{"id":"https://openalex.org/W1971028528","doi":"https://doi.org/10.1108/09540919910254930","title":"Solder joint reliability of plastic ball grid array packages","display_name":"Solder joint reliability of plastic ball grid array packages","publication_year":1999,"publication_date":"1999-04-01","ids":{"openalex":"https://openalex.org/W1971028528","doi":"https://doi.org/10.1108/09540919910254930","mag":"1971028528"},"language":"en","primary_location":{"id":"doi:10.1108/09540919910254930","doi":"https://doi.org/10.1108/09540919910254930","is_oa":false,"landing_page_url":"https://doi.org/10.1108/09540919910254930","pdf_url":null,"source":{"id":"https://openalex.org/S201145208","display_name":"Soldering and Surface Mount Technology","issn_l":"0954-0911","issn":["0954-0911","1758-6836"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310319811","host_organization_name":"Emerald Publishing Limited","host_organization_lineage":["https://openalex.org/P4310319811"],"host_organization_lineage_names":["Emerald Publishing Limited"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Soldering & Surface Mount Technology","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Chong Hua Zhong","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405256821","display_name":"Advanced Micro Devices (Singapore)","ror":"https://ror.org/04jt1bz85","country_code":"SG","type":"company","lineage":["https://openalex.org/I4210137977","https://openalex.org/I4405256821"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Chong Hua Zhong","raw_affiliation_strings":["Advanced Micro Devices (Singapore) Pte Ltd, Singapore","Adv. Micro Devices (Singapore) Pte Ltd., Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Micro Devices (Singapore) Pte Ltd, Singapore","institution_ids":["https://openalex.org/I4405256821"]},{"raw_affiliation_string":"Adv. Micro Devices (Singapore) Pte Ltd., Singapore","institution_ids":["https://openalex.org/I4405256821"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5102723402","display_name":"Sung Yi","orcid":"https://orcid.org/0000-0003-1132-509X","observed_orcids":["https://orcid.org/0000-0003-1132-509X"]},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Sung Yi","raw_affiliation_strings":["School of Mechanical and Production Engineering, Nanyang Technological University, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical and Production Engineering, Nanyang Technological University, Singapore","institution_ids":["https://openalex.org/I172675005"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":7.6955,"has_fulltext":false,"cited_by_count":61,"citation_normalized_percentile":{"value":0.97663862,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":97},"biblio":{"volume":"11","issue":"1","first_page":"44","last_page":"48"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/plastic-ball-grid-array","display_name":"plastic ball grid array","score":0.9070000052452087},{"id":"https://openalex.org/keywords/solder-joint-reliability","display_name":"solder joint reliability","score":0.9700000286102295},{"id":"https://openalex.org/keywords/intermetallic-layer-thickness","display_name":"intermetallic compound thickness","score":0.9610000252723694},{"id":"https://openalex.org/keywords/thermal-cycling","display_name":"thermal cycling","score":0.8730000257492065},{"id":"https://openalex.org/keywords/shear-strength","display_name":"shear strength","score":0.8370000123977661},{"id":"https://openalex.org/keywords/electroless-nickel","display_name":"electroless nickel","score":0.7649999856948853},{"id":"https://openalex.org/keywords/gold-plating","display_name":"gold plating","score":0.5699999928474426},{"id":"https://openalex.org/keywords/fractography","display_name":"fractography","score":0.5139999985694885}],"concepts":[{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.9169377684593201},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.8982580900192261},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8547802567481995},{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.8050127029418945},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.6108171343803406},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.572501540184021},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.5254522562026978},{"id":"https://openalex.org/C136478896","wikidata":"https://www.wikidata.org/wiki/Q898288","display_name":"Brittleness","level":2,"score":0.504684567451477},{"id":"https://openalex.org/C191281628","wikidata":"https://www.wikidata.org/wiki/Q977971","display_name":"Solder