{"id":"https://openalex.org/W1980718166","doi":"https://doi.org/10.1115/ipack2007-33250","title":"Low-Cycle Fatigue Reliability Evaluation for Lead-Free Solders in Vehicle Electronics Devices","display_name":"Low-Cycle Fatigue Reliability Evaluation for Lead-Free Solders in Vehicle Electronics Devices","publication_year":2007,"publication_date":"2007-01-01","ids":{"openalex":"https://openalex.org/W1980718166","doi":"https://doi.org/10.1115/ipack2007-33250","mag":"1980718166"},"language":"en","primary_location":{"id":"doi:10.1115/ipack2007-33250","doi":"https://doi.org/10.1115/ipack2007-33250","is_oa":false,"landing_page_url":"https://doi.org/10.1115/ipack2007-33250","pdf_url":null,"source":{"id":"https://openalex.org/S7407088218","display_name":"ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ASME 2007 InterPACK Conference, Volume 1","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100717180","display_name":"Qiang Yu","orcid":"https://orcid.org/0009-0009-8474-8510","observed_orcids":["https://orcid.org/0009-0009-8474-8510","https://orcid.org/0000-0003-0441-7201","https://orcid.org/0009-0004-0011-1795"]},"institutions":[{"id":"https://openalex.org/I180203408","display_name":"Yokohama National University","ror":"https://ror.org/03zyp6p76","country_code":"JP","type":"education","lineage":["https://openalex.org/I180203408"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Qiang Yu","raw_affiliation_strings":["Yokohama National University, Yokohama, Kanagawa, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Yokohama National University, Yokohama, Kanagawa, Japan","institution_ids":["https://openalex.org/I180203408"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034332740","display_name":"Tadahiro Shibutani","orcid":"https://orcid.org/0000-0003-3205-4268","observed_orcids":["https://orcid.org/0000-0003-3205-4268"]},"institutions":[{"id":"https://openalex.org/I180203408","display_name":"Yokohama National University","ror":"https://ror.org/03zyp6p76","country_code":"JP","type":"education","lineage":["https://openalex.org/I180203408"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tadahiro Shibutani","raw_affiliation_strings":["Yokohama National University, Yokohama, Kanagawa, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Yokohama National University, Yokohama, Kanagawa, Japan","institution_ids":["https://openalex.org/I180203408"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026522031","display_name":"Akifumi Tanaka","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I180203408","display_name":"Yokohama National University","ror":"https://ror.org/03zyp6p76","country_code":"JP","type":"education","lineage":["https://openalex.org/I180203408"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Akifumi Tanaka","raw_affiliation_strings":["Yokohama National University, Yokohama, Kanagawa, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Yokohama National University, Yokohama, Kanagawa, Japan","institution_ids":["https://openalex.org/I180203408"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110050180","display_name":"Takahiro Koyama","orcid":"https://orcid.org/0009-0009-5479-273X","observed_orcids":["https://orcid.org/0009-0009-5479-273X"]},"institutions":[{"id":"https://openalex.org/I180203408","display_name":"Yokohama National University","ror":"https://ror.org/03zyp6p76","country_code":"JP","type":"education","lineage":["https://openalex.org/I180203408"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takahiro Koyama","raw_affiliation_strings":["Yokohama National University, Yokohama, Kanagawa, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Yokohama National University, Yokohama, Kanagawa, Japan","institution_ids":["https://openalex.org/I180203408"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5113596945","display_name":"Masaki SHIRATORI","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I180203408","display_name":"Yokohama National University","ror":"https://ror.org/03zyp6p76","country_code":"JP","type":"education","lineage":["https://openalex.org/I180203408"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Masaki Shiratori","raw_affiliation_strings":["Yokohama National University, Yokohama, Kanagawa, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Yokohama National University, Yokohama, Kanagawa, Japan","institution_ids":["https://openalex.org/I180203408"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I180203408"],"apc_list":null,"apc_paid":null,"fwci":4.5206,"has_fulltext":false,"cited_by_count":15,"citation_normalized_percentile":{"value":0.94844208,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"531","last_page":"537"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9945999979972839,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9945999979972839,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10396","display_name":"Fatigue and fracture mechanics","score":0.004699999932199717,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10780","display_name":"Reliability and Maintenance Optimization","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/2213","display_name":"Safety, Risk, Reliability and Quality"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/low-cycle-fatigue","display_name":"low cycle fatigue","score":0.9679999947547913},{"id":"https://openalex.org/keywords/lead-free-solder","display_name":"lead-free