{"id":"https://openalex.org/W1978327014","doi":"https://doi.org/10.1117/12.772890","title":"EUV source development at Energetiq","display_name":"EUV source development at Energetiq","publication_year":2008,"publication_date":"2008-03-06","ids":{"openalex":"https://openalex.org/W1978327014","doi":"https://doi.org/10.1117/12.772890","mag":"1978327014"},"language":"en","primary_location":{"id":"doi:10.1117/12.772890","doi":"https://doi.org/10.1117/12.772890","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.772890","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5008272985","display_name":"Paul A. Blackborow","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210129379","display_name":"Energetiq Technology (United States)","ror":"https://ror.org/04b29ff96","country_code":"US","type":"company","lineage":["https://openalex.org/I4210129379"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Paul A. Blackborow","raw_affiliation_strings":["Energetiq Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Energetiq Technology, Inc. (United States)","institution_ids":["https://openalex.org/I4210129379"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110352743","display_name":"Matthew J. Partlow","orcid":"https://orcid.org/0000-0002-2635-649X","observed_orcids":["https://orcid.org/0000-0002-2635-649X"]},"institutions":[{"id":"https://openalex.org/I4210129379","display_name":"Energetiq Technology (United States)","ror":"https://ror.org/04b29ff96","country_code":"US","type":"company","lineage":["https://openalex.org/I4210129379"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Matthew J. Partlow","raw_affiliation_strings":["Energetiq Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Energetiq Technology, Inc. (United States)","institution_ids":["https://openalex.org/I4210129379"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071562591","display_name":"Stephen F. Horne","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210129379","display_name":"Energetiq Technology (United States)","ror":"https://ror.org/04b29ff96","country_code":"US","type":"company","lineage":["https://openalex.org/I4210129379"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Stephen F. Horne","raw_affiliation_strings":["Energetiq Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Energetiq Technology, Inc. (United States)","institution_ids":["https://openalex.org/I4210129379"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048986527","display_name":"Matthew M. Besen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210129379","display_name":"Energetiq Technology (United States)","ror":"https://ror.org/04b29ff96","country_code":"US","type":"company","lineage":["https://openalex.org/I4210129379"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Matthew M. Besen","raw_affiliation_strings":["Energetiq Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Energetiq Technology, Inc. (United States)","institution_ids":["https://openalex.org/I4210129379"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113654039","display_name":"Donald K. Smith","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210129379","display_name":"Energetiq Technology (United States)","ror":"https://ror.org/04b29ff96","country_code":"US","type":"company","lineage":["https://openalex.org/I4210129379"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Donald K. Smith","raw_affiliation_strings":["Energetiq Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Energetiq Technology, Inc. (United States)","institution_ids":["https://openalex.org/I4210129379"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111799707","display_name":"Deborah S. Gustafson","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210129379","display_name":"Energetiq Technology (United States)","ror":"https://ror.org/04b29ff96","country_code":"US","type":"company","lineage":["https://openalex.org/I4210129379"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Deborah S. Gustafson","raw_affiliation_strings":["Energetiq Technology, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Energetiq Technology, Inc. (United States)","institution_ids":["https://openalex.org/I4210129379"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210129379"],"apc_list":null,"apc_paid":null,"fwci":2.3694,"has_fulltext":false,"cited_by_count":11,"citation_normalized_percentile":{"value":0.86758945,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":96},"biblio":{"volume":"6921","issue":null,"first_page":"692121","last_page":"692121"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9384999871253967,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9384999871253967,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11920","display_name":"Pulsed Power Technology Applications","score":0.014800000004470348,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10781","display_name":"Low-Pressure Plasma Processing and Diagnostics","score":0.009200000204145908,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/extreme-ultraviolet-sources","display_name":"extreme