{"id":"https://openalex.org/W1982989788","doi":"https://doi.org/10.1007/s00542-014-2366-6","title":"Recent progress in low temperature nanoimprint lithography","display_name":"Recent progress in low temperature nanoimprint lithography","publication_year":2014,"publication_date":"2014-11-19","ids":{"openalex":"https://openalex.org/W1982989788","doi":"https://doi.org/10.1007/s00542-014-2366-6","mag":"1982989788"},"language":"en","primary_location":{"id":"doi:10.1007/s00542-014-2366-6","doi":"https://doi.org/10.1007/s00542-014-2366-6","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s00542-014-2366-6","pdf_url":null,"source":{"id":"https://openalex.org/S54043040","display_name":"Microsystem Technologies","issn_l":"0946-7076","issn":["0946-7076","1432-1858"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microsystem Technologies","raw_type":"journal-article"},"parent_works":[],"lineage":["https://openalex.org/W1982989788"],"child_works_count":0,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100324497","display_name":"Hongwen Sun","orcid":"https://orcid.org/0000-0001-7932-0741","observed_orcids":["https://orcid.org/0000-0001-7932-0741"]},"institutions":[{"id":"https://openalex.org/I163340411","display_name":"Hohai University","ror":"https://ror.org/01wd4xt90","country_code":"CN","type":"education","lineage":["https://openalex.org/I163340411"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Hongwen Sun","raw_affiliation_strings":["College of Internet of Things, Hohai University, 200 JinLing Road North, Changzhou, 213022, China","College of Internet of Things, Hohai University, Changzhou, China 213022#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"College of Internet of Things, Hohai University, 200 JinLing Road North, Changzhou, 213022, China","institution_ids":["https://openalex.org/I163340411"]},{"raw_affiliation_string":"College of Internet of Things, Hohai University, Changzhou, China 213022#TAB#","institution_ids":["https://openalex.org/I163340411"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5100324497"],"corresponding_institution_ids":["https://openalex.org/I163340411"],"apc_list":{"value":2790,"currency":"USD","value_usd":2790},"apc_paid":null,"fwci":3.7993,"has_fulltext":false,"cited_by_count":46,"citation_normalized_percentile":{"value":0.9367191,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":99},"biblio":{"volume":"21","issue":"1","first_page":"1","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11471","display_name":"Block Copolymer Self-Assembly","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/uv-nanoimprint-lithography","display_name":"UV nanoimprint lithography","score":0.9710000157356262},{"id":"https://openalex.org/keywords/thermal-expansion-mismatch","display_name":"thermal expansion mismatch","score":0.8460000157356262},{"id":"https://openalex.org/keywords/alignment-errors","display_name":"alignment errors","score":0.6340000033378601},{"id":"https://openalex.org/keywords/nanostructuring","display_name":"nanostructuring","score":0.5669999718666077},{"id":"https://openalex.org/keywords/resist-materials","display_name":"resist materials","score":0.6449999809265137},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"optoelectronics","score":0.906000018119812},{"id":"https://openalex.org/keywords/displays","display_name":"display devices","score":0.9769999980926514},{"id":"https://openalex.org/keywords/bioapplications","display_name":"bioapplications","score":0.8690000176429749}],"concepts":[{"id":"https://openalex.org/C2777046567","wikidata":"https://www.wikidata.org/wiki/Q1540138","display_name":"Nanoimprint lithography","level":4,"score":0.9816283583641052},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8266058564186096},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.6229128241539001},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.5729801654815674},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.5517277717590332},{"id":"https://openalex.org/C163581340","wikidata":"https://www.wikidata.org/wiki/Q1983848","display_name":"Next-generation lithography","level":5,"score":0.5463533401489258},{"id":"https://openalex.org/C182873914","wikidata":"https://www.wikidata.org/wiki/Q5157329","display_name":"Computational lithography","level":5,"score":0.46515828371047974},{"id":"https://openalex.org/C162117346","wikidata":"https://www.wikidata.org/wiki/Q1106386","display_name":"Nanolithography","level":4,"score":0.44946250319480896},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4292786717414856},{"id":"https://openalex.org/C41794268","wikidata":"https://www.wikidata.org/wiki/Q1408939","display_name":"X-ray lithography","level":4,"score":0.4090716540813446},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3522048592567444},{"id":"https://openalex.org/C200274948","wikidata":"https://www.wikidata.org/wiki/Q256845","display_name":"Electron-beam lithography","level":4,"score":0.20740622282028198},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.20197659730911255},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/s00542-014-2366-6","doi":"https://doi.org/10.1007/s00542-014-2366-6","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s00542-014-2366-6","pdf_url":null,"source":{"id":"https://openalex.org/S54043040","display_name":"Microsystem Technologies","issn_l":"0946-7076","issn":["0946-7076","1432-1858"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microsystem Technologies","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":37,"referenced_works":["https://openalex.org/W1969712551","https://openalex.org/W1971020131","https://openalex.org/W1971250122","https://openalex.org/W1975033320","https://openalex.org/W1975529972","https://openalex.org/W1977216533","https://openalex.org/W1998559735","https://openalex.org/W2002113618","https://openalex.org/W2011566323","https://openalex.org/W2016198450","https://openalex.org/W2019959655","https://openalex.org/W2020284896","https://openalex.org/W2021824388","https://openalex.org/W2025313460","https://openalex.org/W2036117499","https://openalex.org/W2037362340","https://openalex.org/W2053209054","https://openalex.org/W2054963815","https://openalex.org/W2059959474","https://openalex.org/W2062074587","https://openalex.org/W2062732108","https://openalex.org/W2063527592","https://openalex.org/W2066013916","https://openalex.org/W2072667277","https://openalex.org/W2075316733","https://openalex.org/W2076947689","https://openalex.org/W2081198555","https://openalex.org/W2082911317","https://openalex.org/W2090800068","https://openalex.org/W2096679194","https://openalex.org/W2126497920","https://openalex.org/W2130915971","https://openalex.org/W2137988080","https://openalex.org/W2139590608","https://openalex.org/W2162719192","https://openalex.org/W2326927612","https://openalex.org/W3022779416"],"related_works":["https://openalex.org/W2126481859","https://openalex.org/W2218616948","https://openalex.org/W2036117499","https://openalex.org/W4254864826","https://openalex.org/W1583664318","https://openalex.org/W4211180676","https://openalex.org/W2137988080","https://openalex.org/W2606798941","https://openalex.org/W3004318639","https://openalex.org/W2178483002"],"abstract_inverted_index":null,"counts_by_year":[{"year":2024,"cited_by_count":5},{"year":2023,"cited_by_count":4},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":4},{"year":2018,"cited_by_count":5},{"year":2017,"cited_by_count":9},{"year":2016,"cited_by_count":9},{"year":2015,"cited_by_count":4}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2016-06-24T00:00:00"}