solder","score":0.949999988079071},{"id":"https://openalex.org/keywords/sn-ag-cu-solder","display_name":"Sn-Ag-Cu solder","score":0.9860000014305115},{"id":"https://openalex.org/keywords/solder-joints","display_name":"solder joints","score":0.6460000276565552},{"id":"https://openalex.org/keywords/automotive-electronics","display_name":"automotive electronics","score":0.921999990940094},{"id":"https://openalex.org/keywords/fatigue-life-prediction","display_name":"fatigue life prediction","score":0.5220000147819519},{"id":"https://openalex.org/keywords/crack-initiation","display_name":"crack initiation","score":0.5950000286102295},{"id":"https://openalex.org/keywords/crack-propagation","display_name":"crack propagation","score":0.8050000071525574},{"id":"https://openalex.org/keywords/miner-s-rule","display_name":"Miner's rule","score":0.9309999942779541},{"id":"https://openalex.org/keywords/inelastic-strain-range","display_name":"inelastic strain range","score":0.7630000114440918},{"id":"https://openalex.org/keywords/fatigue-reliability","display_name":"fatigue reliability","score":0.44600000977516174},{"id":"https://openalex.org/keywords/finite-element-analysis","display_name":"finite element analysis","score":0.7089999914169312}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7354199290275574},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.6836507320404053},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6189815402030945},{"id":"https://openalex.org/C2779686264","wikidata":"https://www.wikidata.org/wiki/Q25212824","display_name":"Low-cycle fatigue","level":2,"score":0.5331840515136719},{"id":"https://openalex.org/C18168003","wikidata":"https://www.wikidata.org/wiki/Q628595","display_name":"Eutectic system","level":3,"score":0.5073630213737488},{"id":"https://openalex.org/C2777093003","wikidata":"https://www.wikidata.org/wiki/Q6508345","display_name":"Lead (geology)","level":2,"score":0.4992079734802246},{"id":"https://openalex.org/C2985278600","wikidata":"https://www.wikidata.org/wiki/Q65051469","display_name":"Fatigue testing","level":2,"score":0.46934330463409424},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.4560430645942688},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.4523608684539795},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.3079487681388855},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.26218587160110474},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15753361582756042},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.10220298171043396},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C114793014","wikidata":"https://www.wikidata.org/wiki/Q52109","display_name":"Geomorphology","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1115/ipack2007-33250","doi":"https://doi.org/10.1115/ipack2007-33250","is_oa":false,"landing_page_url":"https://doi.org/10.1115/ipack2007-33250","pdf_url":null,"source":{"id":"https://openalex.org/S7407088218","display_name":"ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ASME 2007 InterPACK Conference, Volume 1","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2743601671","https://openalex.org/W2742590347","https://openalex.org/W2118697467","https://openalex.org/W2353724102","https://openalex.org/W2320302481","https://openalex.org/W2168781664","https://openalex.org/W2675462177","https://openalex.org/W2048509077","https://openalex.org/W2398855871","https://openalex.org/W3094076754"],"abstract_inverted_index":{"The":[0],"changeover":[1],"from":[2,100],"eutectic":[3],"Sn-Pb":[4],"solder":[5,8,35],"to":[6,26,69,102,115],"lead-free":[7,34],"(Sn-Ag-Cu)":[9],"has":[10],"been":[11],"driven":[12],"by":[13,174],"environmental":[14],"concerns":[15],"in":[16,24,67,122,127],"the":[17,28,50,56,71,74,79,94,97,118,123,140,144,150,154,167,175],"last":[18],"few":[19],"years.":[20],"In":[21],"this":[22],"study,":[23],"order":[25,68],"obtain":[27],"low-cycle":[29,80,119],"fatigue":[30,40,81,88,98,120,168],"characteristic":[31],"of":[32,96,153,165],"Sn-Ag-Cu":[33],"joints,":[36],"an":[37],"isothermal":[38],"mechanical":[39],"test":[41],"with":[42,87],"a":[43,84],"large":[44,128,155],"strain":[45,76],"range,":[46],"which":[47],"can":[48,171],"clarify":[49],"crack":[51,133,137,145,169],"generation":[52],"process":[53],"and":[54,78,149,163],"shorten":[55],"examination":[57],"time,":[58],"was":[59,64,147,157],"carried":[60],"out.":[61],"FEM":[62],"analysis":[63],"also":[65,136],"performed":[66],"evaluate":[70,117],"relationship":[72],"between":[73],"inelastic":[75],"range":[77],"life.":[82,142],"As":[83],"result,":[85],"compared":[86],"life":[89,121],"longer":[90],"than":[91],"1000":[92],"cycles,":[93],"scatter":[95],"cycles":[99,105],"100":[101],"several":[103],"hundred":[104],"becomes":[106],"larger.":[107],"So,":[108],"it":[109,112],"seems":[110],"that":[111],"is":[113],"necessary":[114],"carefully":[116],"reliability":[124,164],"evaluation.":[125],"Moreover,":[126],"chip":[129,156],"components,":[130],"not":[131],"only":[132],"initiation,":[134],"but":[135],"propagation,":[138],"affects":[139],"failure":[141,151],"Thus,":[143],"path":[146],"simulated":[148],"cycle":[152],"evaluated":[158,173],"based":[159],"on":[160],"Miner\u2019s":[161],"rule,":[162],"including":[166],"propagation":[170],"be":[172],"analytical":[176],"approach.":[177]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2026-10-05T09:50:58.205359","created_date":"2016-06-24T00:00:00"}