ultraviolet sources","score":0.871999979019165},{"id":"https://openalex.org/keywords/xenon-plasma","display_name":"xenon plasma","score":0.8009999990463257},{"id":"https://openalex.org/keywords/euv-lithography","display_name":"EUV lithography","score":0.8289999961853027},{"id":"https://openalex.org/keywords/resist-exposure","display_name":"resist exposure","score":0.6140000224113464},{"id":"https://openalex.org/keywords/mirror-test","display_name":"mirror test","score":0.9079999923706055},{"id":"https://openalex.org/keywords/wafer-inspection","display_name":"wafer inspection","score":0.9729999899864197},{"id":"https://openalex.org/keywords/beamline-design","display_name":"beamline design","score":0.8730000257492065},{"id":"https://openalex.org/keywords/debris-mitigation","display_name":"debris mitigation","score":0.9150000214576721}],"concepts":[{"id":"https://openalex.org/C162996421","wikidata":"https://www.wikidata.org/wiki/Q371965","display_name":"Extreme ultraviolet lithography","level":2,"score":0.8885489106178284},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5922026038169861},{"id":"https://openalex.org/C146024833","wikidata":"https://www.wikidata.org/wiki/Q1385457","display_name":"Extreme ultraviolet","level":3,"score":0.5440454483032227},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.4029965400695801},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1587839126586914},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.14860039949417114}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.772890","doi":"https://doi.org/10.1117/12.772890","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.772890","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W643454364","https://openalex.org/W1524127711","https://openalex.org/W1974187908","https://openalex.org/W1976399667","https://openalex.org/W2064952270","https://openalex.org/W2064956730","https://openalex.org/W2072056648","https://openalex.org/W2081368186","https://openalex.org/W2091566144","https://openalex.org/W2094249583","https://openalex.org/W2146604261","https://openalex.org/W3005135284","https://openalex.org/W3034511655"],"related_works":["https://openalex.org/W2005016216","https://openalex.org/W2067435684","https://openalex.org/W4386863733","https://openalex.org/W4404741991","https://openalex.org/W2087922105","https://openalex.org/W2094249583","https://openalex.org/W2484208324","https://openalex.org/W2044178793","https://openalex.org/W3092438189","https://openalex.org/W2059480285"],"abstract_inverted_index":{"As":[0],"industry":[1],"advances":[2],"towards":[3],"the":[4,34,39,114,126,179],"insertion":[5],"of":[6,22,33,42,59,119,128,147,181],"EUVL":[7],"technology,":[8],"researchers":[9],"and":[10,67,88,112,133,167],"manufacturers":[11],"armed":[12],"with":[13],"alpha":[14],"EUV":[15,182],"light":[16,35,83],"sources":[17,36,95],"invent":[18],"an":[19],"expanding":[20],"array":[21],"potential":[23],"applications":[24],"utilizing":[25],"these":[26],"sources.":[27],"This":[28],"in":[29,45,97,99],"turn":[30],"drives":[31],"development":[32,105],"to":[37,110,157],"fulfill":[38],"large":[40],"field":[41,86],"specific":[43],"needs":[44],"resist":[46],"exposure,":[47],"mirror":[48],"testing,":[49],"wafer":[50],"inspection,":[51],"etc.,":[52],"which":[53],"call":[54],"for":[55,116],"a":[56,72,104,117,142],"greater":[57],"variety":[58,118],"source":[60,65,130],"parameters,":[61],"including":[62],"output":[63,145],"power,":[64],"size,":[66],"stability.":[68],"The":[69,151],"EQ-10":[70,115],"is":[71,107,169],"commercially":[73],"available,":[74],"medium-power":[75],"(10":[76],"W/2\u03c0,":[77],"13.5nm":[78],"\u00b11%,":[79],"Xenon)":[80],"electrodeless":[81],"Z-pinch":[82],"source.":[84],"Significant":[85],"experience":[87],"customer":[89,159],"feedback":[90],"has":[91],"been":[92],"accumulated":[93],"from":[94,187],"already":[96],"operation":[98],"multiple":[100],"locations.":[101],"In":[102],"response,":[103],"program":[106,163,189],"under":[108],"way":[109],"re-engineer":[111],"optimize":[113],"applications.":[120,160],"Data":[121],"will":[122,190],"be":[123,155,191],"presented":[124],"on":[125,136,164,173],"effect":[127],"varying":[129],"geometry,":[131],"frequency,":[132],"input":[134],"power":[135,146,183],"pinch":[137],"performance.":[138],"We":[139],"have":[140],"observed":[141],"sustained":[143],"integrated":[144],"over":[148],"15":[149],"Watts.":[150],"plasma":[152],"size":[153],"can":[154],"varied":[156],"suit":[158],"A":[161],"related":[162],"beamline":[165],"design":[166],"optimization":[168],"also":[170,177],"underway,":[171],"focused":[172],"debris":[174],"mitigation":[175],"while":[176],"maintaining":[178],"efficiency":[180],"delivery.":[184],"Initial":[185],"results":[186],"this":[188],"summarized.":[192]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2024,"cited_by_count":3},{"year":2012,"cited_by_count":2}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2016-06-24T00:00:00"}