{"id":"https://openalex.org/W1963896342","doi":"https://doi.org/10.2494/photopolymer.25.365","title":"Mid-end Process Technologies for Advanced Packaging of LSI Devices","display_name":"Mid-end Process Technologies for Advanced Packaging of LSI Devices","publication_year":2012,"publication_date":"2012-01-01","ids":{"openalex":"https://openalex.org/W1963896342","doi":"https://doi.org/10.2494/photopolymer.25.365","mag":"1963896342"},"language":"en","primary_location":{"id":"doi:10.2494/photopolymer.25.365","doi":"https://doi.org/10.2494/photopolymer.25.365","is_oa":true,"landing_page_url":"https://doi.org/10.2494/photopolymer.25.365","pdf_url":"https://www.jstage.jst.go.jp/article/photopolymer/25/3/25_365/_pdf","source":{"id":"https://openalex.org/S26060816","display_name":"Journal of Photopolymer Science and Technology","issn_l":"0914-9244","issn":["0914-9244","1349-6336"],"is_oa":true,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-40","russia-white-list-3"],"host_organization":"https://openalex.org/P4323288777","host_organization_name":"The Society of Photopolymer Science and Technology (SPST)","host_organization_lineage":["https://openalex.org/P4323288777"],"host_organization_lineage_names":["The Society of Photopolymer Science and Technology (SPST)"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Photopolymer Science and Technology","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://www.jstage.jst.go.jp/article/photopolymer/25/3/25_365/_pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109915966","display_name":"H. Ezawa","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1292669757","display_name":"Toshiba (Japan)","ror":"https://ror.org/0326v3z14","country_code":"JP","type":"company","lineage":["https://openalex.org/I1292669757"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroaki Ezawa","raw_affiliation_strings":["Toshiba Corporation Semiconductor & Storage Products Company, Memory Packaging Development Department, Memory Division"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Toshiba Corporation Semiconductor & Storage Products Company, Memory Packaging Development Department, Memory Division","institution_ids":["https://openalex.org/I1292669757"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006792934","display_name":"Masaya Shima","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1292669757","display_name":"Toshiba (Japan)","ror":"https://ror.org/0326v3z14","country_code":"JP","type":"company","lineage":["https://openalex.org/I1292669757"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Masaya Shima","raw_affiliation_strings":["Toshiba Corporation Semiconductor & Storage Products Company, Memory Packaging Development Department, Memory Division"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Toshiba Corporation Semiconductor & Storage Products Company, Memory Packaging Development Department, Memory Division","institution_ids":["https://openalex.org/I1292669757"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009284780","display_name":"Tatsuo Migita","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Tatsuo Migita","raw_affiliation_strings":["Oita Operations, Process & Manufacturing & Engineering Department"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Oita Operations, Process & Manufacturing & Engineering Department","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053034307","display_name":"Soichi Homma","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1292669757","display_name":"Toshiba (Japan)","ror":"https://ror.org/0326v3z14","country_code":"JP","type":"company","lineage":["https://openalex.org/I1292669757"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Soichi Homma","raw_affiliation_strings":["Toshiba Corporation Semiconductor & Storage Products Company, Memory Packaging Development Department, Memory Division"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Toshiba Corporation Semiconductor & Storage Products Company, Memory Packaging Development Department, Memory Division","institution_ids":["https://openalex.org/I1292669757"]}]},{"author_position":"last","author":{"id":null,"display_name":"Masahiro Miyata","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Masahiro Miyata","raw_affiliation_strings":["Oita Operations, Process & Manufacturing & Engineering Department"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Oita Operations, Process & Manufacturing & Engineering Department","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"cited_by_count":3,"citation_normalized_percentile":{"value":0.12494042,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":93},"biblio":{"volume":"25","issue":"3","first_page":"365","last_page":"370"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9053000211715698,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9053000211715698,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.03889999911189079,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.0215000007301569,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/advanced-packaging","display_name":"advanced packaging","score":0.8980000019073486},{"id":"https://openalex.org/keywords/3d-integration","display_name":"3D integration","score":0.9879999756813049},{"id":"https://openalex.org/keywords/interlayer-dielectric","display_name":"interlayer dielectric","score":0.8799999952316284},{"id":"https://openalex.org/keywords/fan-out-wafer-level-packaging","display_name":"fan-out wafer-level packaging","score":0.9440000057220459},{"id":"https://openalex.org/keywords/thick-film-deposition","display_name":"thick film deposition","score":0.8299999833106995},{"id":"https://openalex.org/keywords/spray-coating","display_name":"spray coating","score":0.9430000185966492},{"id":"https://openalex.org/keywords/chip-stacking","display_name":"chip stacking","score":0.9919999837875366},{"id":"https://openalex.org/keywords/cu2o","display_name":"Cu2O","score":0.8169999718666077},{"id":"https://openalex.org/keywords/photoresist-adhesion","display_name":"photoresist adhesion","score":0.8299999833106995},{"id":"https://openalex.org/keywords/plasma-induced-damage","display_name":"plasma damage","score":0.6660000085830688},{"id":"https://openalex.org/keywords/low-k-dielectrics","display_name":"low-k dielectrics","score":0.7260000109672546},{"id":"https://openalex.org/keywords/flip-chip-reliability","display_name":"flip