paste","level":3,"score":0.4917652904987335},{"id":"https://openalex.org/C127893833","wikidata":"https://www.wikidata.org/wiki/Q7492185","display_name":"Shear strength (soil)","level":3,"score":0.4495936930179596},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.4285668730735779},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.41094905138015747},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.11660370230674744},{"id":"https://openalex.org/C159390177","wikidata":"https://www.wikidata.org/wiki/Q9161265","display_name":"Soil science","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C39432304","wikidata":"https://www.wikidata.org/wiki/Q188847","display_name":"Environmental science","level":0,"score":0.0},{"id":"https://openalex.org/C159750122","wikidata":"https://www.wikidata.org/wiki/Q96621023","display_name":"Soil water","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1108/09540919910254930","doi":"https://doi.org/10.1108/09540919910254930","is_oa":false,"landing_page_url":"https://doi.org/10.1108/09540919910254930","pdf_url":null,"source":{"id":"https://openalex.org/S201145208","display_name":"Soldering and Surface Mount Technology","issn_l":"0954-0911","issn":["0954-0911","1758-6836"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310319811","host_organization_name":"Emerald Publishing Limited","host_organization_lineage":["https://openalex.org/P4310319811"],"host_organization_lineage_names":["Emerald Publishing Limited"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Soldering & Surface Mount Technology","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W567677580","https://openalex.org/W2101602749","https://openalex.org/W2102548295","https://openalex.org/W2141355301","https://openalex.org/W2151416934","https://openalex.org/W2159080175","https://openalex.org/W2166738726","https://openalex.org/W2183519648","https://openalex.org/W4213283506","https://openalex.org/W6829516683"],"related_works":["https://openalex.org/W3115840897","https://openalex.org/W2021730152","https://openalex.org/W2169295691","https://openalex.org/W2055207310","https://openalex.org/W2102812381","https://openalex.org/W1914062284","https://openalex.org/W2037452192","https://openalex.org/W1981541364","https://openalex.org/W2091703944","https://openalex.org/W7128495398"],"abstract_inverted_index":{"Presents":[0],"the":[1,7,22,33,87,94,109,115,118,149,155,173],"results":[2],"of":[3,6,9,25,32,35,45,93,117,125,151],"a":[4,41,73,166],"study":[5,31],"effects":[8],"solder":[10,28,36,50,88,126,156],"ball":[11,61,143],"pad":[12],"metallurgy,":[13],"intermetallic":[14,46,78],"compound":[15,47,79],"(IMC)":[16],"thickness":[17,92,177],"and":[18,52,63,72,83,131,137,161,175],"thermal":[19],"cycling":[20],"on":[21],"shear":[23,110,144],"strengths":[24],"PBGA":[26],"package":[27],"balls.":[29,89],"The":[30,65,90,122,142],"microstructures":[34],"balls":[37,51,127,157],"revealed":[38],"that":[39],"only":[40,165,179],"very":[42],"thin":[43,162],"layer":[44,68,169],"existed":[48],"between":[49],"Ni":[53,55,130,160],"or":[54],"alloy":[56],"barrier":[57],"layers":[58,96,134],"immediately":[59],"after":[60,101,182],"placement":[62],"reflow.":[64],"protective":[66],"Au":[67,133,163],"was":[69,80,97,140,170,178],"dissolved":[70],"completely":[71],"needle":[74],"like":[75],"AuSn":[76],"4":[77],"then":[81],"formed":[82,171],"dispersed":[84],"evenly":[85],"in":[86],"overall":[91],"IMC":[95,120,152,168],"thicker":[98],"than":[99],"15\u03bcm":[100],"storage":[102,183],"at":[103,114,172,184],"150\u00b0C":[104,185],"for":[105,186],"1,000":[106,187],"hours.":[107,188],"During":[108],"tests":[111],"failure":[112],"occurred":[113],"interface":[116,174],"two":[119],"layers.":[121,153],"fracture":[123,139],"surfaces":[124],"with":[128,148,158],"electrolytic":[129],"thick":[132],"were":[135],"smooth":[136],"brittle":[138],"observed.":[141],"strength":[145],"decreased":[146],"dramatically":[147],"formation":[150],"For":[154],"electroless":[159],"layers,":[164],"single":[167],"its":[176],"2.5":[180],"\u03bcm":[181]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":1},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":4},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":3}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2016-06-24T00:00:00"}