{"id":"https://openalex.org/W1978483775","doi":"https://doi.org/10.1063/1.360717","title":"Effect of internal stresses and microstructure of sputtered TiN films on solid-phase reactions with Al-Si-Cu alloy films","display_name":"Effect of internal stresses and microstructure of sputtered TiN films on solid-phase reactions with Al-Si-Cu alloy films","publication_year":1995,"publication_date":"1995-08-15","ids":{"openalex":"https://openalex.org/W1978483775","doi":"https://doi.org/10.1063/1.360717","mag":"1978483775"},"language":"en","primary_location":{"id":"doi:10.1063/1.360717","doi":"https://doi.org/10.1063/1.360717","is_oa":false,"landing_page_url":"https://doi.org/10.1063/1.360717","pdf_url":null,"source":{"id":"https://openalex.org/S187991544","display_name":"Journal of Applied Physics","issn_l":"0021-8979","issn":["0021-8979","1089-7550","1520-8850"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["anvur-scientific","cwts-core","dongbi-d","jufo-1","norway-1","poland-100","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320257","host_organization_name":"American Institute of Physics","host_organization_lineage":["https://openalex.org/P4310320257"],"host_organization_lineage_names":["American Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Applied Physics","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"T. Yamauchi","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"T. Yamauchi","raw_affiliation_strings":["Production Engineering R&D Department, Nippondenso Co. Ltd., 1-1 Showa-cho, Kariya-shi, Aichi 448, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Production Engineering R&D Department, Nippondenso Co. Ltd., 1-1 Showa-cho, Kariya-shi, Aichi 448, Japan","institution_ids":[]}]},{"author_position":"middle","author":{"id":null,"display_name":"T. Yamaoka","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"T. Yamaoka","raw_affiliation_strings":["Production Engineering R&D Department, Nippondenso Co. Ltd., 1-1 Showa-cho, Kariya-shi, Aichi 448, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Production Engineering R&D Department, Nippondenso Co. Ltd., 1-1 Showa-cho, Kariya-shi, Aichi 448, Japan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064714147","display_name":"Kisaragi Yashiro","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"K. Yashiro","raw_affiliation_strings":["Engineering Computing Department, Nippondenso Co. Ltd., 1-1 Showa-cho, Kariya-shi, Aichi 448, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Engineering Computing Department, Nippondenso Co. Ltd., 1-1 Showa-cho, Kariya-shi, Aichi 448, Japan","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058398304","display_name":"Susumu Sobue","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"S. Sobue","raw_affiliation_strings":["Research Laboratories, Nippondenso Co. Ltd., Komenoki, Nisshin-cho, Aichi 470-01, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Research Laboratories, Nippondenso Co. Ltd., Komenoki, Nisshin-cho, Aichi 470-01, Japan","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":3500,"currency":"USD","value_usd":3500},"apc_paid":null,"fwci":2.6362,"has_fulltext":false,"cited_by_count":12,"citation_normalized_percentile":{"value":0.86903114,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":"78","issue":"4","first_page":"2385","last_page":"2391"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","score":0.49149999022483826,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","score":0.49149999022483826,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.30250000953674316,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11853","display_name":"Semiconductor materials and interfaces","score":0.13590000569820404,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/tin-thin-films","display_name":"TiN thin films","score":0.8629999756813049},{"id":"https://openalex.org/keywords/al-si-cu-alloy","display_name":"Al-Si-Cu alloy","score":0.8510000109672546},{"id":"https://openalex.org/keywords/solid-phase-reaction","display_name":"solid-phase