{"id":"https://openalex.org/W1944707239","doi":"https://doi.org/10.1007/s11431-006-0248-6","title":"Droplet creator based on electrowetting-on-dielectric for lab on a chip","display_name":"Droplet creator based on electrowetting-on-dielectric for lab on a chip","publication_year":2006,"publication_date":"2006-03-29","ids":{"openalex":"https://openalex.org/W1944707239","doi":"https://doi.org/10.1007/s11431-006-0248-6","mag":"1944707239"},"language":"en","primary_location":{"id":"doi:10.1007/s11431-006-0248-6","doi":"https://doi.org/10.1007/s11431-006-0248-6","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s11431-006-0248-6","pdf_url":null,"source":{"id":"https://openalex.org/S162583102","display_name":"Science China Technological Sciences","issn_l":"1869-1900","issn":["1869-1900","1006-9321","1674-7321","1862-281X","2095-0624","2095-0640"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Science in China Series E","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5050363785","display_name":"Xuefeng Zeng","orcid":"https://orcid.org/0000-0002-8656-2252","observed_orcids":["https://orcid.org/0000-0002-8656-2252"]},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Xuefeng Zeng","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, 100084, China","[Inst. of Microelectronics, Tsinghua University, Beijing, China]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, 100084, China","institution_ids":["https://openalex.org/I99065089"]},{"raw_affiliation_string":"[Inst. of Microelectronics, Tsinghua University, Beijing, China]","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110364538","display_name":"Ruifeng Yue","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ruifeng Yue","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, 100084, China","[Inst. of Microelectronics, Tsinghua University, Beijing, China]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, 100084, China","institution_ids":["https://openalex.org/I99065089"]},{"raw_affiliation_string":"[Inst. of Microelectronics, Tsinghua University, Beijing, China]","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110379550","display_name":"Jiangang Wu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jiangang Wu","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, 100084, China","[Inst. of Microelectronics, Tsinghua University, Beijing, China]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, 100084, China","institution_ids":["https://openalex.org/I99065089"]},{"raw_affiliation_string":"[Inst. of Microelectronics, Tsinghua University, Beijing, China]","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100630091","display_name":"Huan Hu","orcid":"https://orcid.org/0000-0002-1317-5470","observed_orcids":["https://orcid.org/0000-0002-1317-5470"]},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Huan Hu","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, 100084, China","[Inst. of Microelectronics, Tsinghua University, Beijing, China]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, 100084, China","institution_ids":["https://openalex.org/I99065089"]},{"raw_affiliation_string":"[Inst. of Microelectronics, Tsinghua University, Beijing, China]","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054626276","display_name":"Liang Dong","orcid":"https://orcid.org/0000-0002-0967-4955","observed_orcids":["https://orcid.org/0000-0002-0967-4955","https://orcid.org/0000-0001-5644-2877"]},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liang Dong","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, 100084, China","[Inst. of Microelectronics, Tsinghua University, Beijing, China]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, 100084, China","institution_ids":["https://openalex.org/I99065089"]},{"raw_affiliation_string":"[Inst. of Microelectronics, Tsinghua University, Beijing, China]","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029441301","display_name":"Zheyao Wang","orcid":"https://orcid.org/0000-0001-6196-8865","observed_orcids":["https://orcid.org/0000-0001-6196-8865"]},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zheyao Wang","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, 100084, China","[Inst. of Microelectronics, Tsinghua University, Beijing, China]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, 100084, China","institution_ids":["https://openalex.org/I99065089"]},{"raw_affiliation_string":"[Inst. of Microelectronics, Tsinghua University, Beijing, China]","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019341061","display_name":"Feng He","orcid":"https://orcid.org/0000-0001-8122-4767","observed_orcids":["https://orcid.org/0000-0001-8122-4767"]},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Feng He","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, 100084, China","Department of Engineering Mechanics Tsinghua University  Beijing China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, 100084, China","institution_ids":["https://openalex.org/I99065089"]},{"raw_affiliation_string":"Department of Engineering Mechanics Tsinghua University  Beijing China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5017130159","display_name":"Litian Liu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Litian Liu","raw_affiliation_strings":["Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China","[Inst. of Microelectronics, Tsinghua University, Beijing, China]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China","institution_ids":["https://openalex.org/I99065089"]},{"raw_affiliation_string":"[Inst. of Microelectronics, Tsinghua University, Beijing, China]","institution_ids":["https://openalex.org/I99065089"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5050363785"],"corresponding_institution_ids":["https://openalex.org/I99065089"],"apc_list":{"value":3090,"currency":"USD","value_usd":3090},"apc_paid":null,"fwci":0.6745,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.7315928,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"49","issue":"2","first_page":"248","last_page":"256"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12452","display_name":"Electrowetting