{"id":"https://openalex.org/W1979979481","doi":"https://doi.org/10.1109/irps.1979.362890","title":"Diagnosis of Hybrid Microelectronics using Transmission Acoustic Microscopy","display_name":"Diagnosis of Hybrid Microelectronics using Transmission Acoustic Microscopy","publication_year":1979,"publication_date":"1979-04-01","ids":{"openalex":"https://openalex.org/W1979979481","doi":"https://doi.org/10.1109/irps.1979.362890","mag":"1979979481"},"language":"en","primary_location":{"id":"doi:10.1109/irps.1979.362890","doi":"https://doi.org/10.1109/irps.1979.362890","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.1979.362890","pdf_url":null,"source":{"id":"https://openalex.org/S4210238090","display_name":"IEEE International Reliability Physics Symposium proceedings","issn_l":"0735-0791","issn":["0735-0791","1541-7026","1938-1891"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"17th International Reliability Physics Symposium","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103507435","display_name":"Chen S. Tsai","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I74973139","display_name":"Carnegie Mellon University","ror":"https://ror.org/05x2bcf33","country_code":"US","type":"education","lineage":["https://openalex.org/I74973139"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chen S. Tsai","raw_affiliation_strings":["Center for the Joining of Materials Department of Electrical Engineering, Carnegie Mellon University, Pittsburgh, PA, USA","Center for the Joining of Materials and Department of Electrical Engineering, Carnegie-Mellon University, Pittsburgh, Pa. 15213"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for the Joining of Materials Department of Electrical Engineering, Carnegie Mellon University, Pittsburgh, PA, USA","institution_ids":["https://openalex.org/I74973139"]},{"raw_affiliation_string":"Center for the Joining of Materials and Department of Electrical Engineering, Carnegie-Mellon University, Pittsburgh, Pa. 15213","institution_ids":["https://openalex.org/I74973139"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072108551","display_name":"Chin C. Lee","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I74973139","display_name":"Carnegie Mellon University","ror":"https://ror.org/05x2bcf33","country_code":"US","type":"education","lineage":["https://openalex.org/I74973139"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chin C. Lee","raw_affiliation_strings":["Center for the Joining of Materials Department of Electrical Engineering, Carnegie Mellon University, Pittsburgh, PA, USA","Center for the Joining of Materials and Department of Electrical Engineering, Carnegie-Mellon University, Pittsburgh, Pa. 15213"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for the Joining of Materials Department of Electrical Engineering, Carnegie Mellon University, Pittsburgh, PA, USA","institution_ids":["https://openalex.org/I74973139"]},{"raw_affiliation_string":"Center for the Joining of Materials and Department of Electrical Engineering, Carnegie-Mellon University, Pittsburgh, Pa. 15213","institution_ids":["https://openalex.org/I74973139"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5041359860","display_name":"Jung K. Wang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I74973139","display_name":"Carnegie Mellon University","ror":"https://ror.org/05x2bcf33","country_code":"US","type":"education","lineage":["https://openalex.org/I74973139"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jung K. Wang","raw_affiliation_strings":["Center for the Joining of Materials Department of Electrical Engineering, Carnegie Mellon University, Pittsburgh, PA, USA","Center for the Joining of Materials and Department of Electrical Engineering, Carnegie-Mellon University, Pittsburgh, Pa. 15213"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for the Joining of Materials Department of Electrical Engineering, Carnegie Mellon University, Pittsburgh, PA, USA","institution_ids":["https://openalex.org/I74973139"]},{"raw_affiliation_string":"Center for the Joining of Materials and Department of Electrical Engineering, Carnegie-Mellon University, Pittsburgh, Pa. 15213","institution_ids":["https://openalex.org/I74973139"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I74973139"],"apc_list":null,"apc_paid":null,"fwci":1.9583,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.80201907,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"178","last_page":"182"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.8842999935150146,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.8842999935150146,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10662","display_name":"Ultrasonics and Acoustic Wave Propagation","score":0.1039000004529953,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11856","display_name":"Thermography and Photoacoustic Techniques","score":0.0017999999690800905,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/hybrid-microelectronics","display_name":"hybrid microelectronics","score":0.9639999866485596},{"id":"https://openalex.org/keywords/non-destructive-diagnostics","display_name":"non-destructive diagnostics","score":0.8230000138282776},{"id":"https://openalex.org/keywords/defect-imaging","display_name":"defect imaging","score":0.6420000195503235},{"id":"https://openalex.org/keywords/thin-film-circuits","display_name":"thin-film