reaction","score":0.8510000109672546},{"id":"https://openalex.org/keywords/interfacial-reaction","display_name":"interfacial reaction","score":0.6179999709129333},{"id":"https://openalex.org/keywords/internal-stress","display_name":"internal stress","score":0.777999997138977},{"id":"https://openalex.org/keywords/compressive-stress","display_name":"compressive stress","score":0.9089999794960022},{"id":"https://openalex.org/keywords/microstructure","display_name":"microstructure","score":0.6840000152587891},{"id":"https://openalex.org/keywords/tial3","display_name":"TiAl3","score":0.8050000071525574},{"id":"https://openalex.org/keywords/ti-diffusion","display_name":"Ti diffusion","score":0.492000013589859},{"id":"https://openalex.org/keywords/phase-separation","display_name":"phase separation","score":0.800000011920929},{"id":"https://openalex.org/keywords/monte-carlo-simulation","display_name":"Monte Carlo simulation","score":0.6710000038146973},{"id":"https://openalex.org/keywords/annealing","display_name":"annealing","score":0.35100001096725464}],"concepts":[{"id":"https://openalex.org/C525849907","wikidata":"https://www.wikidata.org/wiki/Q1096","display_name":"Tin","level":2,"score":0.8475977182388306},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.794496476650238},{"id":"https://openalex.org/C56052488","wikidata":"https://www.wikidata.org/wiki/Q103382","display_name":"Amorphous solid","level":2,"score":0.6617946028709412},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.594207763671875},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.5452895164489746},{"id":"https://openalex.org/C2777855556","wikidata":"https://www.wikidata.org/wiki/Q4339544","display_name":"Annealing (glass)","level":2,"score":0.5384417176246643},{"id":"https://openalex.org/C137637335","wikidata":"https://www.wikidata.org/wiki/Q899604","display_name":"Crystallite","level":2,"score":0.4794665575027466},{"id":"https://openalex.org/C25442681","wikidata":"https://www.wikidata.org/wiki/Q28087","display_name":"Auger electron spectroscopy","level":2,"score":0.44797483086586},{"id":"https://openalex.org/C77557913","wikidata":"https://www.wikidata.org/wiki/Q864822","display_name":"Electron diffraction","level":3,"score":0.44378191232681274},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.4413430988788605},{"id":"https://openalex.org/C22423302","wikidata":"https://www.wikidata.org/wiki/Q898444","display_name":"Sputtering","level":3,"score":0.4281643033027649},{"id":"https://openalex.org/C44280652","wikidata":"https://www.wikidata.org/wiki/Q104837","display_name":"Phase (matter)","level":2,"score":0.41319572925567627},{"id":"https://openalex.org/C8010536","wikidata":"https://www.wikidata.org/wiki/Q160398","display_name":"Crystallography","level":1,"score":0.36472606658935547},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.36449146270751953},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.2862405776977539},{"id":"https://openalex.org/C207114421","wikidata":"https://www.wikidata.org/wiki/Q133900","display_name":"Diffraction","level":2,"score":0.1856534779071808},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.13994276523590088},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.09990239143371582},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.08898916840553284},{"id":"https://openalex.org/C185544564","wikidata":"https://www.wikidata.org/wiki/Q81197","display_name":"Nuclear physics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1063/1.360717","doi":"https://doi.org/10.1063/1.360717","is_oa":false,"landing_page_url":"https://doi.org/10.1063/1.360717","pdf_url":null,"source":{"id":"https://openalex.org/S187991544","display_name":"Journal of Applied Physics","issn_l":"0021-8979","issn":["0021-8979","1089-7550","1520-8850"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["anvur-scientific","cwts-core","dongbi-d","jufo-1","norway-1","poland-100","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320257","host_organization_name":"American Institute of Physics","host_organization_lineage":["https://openalex.org/P4310320257"],"host_organization_lineage_names":["American Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Applied