{"id":"https://openalex.org/W1982910906","doi":"https://doi.org/10.1117/12.712368","title":"Process margin improvement using custom transmission EAPSM reticles","display_name":"Process margin improvement using custom transmission EAPSM reticles","publication_year":2007,"publication_date":"2007-03-16","ids":{"openalex":"https://openalex.org/W1982910906","doi":"https://doi.org/10.1117/12.712368","mag":"1982910906"},"language":"en","primary_location":{"id":"doi:10.1117/12.712368","doi":"https://doi.org/10.1117/12.712368","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.712368","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5020491300","display_name":"J. Buntin","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I11912373","display_name":"Micron (United States)","ror":"https://ror.org/02fv52296","country_code":"US","type":"company","lineage":["https://openalex.org/I11912373"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Buntin","raw_affiliation_strings":["Micron Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micron Technology, Inc. (United States)","institution_ids":["https://openalex.org/I11912373"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101442431","display_name":"Shivam Agarwal","orcid":"https://orcid.org/0000-0001-7221-1171","observed_orcids":["https://orcid.org/0000-0001-7221-1171"]},"institutions":[{"id":"https://openalex.org/I11912373","display_name":"Micron (United States)","ror":"https://ror.org/02fv52296","country_code":"US","type":"company","lineage":["https://openalex.org/I11912373"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Agarwal","raw_affiliation_strings":["Micron Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micron Technology, Inc. (United States)","institution_ids":["https://openalex.org/I11912373"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006823547","display_name":"B. Rolfson","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I11912373","display_name":"Micron (United States)","ror":"https://ror.org/02fv52296","country_code":"US","type":"company","lineage":["https://openalex.org/I11912373"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B. Rolfson","raw_affiliation_strings":["Micron Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micron Technology, Inc. (United States)","institution_ids":["https://openalex.org/I11912373"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032951748","display_name":"Richard Housley","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I11912373","display_name":"Micron (United States)","ror":"https://ror.org/02fv52296","country_code":"US","type":"company","lineage":["https://openalex.org/I11912373"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R. Housley","raw_affiliation_strings":["Micron Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micron Technology, Inc. (United States)","institution_ids":["https://openalex.org/I11912373"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061520109","display_name":"Bill Baggenstoss","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I11912373","display_name":"Micron (United States)","ror":"https://ror.org/02fv52296","country_code":"US","type":"company","lineage":["https://openalex.org/I11912373"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B. Baggenstoss","raw_affiliation_strings":["Micron Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micron Technology, Inc. (United States)","institution_ids":["https://openalex.org/I11912373"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026725461","display_name":"Erik Byers","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I11912373","display_name":"Micron (United States)","ror":"https://ror.org/02fv52296","country_code":"US","type":"company","lineage":["https://openalex.org/I11912373"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"E. Byers","raw_affiliation_strings":["Micron Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micron Technology, Inc. (United States)","institution_ids":["https://openalex.org/I11912373"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5108361338","display_name":"Chris Progler","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I150491032","display_name":"Photronics (United States)","ror":"https://ror.org/05jg7dd90","country_code":"US","type":"company","lineage":["https://openalex.org/I150491032"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. Progler","raw_affiliation_strings":["Photronics, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Photronics, Inc. (United States)","institution_ids":["https://openalex.org/I150491032"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.06316546,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"6520","issue":null,"first_page":"65202D","last_page":"65202D"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11517","display_name":"Advanced optical system design","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11183","display_name":"Advanced