circuits","score":0.8629999756813049},{"id":"https://openalex.org/keywords/thick-film-circuits","display_name":"thick film circuits","score":0.9580000042915344},{"id":"https://openalex.org/keywords/thick-film-resistors","display_name":"thick film resistors","score":0.8539999723434448},{"id":"https://openalex.org/keywords/defect-localization","display_name":"defect localization","score":0.6759999990463257},{"id":"https://openalex.org/keywords/failure-analysis","display_name":"failure analysis","score":0.9589999914169312},{"id":"https://openalex.org/keywords/quality-control","display_name":"quality control","score":0.9610000252723694}],"concepts":[{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.8827879428863525},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7414071559906006},{"id":"https://openalex.org/C2781117724","wikidata":"https://www.wikidata.org/wiki/Q4674694","display_name":"Acoustic microscopy","level":3,"score":0.7390188574790955},{"id":"https://openalex.org/C67649825","wikidata":"https://www.wikidata.org/wiki/Q196538","display_name":"Microscope","level":2,"score":0.5890606641769409},{"id":"https://openalex.org/C184652730","wikidata":"https://www.wikidata.org/wiki/Q2357982","display_name":"Attenuation","level":2,"score":0.5487707853317261},{"id":"https://openalex.org/C137488568","wikidata":"https://www.wikidata.org/wiki/Q5321","display_name":"Resistor","level":3,"score":0.5481883883476257},{"id":"https://openalex.org/C147080431","wikidata":"https://www.wikidata.org/wiki/Q1074953","display_name":"Microscopy","level":2,"score":0.529689371585846},{"id":"https://openalex.org/C77017923","wikidata":"https://www.wikidata.org/wiki/Q912313","display_name":"Optical microscope","level":3,"score":0.5287144780158997},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.4943416118621826},{"id":"https://openalex.org/C52192207","wikidata":"https://www.wikidata.org/wiki/Q5322","display_name":"Capacitor","level":3,"score":0.4713315963745117},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4505317211151123},{"id":"https://openalex.org/C76198728","wikidata":"https://www.wikidata.org/wiki/Q3629144","display_name":"Acoustic attenuation","level":3,"score":0.4184873402118683},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.41230806708335876},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1790490746498108},{"id":"https://openalex.org/C26771246","wikidata":"https://www.wikidata.org/wiki/Q321095","display_name":"Scanning electron microscope","level":2,"score":0.13823431730270386},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.11164745688438416},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.09634649753570557},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.07661506533622742},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps.1979.362890","doi":"https://doi.org/10.1109/irps.1979.362890","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.1979.362890","pdf_url":null,"source":{"id":"https://openalex.org/S4210238090","display_name":"IEEE International Reliability Physics Symposium proceedings","issn_l":"0735-0791","issn":["0735-0791","1541-7026","1938-1891"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"17th International Reliability Physics Symposium","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W1502488066","https://openalex.org/W7098970442","https://openalex.org/W2072238113","https://openalex.org/W1555617344","https://openalex.org/W151399922","https://openalex.org/W2753248120","https://openalex.org/W2109531907","https://openalex.org/W1985511735","https://openalex.org/W2013649711","https://openalex.org/W3087825682"],"abstract_inverted_index":{"This":[0],"paper":[1],"reports":[2],"further":[3],"progress":[4],"we":[5],"have":[6],"made":[7],"most":[8],"recently":[9],"on":[10],"nondestructive":[11],"diagnosis":[12],"of":[13,27,55,70,96,138],"hybrid":[14,139],"microelectronic":[15],"components":[16],"using":[17],"a":[18,52,67,79,93,126],"150":[19],"MHz":[20],"transmission":[21,122],"scanning":[22],"acoustic":[23,48,60,87,123],"microscope.":[24],"Acoustic":[25],"imaging":[26],"defects":[28],"in":[29,74,85],"production-line":[30],"thin-film":[31],"circuits,":[32,34],"thick-film":[33,80],"and":[35,65,115,129,135],"multilayer":[36,76],"chip":[37],"capacitors":[38],"was":[39,72,89],"carried":[40],"out.":[41],"Contrary":[42],"to":[43,91,107],"the":[44,47,75,83,86,97,110,116],"optical":[45],"micrographs,":[46],"micrographs":[49],"recorded":[50],"show":[51],"high":[53,68],"degree":[54,69],"contrast.":[56],"A":[57,100],"large":[58],"differential":[59],"attenuation":[61],"(typically":[62],"30":[63],"db)":[64],"thus":[66],"nonuniformity":[71],"observed":[73],"structures.":[77],"For":[78],"resistor":[81],"circuit":[82],"contrast":[84],"micrograph":[88],"found":[90],"be":[92],"sensitive":[94],"function":[95],"resistance":[98],"value.":[99],"simple":[101],"method":[102],"has":[103],"also":[104],"been":[105],"established":[106],"determine":[108],"both":[109],"defect":[111,117],"location":[112],"(in":[113],"depth)":[114],"type.":[118],"We":[119],"conclude":[120],"that":[121],"microscopy":[124],"is":[125],"highly":[127],"useful":[128],"unique":[130],"technique":[131],"for":[132],"failure":[133],"analysis":[134],"quality":[136],"control":[137],"microelectronics.":[140]},"counts_by_year":[{"year":2019,"cited_by_count":1}],"updated_date":"2026-10-06T10:28:23.643775","created_date":"2016-06-24T00:00:00"}