and Microfluidic Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12452","display_name":"Electrowetting and Microfluidic Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electrowetting-on-dielectric","display_name":"electrowetting-on-dielectric","score":0.996999979019165},{"id":"https://openalex.org/keywords/droplet-formation","display_name":"droplet formation","score":0.7950000166893005},{"id":"https://openalex.org/keywords/microelectrode-arrays","display_name":"microelectrode arrays","score":0.8500000238418579},{"id":"https://openalex.org/keywords/lab-on-a-chip","display_name":"lab-on-a-chip","score":0.7409999966621399},{"id":"https://openalex.org/keywords/hydrophobic-layer","display_name":"hydrophobic layer","score":0.6690000295639038},{"id":"https://openalex.org/keywords/fluorinated-polymers","display_name":"fluorinated polymers","score":0.7990000247955322},{"id":"https://openalex.org/keywords/silicon-nitride-dielectric","display_name":"silicon nitride dielectric","score":0.8579999804496765},{"id":"https://openalex.org/keywords/sandwich-structures","display_name":"sandwich structures","score":0.6340000033378601},{"id":"https://openalex.org/keywords/silicone-oil","display_name":"silicone oil","score":0.8140000104904175}],"concepts":[{"id":"https://openalex.org/C2779673822","wikidata":"https://www.wikidata.org/wiki/Q907239","display_name":"Electrowetting","level":3,"score":0.9602400064468384},{"id":"https://openalex.org/C111670793","wikidata":"https://www.wikidata.org/wiki/Q16979465","display_name":"Microelectrode","level":3,"score":0.7282095551490784},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7122605443000793},{"id":"https://openalex.org/C2777431650","wikidata":"https://www.wikidata.org/wiki/Q413828","display_name":"Silicon nitride","level":3,"score":0.7112593650817871},{"id":"https://openalex.org/C95967509","wikidata":"https://www.wikidata.org/wiki/Q1952355","display_name":"Multielectrode array","level":4,"score":0.7004067301750183},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.6873353719711304},{"id":"https://openalex.org/C134514944","wikidata":"https://www.wikidata.org/wiki/Q817136","display_name":"Wetting","level":2,"score":0.6659837961196899},{"id":"https://openalex.org/C6556556","wikidata":"https://www.wikidata.org/wiki/Q899239","display_name":"Contact angle","level":2,"score":0.6463760733604431},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.6262855529785156},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.5940523147583008},{"id":"https://openalex.org/C92444450","wikidata":"https://www.wikidata.org/wiki/Q5276112","display_name":"Digital microfluidics","level":4,"score":0.5750404596328735},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5476651191711426},{"id":"https://openalex.org/C57410435","wikidata":"https://www.wikidata.org/wiki/Q505668","display_name":"Chemical vapor deposition","level":2,"score":0.5185399651527405},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5089166164398193},{"id":"https://openalex.org/C8673954","wikidata":"https://www.wikidata.org/wiki/Q138845","display_name":"Microfluidics","level":2,"score":0.4972133934497833},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.4778939485549927},{"id":"https://openalex.org/C64297162","wikidata":"https://www.wikidata.org/wiki/Q1987070","display_name":"Deposition (geology)","level":3,"score":0.47494199872016907},{"id":"https://openalex.org/C38347018","wikidata":"https://www.wikidata.org/wiki/Q905958","display_name":"Plasma-enhanced chemical vapor deposition","level":3,"score":0.45983949303627014},{"id":"https://openalex.org/C2775952280","wikidata":"https://www.wikidata.org/wiki/Q416873","display_name":"Silicone oil","level":2,"score":0.4407127797603607},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3442173898220062},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3336658477783203},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.18555498123168945},{"id":"https://openalex.org/C2816523","wikidata":"https://www.wikidata.org/wiki/Q180184","display_name":"Sediment","level":2,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/s11431-006-0248-6","doi":"https://doi.org/10.1007/s11431-006-0248-6","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s11431-006-0248-6","pdf_url":null,"source":{"id":"https://openalex.org/S162583102","display_name":"Science China Technological Sciences","issn_l":"1869-1900","issn":["1869-1900","1006-9321","1674-7321","1862-281X","2095-0624","2095-0640"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Science in China Series E","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":16,"referenced_works":["https://openalex.org/W1964165072","https://openalex.org/W1982731027","https://openalex.org/W1998848303","https://openalex.org/W2001020988","https://openalex.org/W2003295114","https://openalex.org/W2015528962","https://openalex.org/W2030826572","https://openalex.org/W2052319034","https://openalex.org/W2059963708","https://openalex.org/W2062070676","https://openalex.org/W2068561631","https://openalex.org/W2082217900","https://openalex.org/W2101164901","https://openalex.org/W2128267708","https://openalex.org/W2142486523","https://openalex.org/W2150068960"],"related_works":["https://openalex.org/W2351873520","https://openalex.org/W61509678","https://openalex.org/W2743965911","https://openalex.org/W3045501599","https://openalex.org/W1975948512","https://openalex.org/W2189971779","https://openalex.org/W2348477355","https://openalex.org/W2010589113","https://openalex.org/W1968000836","https://openalex.org/W2539841728"],"abstract_inverted_index":null,"counts_by_year":[{"year":2018,"cited_by_count":2},{"year":2014,"cited_by_count":1}],"updated_date":"2026-10-02T10:15:12.560889","created_date":"2016-06-24T00:00:00"}