X-ray Imaging Techniques","score":0.0,"subfield":{"id":"https://openalex.org/subfields/3108","display_name":"Radiation"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/resolution-enhancement-techniques","display_name":"resolution enhancement techniques","score":0.7960000038146973},{"id":"https://openalex.org/keywords/low-k1-lithography","display_name":"low-k1 lithography","score":0.9610000252723694},{"id":"https://openalex.org/keywords/image-contrast","display_name":"image contrast","score":0.8569999933242798},{"id":"https://openalex.org/keywords/193-nm-lithography","display_name":"193 nm lithography","score":1.0}],"concepts":[{"id":"https://openalex.org/C146617872","wikidata":"https://www.wikidata.org/wiki/Q1391868","display_name":"Reticle","level":3,"score":0.9916739463806152},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.6629595160484314},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.6525534987449646},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.632186770439148},{"id":"https://openalex.org/C761482","wikidata":"https://www.wikidata.org/wiki/Q118093","display_name":"Transmission (telecommunications)","level":2,"score":0.5578171014785767},{"id":"https://openalex.org/C94263209","wikidata":"https://www.wikidata.org/wiki/Q1076175","display_name":"Immersion lithography","level":4,"score":0.5430343747138977},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5078108906745911},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.4762180745601654},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.44703027606010437},{"id":"https://openalex.org/C2777441419","wikidata":"https://www.wikidata.org/wiki/Q16969460","display_name":"Process window","level":3,"score":0.421560674905777},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3405877947807312},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.2690824568271637},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.17248907685279846},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.16293814778327942},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.13152629137039185},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09173581004142761},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.712368","doi":"https://doi.org/10.1117/12.712368","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.712368","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6773999929428101,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2087908072","https://openalex.org/W2083504775","https://openalex.org/W4236689710","https://openalex.org/W2028973912","https://openalex.org/W2490684128","https://openalex.org/W1973070317","https://openalex.org/W2091518452","https://openalex.org/W2165872646","https://openalex.org/W1997943642","https://openalex.org/W2091782806"],"abstract_inverted_index":{"Low":[0],"k1":[1,26,47,71],"lithography":[2,17],"poses":[3],"a":[4,64,69,147],"number":[5],"of":[6,149],"challenges":[7],"to":[8,21,42,44,50,91],"the":[9,31,45,57],"process":[10,72],"development":[11],"engineer.":[12],"Although":[13],"polarization":[14],"and":[15,55,112,155,162],"immersion":[16],"will":[18,33,143,166],"allow":[19],"us":[20],"create":[22],"processes":[23],"at":[24],"lower":[25],"than":[27],"previous":[28],"paradigms":[29],"allowed,":[30],"lithographer":[32],"quickly":[34],"be":[35,100,124,144,167],"looking":[36],"for":[37,126,146],"Resolution":[38],"Enhancement":[39],"Techniques":[40],"(RET)":[41],"push":[43],"ultra-low":[46],"regime,":[48],"or":[49],"extend":[51],"older":[52],"generation":[53],"tools":[54],"avoid":[56],"aforementioned":[58],"expensive":[59],"options.":[60],"Reticle":[61,96],"transmission":[62,97,106,122,142],"is":[63],"RET":[65],"that":[66],"can":[67,99,123],"enable":[68],"low":[70],"by":[73,139],"increasing":[74],"image":[75,132],"contrast.":[76],"With":[77],"work":[78],"performed":[79],"in":[80],"conjunction":[81],"with":[82,118],"our":[83],"MP":[84],"Mask":[85],"facility,":[86],"we":[87],"have":[88],"been":[89],"able":[90],"obtain":[92],"custom-transmission":[93,159],"EAPSM":[94],"reticles.":[95],"optimization":[98],"carried":[101],"out":[102],"through":[103],"simulation.":[104],"Optimum":[105],"varies":[107],"depending":[108],"on":[109,134],"optical":[110],"parameters":[111],"feature":[113],"size.":[114],"Moreover,":[115],"when":[116],"working":[117],"2D":[119],"patterns,":[120],"reticle":[121,141,160],"optimized":[125],"weaker":[127],"features,":[128],"without":[129],"significantly":[130],"sacrificing":[131],"contrast":[133],"primary":[135],"features.":[136],"Process":[137],"improvement":[138],"optimizing":[140],"explored":[145],"variety":[148],"device":[150],"types":[151],"using":[152],"both":[153],"248nm":[154],"193nm":[156],"lithography.":[157],"Simulation,":[158],"fabrication,":[161],"empirical":[163],"wafer":[164],"results":[165],"presented.":[168]},"counts_by_year":[{"year":2016,"cited_by_count":1}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2016-06-24T00:00:00"}