org/I11923345"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":3.1651,"has_fulltext":false,"cited_by_count":16,"citation_normalized_percentile":{"value":0.91276596,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"511","last_page":"517"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12776","display_name":"Electrohydrodynamics and Fluid Dynamics","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/inkjet-printing","display_name":"inkjet printing","score":0.9919999837875366},{"id":"https://openalex.org/keywords/printed-electronics","display_name":"printed electronics","score":0.5609999895095825},{"id":"https://openalex.org/keywords/silver-nanoparticles","display_name":"silver nanoparticles","score":0.6159999966621399},{"id":"https://openalex.org/keywords/conductive-ink","display_name":"conductive ink","score":0.7419999837875366},{"id":"https://openalex.org/keywords/electrical-connections","display_name":"electrical connections","score":0.47600001096725464},{"id":"https://openalex.org/keywords/microelectronics-manufacturing","display_name":"microelectronics manufacturing","score":0.39399999380111694}],"concepts":[{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.7778869867324829},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7314120531082153},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.6246256828308105},{"id":"https://openalex.org/C56200935","wikidata":"https://www.wikidata.org/wiki/Q250840","display_name":"Nozzle","level":2,"score":0.6214430928230286},{"id":"https://openalex.org/C109693293","wikidata":"https://www.wikidata.org/wiki/Q1496072","display_name":"Inkwell","level":2,"score":0.6138758063316345},{"id":"https://openalex.org/C2777892344","wikidata":"https://www.wikidata.org/wiki/Q5159386","display_name":"Conductive ink","level":4,"score":0.6052315831184387},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.51708984375},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.5092164278030396},{"id":"https://openalex.org/C95238685","wikidata":"https://www.wikidata.org/wiki/Q1326902","display_name":"Electrohydrodynamics","level":3,"score":0.4814828634262085},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.47984927892684937},{"id":"https://openalex.org/C25435620","wikidata":"https://www.wikidata.org/wiki/Q1497629","display_name":"Printed electronics","level":3,"score":0.4300042986869812},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.42670929431915283},{"id":"https://openalex.org/C119947313","wikidata":"https://www.wikidata.org/wiki/Q5596635","display_name":"Jet (fluid)","level":2,"score":0.4214558005332947},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2657725214958191},{"id":"https://openalex.org/C60799052","wikidata":"https://www.wikidata.org/wiki/Q46221","display_name":"Electric field","level":2,"score":0.09553572535514832},{"id":"https://openalex.org/C66825105","wikidata":"https://www.wikidata.org/wiki/Q354718","display_name":"Sheet resistance","level":3,"score":0.08613482117652893},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.07153773307800293},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/estc.2006.280051","doi":"https://doi.org/10.1109/estc.2006.280051","is_oa":false,"landing_page_url":"https://doi.org/10.1109/estc.2006.280051","pdf_url":null,"source":{"id":"https://openalex.org/S4306497785","display_name":"Electronic System-Integration Technology Conference (ESTC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2006 1st Electronic Systemintegration Technology Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W2539867605","https://openalex.org/W4285719527"],"related_works":["https://openalex.org/W2119623167","https://openalex.org/W1991371170","https://openalex.org/W2093249292","https://openalex.org/W4254119317","https://openalex.org/W2805528617","https://openalex.org/W2539867605","https://openalex.org/W2142684258","https://openalex.org/W2384023383","https://openalex.org/W3141684918","https://openalex.org/W4378445992"],"abstract_inverted_index":{"Production":[0],"of":[1,12,37,43,52,67,86,129,142,147,165,175],"modern":[2],"microelectronic":[3],"devices":[4],"needs":[5,97],"printing":[6,66,159],"technologies":[7,181],"with":[8,18,100,119,168,192,208],"the":[9,41,49,80,83,139,143,145,163,176,187],"highest":[10],"level":[11],"resolution":[13],"and":[14,55,91,106,151,190,205],"repeatability.":[15],"Ink-jet":[16],"technology":[17],"micro-dimensions":[19],"nozzle":[20,84],"is":[21,178,200],"year":[22,24],"by":[23,114],"wider":[25],"used":[26],"for":[27,185],"this":[28,127],"purpose.":[29],"It":[30],"makes":[31],"possible":[32,104,201],"to":[33,61,180,202],"dispense":[34],"small":[35],"volumes":[36],"a":[38,47,87,197],"material":[39],"in":[40,210],"range":[42,211],"tens":[44,60,89],"picolitres.":[45],"As":[46,196],"result":[48,198],"printed":[50,188],"matrix":[51],"dots,":[53],"lines":[54,204],"more":[56],"complicated":[57,206],"shapes":[58,207],"have":[59,162],"hundreds":[62],"micrometers":[63,90],"scale.":[64],"The":[65,172],"electrically":[68],"conductive":[69,75],"microstructures":[70,189],"requires":[71],"dispensed":[72],"materials":[73],"containing":[74,116],"particles":[76,118],"as":[77,101,103],"filler.":[78],"On":[79],"other":[81],"hand,":[82],"diameter":[85],"few":[88],"extremely":[92,135],"high":[93,194],"acceleration":[94],"during":[95,134],"\"shots\"":[96],"liquid":[98],"formulations":[99],"low":[102],"viscosity":[105],"highly":[107],"homogeneous":[108],"structure.":[109],"Such":[110],"demands":[111],"are":[112,154,183],"fulfilled":[113],"ink":[115],"silver":[117,149],"size":[120],"dimensions":[121],"less":[122],"than":[123],"10":[124],"nm.":[125],"Only":[126],"types":[128],"fluids":[130],"work":[131],"very":[132,193],"stable":[133],"long":[136],"time.":[137],"In":[138],"first":[140],"part":[141,174],"paper":[144,177],"background":[146],"nano":[148],"production":[150],"its":[152],"properties":[153],"presented.":[155],"Just":[156],"after":[157],"ink-jet":[158],"process":[160],"structures":[161],"form":[164],"molecular":[166],"fluid":[167],"no":[169],"electrical":[170],"conductivity.":[171],"main":[173],"devoted":[179],"which":[182],"necessary":[184],"obtaining":[186],"connections":[191],"conductance.":[195],"it":[199],"make":[203],"resistivity":[209],"10-5":[212],"\u03a9cm.":[213]},"counts_by_year":[{"year":2018,"cited_by_count":2},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":3}],"updated_date":"2026-10-05T09:50:58.205359","created_date":"2016-06-24T00:00:00"}