Physics","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":27,"referenced_works":["https://openalex.org/W604127426","https://openalex.org/W1485283179","https://openalex.org/W1969378772","https://openalex.org/W1975060089","https://openalex.org/W1978628611","https://openalex.org/W1999781894","https://openalex.org/W2000482538","https://openalex.org/W2000937883","https://openalex.org/W2001018259","https://openalex.org/W2002574445","https://openalex.org/W2009676411","https://openalex.org/W2016420865","https://openalex.org/W2020393520","https://openalex.org/W2035950790","https://openalex.org/W2065146104","https://openalex.org/W2065637803","https://openalex.org/W2067510218","https://openalex.org/W2074642450","https://openalex.org/W2075398147","https://openalex.org/W2078449473","https://openalex.org/W2081811986","https://openalex.org/W2082109824","https://openalex.org/W2091342148","https://openalex.org/W2091545311","https://openalex.org/W2099511917","https://openalex.org/W2148743001","https://openalex.org/W2151853420"],"related_works":["https://openalex.org/W2075610245","https://openalex.org/W2143842922","https://openalex.org/W1969321788","https://openalex.org/W1981395000","https://openalex.org/W360070510","https://openalex.org/W2083505647","https://openalex.org/W2035049093","https://openalex.org/W2017201182","https://openalex.org/W2088015761","https://openalex.org/W2062403332"],"abstract_inverted_index":{"Solid-phase":[0],"reactions":[1,210],"at":[2,43,65,71,146,211],"the":[3,28,32,36,66,72,81,85,109,116,120,140,174,188,195,198,208,212,217,220,229],"interface":[4,68],"between":[5],"Al-Si-Cu":[6],"and":[7,24,129,184,215],"reactively":[8],"sputtered":[9],"TiN":[10,37,122,141,189,199],"thin":[11,38,48],"films":[12,200],"have":[13],"been":[14],"investigated":[15],"by":[16,69],"cross-sectional":[17],"transmission":[18],"electron":[19,22],"microscopy,":[20],"Auger":[21],"spectroscopy,":[23],"x-ray":[25],"diffraction.":[26],"In":[27],"case":[29,86],"in":[30,35,84,97,119,187,225],"which":[31],"internal":[33,117,156,178],"stress":[34,91,118,179],"film":[39,123,142],"is":[40,61,96,192],"extremely":[41],"compressive":[42,90],"209":[44],"MPa,":[45,94],"a":[46,88,98,103,125,137,160,168,202],"very":[47],"amorphous":[49,110],"Al-Ti-Si":[50],"ternary":[51],"compound":[52],"layer":[53,106,112],"(a-Al-Ti-Si)":[54],"containing":[55],"microcrystallites,":[56],"about":[57,181],"4":[58],"nm":[59],"thick,":[60],"found":[62],"to":[63,101,165,173],"form":[64,102],"Al-Si-Cu/TiN":[67,213],"annealing":[70],"temperature":[73,131],"of":[74,87,92,115,127,139,155,176,197,204,219,222,228],"450":[75],"\u00b0C":[76],"for":[77],"30":[78],"min.":[79],"On":[80],"other":[82],"hand,":[83],"minimally":[89],"21":[93],"it":[95],"marked":[99],"contrast":[100],"polycrystalline":[104],"TiAl3":[105],"(c-TiAl3)":[107],"on":[108,159],"intermediate":[111],"ununiformly.":[113],"Behavior":[114],"latter":[121],"as":[124],"function":[126],"heating":[128],"cooling":[130],"shows":[132],"nonlinear":[133],"characteristics,":[134],"indicating":[135],"that":[136,167,194,216],"rearrangement":[138,196],"actively":[143],"occurs":[144],"even":[145],"low":[147,177],"temperatures":[148],"below":[149],"300":[150],"\u00b0C.":[151],"Monte":[152],"Carlo":[153],"simulations":[154],"microstructures":[157],"based":[158],"ballistic":[161],"aggregation":[162],"model":[163],"suggest":[164],"us":[166],"short":[169],"migration":[170],"length":[171],"corresponding":[172],"condition":[175],"brings":[180],"numerous":[182],"vacancies":[183],"disordered":[185],"regions":[186],"films.":[190],"It":[191],"considered":[193],"with":[201],"diffusion":[203],"Ti":[205],"atoms":[206],"governs":[207],"solid-phase":[209],"interfaces":[214],"formation":[218],"bilayer":[221],"c-TiAl3/a-Al-Ti-Si":[223],"originates":[224],"phase":[226],"separation":[227],"resultant":[230],"Al-Ti":[231],"mixing":[232],"layer.":[233]},"counts_by_year":[{"year":2018,"cited_by_count":1}],"updated_date":"2026-10-01T08:54:57.152042","created_date":"2016-06-24T00:00:00"}