{"id":"https://openalex.org/W1965446972","doi":"https://doi.org/10.4028/www.scientific.net/ssp.145-146.381","title":"Damage-Free Post-CMP Cleaning Solution for Low-k Fluorocarbon on Advanced Interconnects","display_name":"Damage-Free Post-CMP Cleaning Solution for Low-k Fluorocarbon on Advanced Interconnects","publication_year":2009,"publication_date":"2009-01-01","ids":{"openalex":"https://openalex.org/W1965446972","doi":"https://doi.org/10.4028/www.scientific.net/ssp.145-146.381","mag":"1965446972"},"language":"en","primary_location":{"id":"doi:10.4028/www.scientific.net/ssp.145-146.381","doi":"https://doi.org/10.4028/www.scientific.net/ssp.145-146.381","is_oa":false,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/ssp.145-146.381","pdf_url":null,"source":{"id":"https://openalex.org/S187696258","display_name":"Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena","issn_l":"1012-0394","issn":["1012-0394","1662-9779","1662-9787"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4322614515","host_organization_name":"Scientific.net","host_organization_lineage":["https://openalex.org/P4322614515"],"host_organization_lineage_names":["Scientific.net"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Solid State Phenomena","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Xun Gu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Xun Gu","raw_affiliation_strings":["Tohoku University","Tohoku Univ.#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tohoku University","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Tohoku Univ.#TAB#","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113874607","display_name":"Takenao Nemoto","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takenao Nemoto","raw_affiliation_strings":["Tohoku University","Tohoku Univ.#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tohoku University","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Tohoku Univ.#TAB#","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017855642","display_name":"Akinobu Teramoto","orcid":"https://orcid.org/0000-0002-4655-9403","observed_orcids":["https://orcid.org/0000-0002-4655-9403"]},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Akinobu Teramoto","raw_affiliation_strings":["Tohoku University","New Industry Creation Hatchery Center (NICHe)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tohoku University","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe)","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018904746","display_name":"Rui Hasebe","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Rui Hasebe","raw_affiliation_strings":["Tohoku University","Tohoku Univ.#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tohoku University","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Tohoku Univ.#TAB#","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045671593","display_name":"Takashi Ito","orcid":"https://orcid.org/0000-0002-9002-5708","observed_orcids":["https://orcid.org/0000-0002-9002-5708"]},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takashi Ito","raw_affiliation_strings":["Tohoku University","Advanced Interdisciplinary Research Division"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tohoku University","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Advanced Interdisciplinary Research Division","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110479973","display_name":"Tadahiro Ohmi","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tadahiro Ohmi","raw_affiliation_strings":["Tohoku University","Tohoku Univ.#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tohoku University","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Tohoku Univ.#TAB#","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":0.8134,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.67954733,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":97},"biblio":{"volume":"145-146","issue":null,"first_page":"381","last_page":"384"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9945999979972839,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9945999979972839,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.003700000001117587,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.00039999998989515007,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/post-cmp-cleaning","display_name":"post-CMP cleaning","score":0.8309999704360962},{"id":"https://openalex.org/keywords/ultra-low-k-dielectrics","display_name":"ultra low-k dielectrics","score":0.765999972820282},{"id":"https://openalex.org/keywords/lsi-circuits","display_name":"LSI circuits","score":0.5960000157356262}],"concepts":[{"id":"https://openalex.org/C2776875633","wikidata":"https://www.wikidata.org/wiki/Q425094","display_name":"Fluorocarbon","level":2,"score":0.823992133140564},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7733751535415649},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.6429412364959717},{"id":"https://openalex.org/C180088628","wikidata":"https://www.wikidata.org/wiki/Q1069404","display_name":"Chemical-mechanical planarization","level":3,"score":0.5385438203811646},{"id":"https://openalex.org/C2779866884","wikidata":"https://www.wikidata.org/wiki/Q1872538","display_name":"Low-k dielectric","level":3,"score":0.48178741335868835},{"id":"https://openalex.org/C6648577","wikidata":"https://www.wikidata.org/wiki/Q622669","display_name":"Porosity","level":2,"score":0.4654223620891571},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.43793195486068726},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.41186052560806274},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.36609625816345215},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.33745044469833374},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3256686329841614},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.1286238729953766},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":4,"locations":[{"id":"doi:10.4028/www.scientific.net/ssp.145-146.381","doi":"https://doi.org/10.4028/www.scientific.net/ssp.145-146.381","is_oa":false,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/ssp.145-146.381","pdf_url":null,"source":{"id":"https://openalex.org/S187696258","display_name":"Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena","issn_l":"1012-0394","issn":["1012-0394","1662-9779","1662-9787"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4322614515","host_organization_name":"Scientific.net","host_organization_lineage":["https://openalex.org/P4322614515"],"host_organization_lineage_names":["Scientific.net"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Solid State Phenomena","raw_type":"journal-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.430.6905","doi":null,"is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.430.6905","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.scientific.net/SSP.145-146.381.pdf","raw_type":"text"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.696.1655","doi":null,"is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.696.1655","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.scientific.net/SSP.145-146.381.pdf","raw_type":"text"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.988.2664","doi":null,"is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.988.2664","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.scientific.net/ssp.145-146.381.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2774465277","https://openalex.org/W2036013159","https://openalex.org/W2076992749","https://openalex.org/W4249972989","https://openalex.org/W2045294831","https://openalex.org/W2322183588","https://openalex.org/W2141174513","https://openalex.org/W2020475293","https://openalex.org/W2055139770","https://openalex.org/W2771680541"],"abstract_inverted_index":{"As":[0],"technology":[1],"node":[2],"progressing,":[3],"ultra":[4,25],"low-k":[5,26],"film":[6,20,27,35],"has":[7],"been":[8],"implemented":[9],"to":[10,38,49,66],"reduce":[11],"RC":[12],"delay":[13],"in":[14,54],"LSI":[15],"circuit.":[16],"A":[17],"fluorocarbon":[18],"(CFx)":[19],"is":[21,36,47,85],"proposed":[22],"as":[23],"foreground":[24],"because":[28],"of":[29,74],"non-porous":[30],"structure":[31,43,81],"[1].":[32],"Although":[33],"CFx":[34,80],"expected":[37],"be":[39],"stable":[40],"for":[41],"its":[42],"advantage,":[44],"damage-less":[45],"process":[46,56,63],"anticipated":[48],"avoid":[50],"dielectric":[51],"constants":[52],"change":[53],"subsequence":[55],"steps":[57],"[2].":[58],"CMP":[59,62,76],"and":[60,82],"post":[61,75],"are":[64],"concerned":[65],"bring":[67],"damage":[68],"on":[69,79],"devices,":[70],"so":[71],"the":[72],"effect":[73],"cleaning":[77],"solutions":[78],"electric":[83],"property":[84],"evaluated.":[86]},"counts_by_year":[{"year":2012,"cited_by_count":3}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2016-06-24T00:00:00"}