{"id":"https://openalex.org/W1983265996","doi":"https://doi.org/10.1016/s0257-8972(00)00753-2","title":"Residual stress analysis of SiO2 films deposited by plasma-enhanced chemical vapor deposition","display_name":"Residual stress analysis of SiO2 films deposited by plasma-enhanced chemical vapor deposition","publication_year":2000,"publication_date":"2000-09-01","ids":{"openalex":"https://openalex.org/W1983265996","doi":"https://doi.org/10.1016/s0257-8972(00)00753-2","mag":"1983265996"},"language":"en","primary_location":{"id":"doi:10.1016/s0257-8972(00)00753-2","doi":"https://doi.org/10.1016/s0257-8972(00)00753-2","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0257-8972(00)00753-2","pdf_url":null,"source":{"id":"https://openalex.org/S76010543","display_name":"Surface and Coatings Technology","issn_l":"0257-8972","issn":["0257-8972","1879-3347"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["anvur-scientific","cwts-core","dongbi-b","jufo-2","ki-jl-1","norway-1","poland-100","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Surface and Coatings Technology","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5023007479","display_name":"Jin-Kyung Choi","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Jin-Kyung Choi","raw_affiliation_strings":["Department of Materials Engineering. Sungkyunkwan University, 300 Chunchun-dong Jangan-gu, 440-746 Suwon, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Engineering. Sungkyunkwan University, 300 Chunchun-dong Jangan-gu, 440-746 Suwon, South Korea","institution_ids":["https://openalex.org/I848706"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049292212","display_name":"J. Lee","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"J. Lee","raw_affiliation_strings":["Department of Materials Engineering. Sungkyunkwan University, 300 Chunchun-dong Jangan-gu, 440-746 Suwon, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Engineering. Sungkyunkwan University, 300 Chunchun-dong Jangan-gu, 440-746 Suwon, South Korea","institution_ids":["https://openalex.org/I848706"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044406224","display_name":"Ji\u2010Beom Yoo","orcid":"https://orcid.org/0000-0002-3074-6685","observed_orcids":["https://orcid.org/0000-0002-3074-6685"]},"institutions":[{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Ji-Beom Yoo","raw_affiliation_strings":["Department of Materials Engineering. Sungkyunkwan University, 300 Chunchun-dong Jangan-gu, 440-746 Suwon, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Engineering. Sungkyunkwan University, 300 Chunchun-dong Jangan-gu, 440-746 Suwon, South Korea","institution_ids":["https://openalex.org/I848706"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088471794","display_name":"Jongsun Maeng","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I111277659","display_name":"Chonnam National University","ror":"https://ror.org/05kzjxq56","country_code":"KR","type":"education","lineage":["https://openalex.org/I111277659"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jong-Sun Maeng","raw_affiliation_strings":["Department of Metallurgical Engineering, Chonnam National University*300, Yongbong-dong Buk-gu, 500-757 Kwangju, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Metallurgical Engineering, Chonnam National University*300, Yongbong-dong Buk-gu, 500-757 Kwangju, South Korea","institution_ids":["https://openalex.org/I111277659"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5103223983","display_name":"Youngman Kim","orcid":"https://orcid.org/0000-0003-0787-1485","observed_orcids":["https://orcid.org/0000-0003-0787-1485"]},"institutions":[{"id":"https://openalex.org/I111277659","display_name":"Chonnam National University","ror":"https://ror.org/05kzjxq56","country_code":"KR","type":"education","lineage":["https://openalex.org/I111277659"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Young-Man Kim","raw_affiliation_strings":["Department of Metallurgical Engineering, Chonnam National University*300, Yongbong-dong Buk-gu, 500-757 Kwangju, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Metallurgical Engineering, Chonnam National University*300, Yongbong-dong Buk-gu, 500-757 Kwangju, South Korea","institution_ids":["https://openalex.org/I111277659"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5023007479"],"corresponding_institution_ids":["https://openalex.org/I848706"],"apc_list":{"value":3880,"currency":"USD","value_usd":3880},"apc_paid":null,"fwci":0.4226,"has_fulltext":false,"cited_by_count":11,"citation_normalized_percentile":{"value":0.65569357,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":96},"biblio":{"volume":"131","issue":"1-3","first_page":"153","last_page":"157"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.4456000030040741,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.4456000030040741,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","score":0.4043000042438507,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.08449999988079071,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/residual-stress","display_name":"residual stress","score":0.9430000185966492},{"id":"https://openalex.org/keywords/silicon-dioxide-thin-films","display_name":"SiO2 thin films","score":0.8960000276565552},{"id":"https://openalex.org/keywords/silica","display_name":"silica","score":0.7450000047683716},{"id":"https://openalex.org/keywords/plasma-enhanced-chemical-vapor-deposition","display_name":"plasma-enhanced chemical vapor deposition","score":0.9440000057220459},{"id":"https://openalex.org/keywords/hmds","display_name":"HMDS","score":0.6909999847412109},{"id":"https://openalex.org/keywords/silane","display_name":"silane","score":0.8429999947547913},{"id":"https://openalex.org/keywords/rf-power","display_name":"RF power","score":0.9399999976158142},{"id":"https://openalex.org/keywords/growth-temperature","display_name":"growth temperature","score":0.8700000047683716},{"id":"https://openalex.org/keywords/deposition-parameters","display_name":"deposition parameters","score":0.6769999861717224}],"concepts":[{"id":"https://openalex.org/C37292000","wikidata":"https://www.wikidata.org/wiki/Q1257918","display_name":"Residual stress","level":2,"score":0.9121137857437134},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.851643443107605},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.6012213826179504},{"id":"https://openalex.org/C57410435","wikidata":"https://www.wikidata.org/wiki/Q505668","display_name":"Chemical vapor deposition","level":2,"score":0.5535861253738403},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.5382565855979919},{"id":"https://openalex.org/C64297162","wikidata":"https://www.wikidata.org/wiki/Q1987070","display_name":"Deposition (geology)","level":3,"score":0.5332956314086914},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.4592738747596741},{"id":"https://openalex.org/C155512373","wikidata":"https://www.wikidata.org/wiki/Q287450","display_name":"Residual","level":2,"score":0.43183034658432007},{"id":"https://openalex.org/C87210426","wikidata":"https://www.wikidata.org/wiki/Q1072476","display_name":"Bending","level":2,"score":0.42367085814476013},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.10826417803764343},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C2816523","wikidata":"https://www.wikidata.org/wiki/Q180184","display_name":"Sediment","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0257-8972(00)00753-2","doi":"https://doi.org/10.1016/s0257-8972(00)00753-2","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0257-8972(00)00753-2","pdf_url":null,"source":{"id":"https://openalex.org/S76010543","display_name":"Surface and Coatings Technology","issn_l":"0257-8972","issn":["0257-8972","1879-3347"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["anvur-scientific","cwts-core","dongbi-b","jufo-2","ki-jl-1","norway-1","poland-100","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Surface and Coatings Technology","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1999449597","https://openalex.org/W2000572870","https://openalex.org/W2017281864","https://openalex.org/W2034327584","https://openalex.org/W2053253692","https://openalex.org/W2066017660","https://openalex.org/W2091146614"],"related_works":["https://openalex.org/W2918215069","https://openalex.org/W1985298851","https://openalex.org/W2012688126","https://openalex.org/W1989135116","https://openalex.org/W2061863391","https://openalex.org/W2368132576","https://openalex.org/W2898862147","https://openalex.org/W2291084446","https://openalex.org/W2039247622","https://openalex.org/W2888097411"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":1}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2016-06-24T00:00:00"}