chip reliability","score":0.8320000171661377}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8313740491867065},{"id":"https://openalex.org/C33574316","wikidata":"https://www.wikidata.org/wiki/Q917260","display_name":"Passivation","level":3,"score":0.8012362718582153},{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.6902828812599182},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.5747232437133789},{"id":"https://openalex.org/C2781448156","wikidata":"https://www.wikidata.org/wiki/Q1570182","display_name":"Coating","level":2,"score":0.5281969308853149},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5213648080825806},{"id":"https://openalex.org/C193149544","wikidata":"https://www.wikidata.org/wiki/Q7122904","display_name":"Packaging engineering","level":2,"score":0.4990255832672119},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.48900970816612244},{"id":"https://openalex.org/C54725748","wikidata":"https://www.wikidata.org/wiki/Q7247277","display_name":"Process integration","level":2,"score":0.47581154108047485},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.459003210067749},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3945772647857666},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.393730103969574},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.22368478775024414},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.17707011103630066},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.17573845386505127},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.1310635805130005},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.2494/photopolymer.25.365","doi":"https://doi.org/10.2494/photopolymer.25.365","is_oa":true,"landing_page_url":"https://doi.org/10.2494/photopolymer.25.365","pdf_url":"https://www.jstage.jst.go.jp/article/photopolymer/25/3/25_365/_pdf","source":{"id":"https://openalex.org/S26060816","display_name":"Journal of Photopolymer Science and Technology","issn_l":"0914-9244","issn":["0914-9244","1349-6336"],"is_oa":true,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-40","russia-white-list-3"],"host_organization":"https://openalex.org/P4323288777","host_organization_name":"The Society of Photopolymer Science and Technology (SPST)","host_organization_lineage":["https://openalex.org/P4323288777"],"host_organization_lineage_names":["The Society of Photopolymer Science and Technology (SPST)"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Photopolymer Science and Technology","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.2494/photopolymer.25.365","doi":"https://doi.org/10.2494/photopolymer.25.365","is_oa":true,"landing_page_url":"https://doi.org/10.2494/photopolymer.25.365","pdf_url":"https://www.jstage.jst.go.jp/article/photopolymer/25/3/25_365/_pdf","source":{"id":"https://openalex.org/S26060816","display_name":"Journal of Photopolymer Science and Technology","issn_l":"0914-9244","issn":["0914-9244","1349-6336"],"is_oa":true,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-40","russia-white-list-3"],"host_organization":"https://openalex.org/P4323288777","host_organization_name":"The Society of Photopolymer Science and Technology (SPST)","host_organization_lineage":["https://openalex.org/P4323288777"],"host_organization_lineage_names":["The Society of Photopolymer Science and Technology (SPST)"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Photopolymer Science and Technology","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.4943999946117401,"id":"https://metadata.un.org/sdg/9"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W1963896342.pdf","grobid_xml":"https://content.openalex.org/works/W1963896342.grobid-xml"},"referenced_works_count":4,"referenced_works":["https://openalex.org/W1980004580","https://openalex.org/W2026723811","https://openalex.org/W2070605056","https://openalex.org/W2163742724"],"related_works":["https://openalex.org/W2126908785","https://openalex.org/W1176225407","https://openalex.org/W2989755533","https://openalex.org/W4404211363","https://openalex.org/W2065586335","https://openalex.org/W4416882975","https://openalex.org/W4407822769","https://openalex.org/W7125817766","https://openalex.org/W2880189814","https://openalex.org/W4383334246"],"abstract_inverted_index":{"As":[0],"the":[1,8,32,71,107,119,132,135,139],"demand":[2],"for":[3,38,101,173],"advanced":[4,152],"packaging":[5,25],"is":[6,14,126],"growing,":[7],"value":[9],"of":[10,49,55,82,97,118,141,145,158,167,170],"mid-end":[11],"process":[12,50,111,174],"technologies":[13],"increasing":[15],"in":[16],"an":[17],"effort":[18],"to":[19,34,76,123,128,155],"realize":[20],"innovative":[21],"device":[22],"products.":[23],"Substrate-free":[24],"and":[26,42,46,78,134],"3D":[27],"integration":[28,112],"are":[29],"coming":[30],"with":[31],"challenges":[33],"polymer":[35,147],"resin":[36,73],"deposition":[37,65],"interlayer":[39],"dielectrics":[40],"films":[41,45],"final":[43,148],"passivation":[44,149],"their":[47],"developments":[48],"integration.":[51,175],"For":[52],"cost":[53],"reduction":[54],"Fan-out":[56],"Wafer":[57],"Level":[58],"Packaging,":[59],"we":[60],"have":[61],"demonstrated":[62],"thick":[63,99],"film":[64,150],"on":[66,88,106,151],"square":[67],"panel":[68],"substrates":[69],"using":[70],"photo-sensitive":[72],"materials":[74,171],"tailored":[75],"spray-coating":[77],"slit-coating.":[79],"Chip":[80],"stacking":[81],"a":[83,89,98,146],"high":[84,90],"performance":[85],"logic":[86],"chip":[87,160],"band-width":[91],"DRAM":[92],"needs":[93],"fine":[94],"pitch":[95],"patterning":[96],"photo-resist":[100],"Cu":[102,120,136],"electroplated":[103],"redistribution":[104],"lines":[105],"DRAM.":[108],"Our":[109],"successful":[110],"has":[113,162],"confirmed":[114],"that":[115],"slight":[116],"oxidation":[117],"seed":[121],"surface":[122,144],"form":[124],"Cu2O":[125],"preferred":[127],"improve":[129,156],"adhesion":[130],"between":[131],"resist":[133],"surface.":[137],"Finally,":[138],"restoration":[140],"plasma":[142],"damaged":[143],"low-k":[153],"chips":[154],"reliability":[157],"flip":[159],"packages":[161],"been":[163],"discussed":[164],"as":[165],"one":[166],"typical":[168],"examples":[169],"design":[172]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2017,"cited_by_count":1}],"updated_date":"2026-09-29T14:09:16.559479","created_date":"2016-06-24T00:00:00"}