{"id":"https://openalex.org/W1970324381","doi":"https://doi.org/10.1117/12.868563","title":"Improvement of KrF contact layer by inverse lithography technology with assist feature","display_name":"Improvement of KrF contact layer by inverse lithography technology with assist feature","publication_year":2010,"publication_date":"2010-04-29","ids":{"openalex":"https://openalex.org/W1970324381","doi":"https://doi.org/10.1117/12.868563","mag":"1970324381"},"language":"en","primary_location":{"id":"doi:10.1117/12.868563","doi":"https://doi.org/10.1117/12.868563","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.868563","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5010657698","display_name":"Sungho Jun","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210111902","display_name":"Dongbu HiTek (South Korea)","ror":"https://ror.org/018z3cr21","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210111902"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sungho Jun","raw_affiliation_strings":["Dongbu HiTek Co., Ltd. (Korea, Republic of)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dongbu HiTek Co., Ltd. (Korea, Republic of)","institution_ids":["https://openalex.org/I4210111902"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045375955","display_name":"Yeon-Ah Shim","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210111902","display_name":"Dongbu HiTek (South Korea)","ror":"https://ror.org/018z3cr21","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210111902"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Yeon-Ah Shim","raw_affiliation_strings":["Dongbu HiTek Co., Ltd. (Korea, Republic of)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dongbu HiTek Co., Ltd. (Korea, Republic of)","institution_ids":["https://openalex.org/I4210111902"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Jaeyoung Choi","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210111902","display_name":"Dongbu HiTek (South Korea)","ror":"https://ror.org/018z3cr21","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210111902"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jaeyoung Choi","raw_affiliation_strings":["Dongbu HiTek Co., Ltd. (Korea, Republic of)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dongbu HiTek Co., Ltd. (Korea, Republic of)","institution_ids":["https://openalex.org/I4210111902"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048315161","display_name":"Kwangsun Choi","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210111902","display_name":"Dongbu HiTek (South Korea)","ror":"https://ror.org/018z3cr21","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210111902"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Kwangsun Choi","raw_affiliation_strings":["Dongbu HiTek Co., Ltd. (Korea, Republic of)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dongbu HiTek Co., Ltd. (Korea, Republic of)","institution_ids":["https://openalex.org/I4210111902"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101738977","display_name":"Jae Won Han","orcid":"https://orcid.org/0000-0002-1642-4671","observed_orcids":["https://orcid.org/0000-0002-1642-4671"]},"institutions":[{"id":"https://openalex.org/I4210111902","display_name":"Dongbu HiTek (South Korea)","ror":"https://ror.org/018z3cr21","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210111902"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jae-won Han","raw_affiliation_strings":["Dongbu HiTek Co., Ltd. (Korea, Republic of)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dongbu HiTek Co., Ltd. (Korea, Republic of)","institution_ids":["https://openalex.org/I4210111902"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051578725","display_name":"Kechang Wang","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Kechang Wang","raw_affiliation_strings":["Luminescent Technologies, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Luminescent Technologies, Inc. (United States)","institution_ids":[]}]},{"author_position":"middle","author":{"id":null,"display_name":"John McCarthy","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"John McCarthy","raw_affiliation_strings":["Luminescent Technologies, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Luminescent Technologies, Inc. (United States)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100858476","display_name":"Guangming Xiao","orcid":"https://orcid.org/0009-0008-4758-8098","observed_orcids":["https://orcid.org/0009-0008-4758-8098"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Guangming Xiao","raw_affiliation_strings":["Luminescent Technologies, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Luminescent Technologies, Inc. (United States)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009836510","display_name":"Grace Dai","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Grace Dai","raw_affiliation_strings":["Luminescent Technologies, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Luminescent Technologies, Inc. (United States)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061766707","display_name":"Donghwan Son","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"DongHwan Son","raw_affiliation_strings":["Luminescent Technologies, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Luminescent Technologies, Inc. (United States)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049117338","display_name":"Xin Gui Zhou","orcid":"https://orcid.org/0000-0002-7726-7809","observed_orcids":["https://orcid.org/0000-0002-7726-7809"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Xin Zhou","raw_affiliation_strings":["Luminescent Technologies, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Luminescent Technologies, Inc. (United States)","institution_ids":[]}]},{"author_position":"middle","author":{"id":null,"display_name":"Tom Cecil","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Tom Cecil","raw_affiliation_strings":["Luminescent Technologies, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Luminescent Technologies, Inc. (United States)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100403326","display_name":"David S. Kim","orcid":"https://orcid.org/0000-0003-3621-4476","observed_orcids":["https://orcid.org/0000-0003-3621-4476"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"David Kim","raw_affiliation_strings":["Luminescent Technologies, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Luminescent Technologies, Inc. (United States)","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110239638","display_name":"Ki\u2010Ho Baik","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"KiHo Baik","raw_affiliation_strings":["Luminescent Technologies, Inc. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Luminescent Technologies, Inc. (United States)","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.04592736,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":"7748","issue":null,"first_page":"77481V","last_page":"77481V"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11517","display_name":"Advanced optical system design","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/krf-lithography","display_name":"KrF lithography","score":0.7720000147819519},{"id":"https://openalex.org/keywords/contact-hole-patterning","display_name":"contact hole patterning","score":0.8080000281333923},{"id":"https://openalex.org/keywords/sub-resolution-assist-features","display_name":"sub-resolution assist features","score":0.8230000138282776},{"id":"https://openalex.org/keywords/inverse-lithography","display_name":"inverse lithography technology","score":0.8579999804496765},{"id":"https://openalex.org/keywords/off-axis-illumination","display_name":"off-axis illumination","score":0.7490000128746033},{"id":"https://openalex.org/keywords/depth-of-focus","display_name":"depth of focus","score":0.8619999885559082},{"id":"https://openalex.org/keywords/image-contrast","display_name":"image contrast","score":0.953000009059906},{"id":"https://openalex.org/keywords/hole-circularity","display_name":"hole circularity","score":0.8730000257492065},{"id":"https://openalex.org/keywords/process-margin","display_name":"process margin","score":0.8569999933242798},{"id":"https://openalex.org/keywords/aerial-image-simulation","display_name":"aerial image simulation","score":0.7390000224113464}],"concepts":[{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.7565752267837524},{"id":"https://openalex.org/C2777441419","wikidata":"https://www.wikidata.org/wiki/Q16969460","display_name":"Process window","level":3,"score":0.7554271817207336},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6504986882209778},{"id":"https://openalex.org/C2776429412","wikidata":"https://www.wikidata.org/wiki/Q4688011","display_name":"Aerial image","level":3,"score":0.5822836756706238},{"id":"https://openalex.org/C2776401178","wikidata":"https://www.wikidata.org/wiki/Q12050496","display_name":"Feature (linguistics)","level":2,"score":0.5384973883628845},{"id":"https://openalex.org/C192209626","wikidata":"https://www.wikidata.org/wiki/Q190909","display_name":"Focus (optics)","level":2,"score":0.4865054488182068},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.4811035990715027},{"id":"https://openalex.org/C207467116","wikidata":"https://www.wikidata.org/wiki/Q4385666","display_name":"Inverse","level":2,"score":0.4451243579387665},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.3726115822792053},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.3449539840221405},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.30075883865356445},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.28381747007369995},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.2812247574329376},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.25955265760421753},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.16037556529045105},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.09325772523880005},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.09110987186431885},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.868563","doi":"https://doi.org/10.1117/12.868563","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.868563","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.5378999710083008}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2011864239","https://openalex.org/W2008187725","https://openalex.org/W1981304472","https://openalex.org/W1986597872","https://openalex.org/W1990151988","https://openalex.org/W1982361390","https://openalex.org/W2076283043","https://openalex.org/W2007756360","https://openalex.org/W2329455497","https://openalex.org/W1981719225"],"abstract_inverted_index":{"Patterning":[0],"of":[1,10,52,68,99,105,118,124,155,166,176,206],"contact":[2,58,96,128,178,202],"holes":[3],"using":[4,31,134,147,243],"KrF":[5,28],"lithography":[6,29,194,245],"system":[7,30],"is":[8,71,130,183,217,220,247],"one":[9],"the":[11,16,88,102,115,119,138,143,153,162,174,224],"most":[12,131],"challenging":[13],"tasks":[14],"for":[15,56,76,94,141,239],"sub-90nm":[17],"technology":[18,246],"node,.":[19],"Contact":[20],"hole":[21,69],"patterns":[22],"can":[23,83],"be":[24,84,109,170],"printed":[25],"with":[26],"a":[27,42,127,148,184,237],"Off-Axis":[32],"Illumination":[33],"(OAI)":[34],"such":[35,41],"as":[36],"Quasar":[37],"or":[38],"Quadrupole.":[39],"However,":[40],"source":[43],"usually":[44],"offers":[45],"poor":[46,50],"image":[47,63,89,233],"contrast":[48,64],"and":[49,65,92,161,164,214],"depth":[51],"focus":[53],"(DOF),":[54],"especially":[55,212],"isolated":[57,95,106,120],"holes.":[59,97,203],"In":[60],"addition":[61],"to":[62,86,108,151,158,169,199],"DOF,":[66],"circularity":[67,93,213],"shape":[70],"also":[72,221],"an":[73,192],"important":[74],"parameter":[75],"device":[77],"performance.":[78],"Sub-resolution":[79],"assist":[80,156,167],"features":[81,107,157,168],"(SRAF)":[82],"used":[85,198],"improve":[87],"contrast,":[90],"DOF":[91],"Application":[98],"SRAFs,":[100],"modifies":[101],"intensity":[103],"profile":[104],"more":[110],"like":[111],"dense":[112],"ones,":[113],"improving":[114],"focal":[116],"response":[117],"feature.":[121],"The":[122,204],"insertion":[123],"SRAFs":[125,144],"in":[126,173],"design":[129],"commonly":[132],"done":[133],"rule-based":[135,180],"scripting,":[136],"where":[137],"initial":[139],"rules":[140,242],"configuring":[142],"are":[145,227],"derived":[146],"simulation":[149,234],"tool":[150],"determining":[152],"distance":[154],"main":[159],"feature,":[160],"size":[163],"number":[165],"used.":[171],"However":[172],"case":[175],"random":[177,201],"holes,":[179],"SRAF":[181,207,241],"placement":[182],"nearly":[185],"impossible":[186],"task.":[187],"To":[188],"address":[189],"this":[190],"problem,":[191],"inverse":[193,244],"technique":[195],"was":[196],"successfully":[197],"treat":[200],"impact":[205],"configuration":[208],"on":[209],"pattern":[210],"profile,":[211],"process":[215],"margin,":[216],"demonstrated.":[218],"It":[219],"shown":[222],"that":[223],"experimental":[225],"data":[226],"easily":[228],"predicted":[229],"by":[230],"calibrating":[231],"aerial":[232],"results.":[235],"Finally,":[236],"methodology":[238],"optimizing":[240],"described.":[248]},"counts_by_year":[{"year":2014,"cited_by_count":1}],"updated_date":"2026-11-01T11:40:01.658920","created_date":"2016-06-24T00:00:00"}