{"id":"https://openalex.org/W1900793085","doi":"https://doi.org/10.1109/asic.1994.404542","title":"A modular, high performance, 2 \u03bcm CCD-BiCMOS process technology for application specific image sensors and image sensor systems on a chip","display_name":"A modular, high performance, 2 \u03bcm CCD-BiCMOS process technology for application specific image sensors and image sensor systems on a chip","publication_year":2002,"publication_date":"2002-12-17","ids":{"openalex":"https://openalex.org/W1900793085","doi":"https://doi.org/10.1109/asic.1994.404542","mag":"1900793085"},"language":"en","primary_location":{"id":"doi:10.1109/asic.1994.404542","doi":"https://doi.org/10.1109/asic.1994.404542","is_oa":false,"landing_page_url":"https://doi.org/10.1109/asic.1994.404542","pdf_url":null,"source":{"id":"https://openalex.org/S7407086705","display_name":"Annual IEEE International ASIC Conference and Exhibit","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings Seventh Annual IEEE International ASIC Conference and Exhibit","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5017690339","display_name":"R. Michael Guidash","orcid":"https://orcid.org/0000-0003-2614-1015","observed_orcids":["https://orcid.org/0000-0003-2614-1015"]},"institutions":[{"id":"https://openalex.org/I175669267","display_name":"Carestream (United States)","ror":"https://ror.org/048m16q57","country_code":"US","type":"company","lineage":["https://openalex.org/I175669267"]},{"id":"https://openalex.org/I4210094723","display_name":"Kodak (Japan)","ror":"https://ror.org/00tee0349","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210094723","https://openalex.org/I4210159451"]},{"id":"https://openalex.org/I4210159451","display_name":"Kodak (United States)","ror":"https://ror.org/04rn3ph18","country_code":"US","type":"company","lineage":["https://openalex.org/I4210159451"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"R.M. Guidash","raw_affiliation_strings":["Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","institution_ids":["https://openalex.org/I4210094723"]},{"raw_affiliation_string":"Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA","institution_ids":["https://openalex.org/I175669267","https://openalex.org/I4210159451"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047160649","display_name":"P.P.K. Lee","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I175669267","display_name":"Carestream (United States)","ror":"https://ror.org/048m16q57","country_code":"US","type":"company","lineage":["https://openalex.org/I175669267"]},{"id":"https://openalex.org/I4210094723","display_name":"Kodak (Japan)","ror":"https://ror.org/00tee0349","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210094723","https://openalex.org/I4210159451"]},{"id":"https://openalex.org/I4210159451","display_name":"Kodak (United States)","ror":"https://ror.org/04rn3ph18","country_code":"US","type":"company","lineage":["https://openalex.org/I4210159451"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"P.P.K. Lee","raw_affiliation_strings":["Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","institution_ids":["https://openalex.org/I4210094723"]},{"raw_affiliation_string":"Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA","institution_ids":["https://openalex.org/I175669267","https://openalex.org/I4210159451"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085101417","display_name":"Jason Andrus","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I175669267","display_name":"Carestream (United States)","ror":"https://ror.org/048m16q57","country_code":"US","type":"company","lineage":["https://openalex.org/I175669267"]},{"id":"https://openalex.org/I4210094723","display_name":"Kodak (Japan)","ror":"https://ror.org/00tee0349","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210094723","https://openalex.org/I4210159451"]},{"id":"https://openalex.org/I4210159451","display_name":"Kodak (United States)","ror":"https://ror.org/04rn3ph18","country_code":"US","type":"company","lineage":["https://openalex.org/I4210159451"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"J.M. Andrus","raw_affiliation_strings":["Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","institution_ids":["https://openalex.org/I4210094723"]},{"raw_affiliation_string":"Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA","institution_ids":["https://openalex.org/I175669267","https://openalex.org/I4210159451"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086947341","display_name":"Antonio S. Ciccarelli","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I175669267","display_name":"Carestream (United States)","ror":"https://ror.org/048m16q57","country_code":"US","type":"company","lineage":["https://openalex.org/I175669267"]},{"id":"https://openalex.org/I4210094723","display_name":"Kodak (Japan)","ror":"https://ror.org/00tee0349","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210094723","https://openalex.org/I4210159451"]},{"id":"https://openalex.org/I4210159451","display_name":"Kodak (United States)","ror":"https://ror.org/04rn3ph18","country_code":"US","type":"company","lineage":["https://openalex.org/I4210159451"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"A.S. Ciccarelli","raw_affiliation_strings":["Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","institution_ids":["https://openalex.org/I4210094723"]},{"raw_affiliation_string":"Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA","institution_ids":["https://openalex.org/I175669267","https://openalex.org/I4210159451"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018831151","display_name":"H Erhardt","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I175669267","display_name":"Carestream (United States)","ror":"https://ror.org/048m16q57","country_code":"US","type":"company","lineage":["https://openalex.org/I175669267"]},{"id":"https://openalex.org/I4210094723","display_name":"Kodak (Japan)","ror":"https://ror.org/00tee0349","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210094723","https://openalex.org/I4210159451"]},{"id":"https://openalex.org/I4210159451","display_name":"Kodak (United States)","ror":"https://ror.org/04rn3ph18","country_code":"US","type":"company","lineage":["https://openalex.org/I4210159451"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"H.J. Erhardt","raw_affiliation_strings":["Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","institution_ids":["https://openalex.org/I4210094723"]},{"raw_affiliation_string":"Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA","institution_ids":["https://openalex.org/I175669267","https://openalex.org/I4210159451"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109906438","display_name":"J. Fischer","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I175669267","display_name":"Carestream (United States)","ror":"https://ror.org/048m16q57","country_code":"US","type":"company","lineage":["https://openalex.org/I175669267"]},{"id":"https://openalex.org/I4210094723","display_name":"Kodak (Japan)","ror":"https://ror.org/00tee0349","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210094723","https://openalex.org/I4210159451"]},{"id":"https://openalex.org/I4210159451","display_name":"Kodak (United States)","ror":"https://ror.org/04rn3ph18","country_code":"US","type":"company","lineage":["https://openalex.org/I4210159451"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"J.R. Fischer","raw_affiliation_strings":["Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","institution_ids":["https://openalex.org/I4210094723"]},{"raw_affiliation_string":"Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA","institution_ids":["https://openalex.org/I175669267","https://openalex.org/I4210159451"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061380647","display_name":"Eric J. Meisenzahl","orcid":"https://orcid.org/0000-0002-7061-9795","observed_orcids":["https://orcid.org/0000-0002-7061-9795"]},"institutions":[{"id":"https://openalex.org/I175669267","display_name":"Carestream (United States)","ror":"https://ror.org/048m16q57","country_code":"US","type":"company","lineage":["https://openalex.org/I175669267"]},{"id":"https://openalex.org/I4210094723","display_name":"Kodak (Japan)","ror":"https://ror.org/00tee0349","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210094723","https://openalex.org/I4210159451"]},{"id":"https://openalex.org/I4210159451","display_name":"Kodak (United States)","ror":"https://ror.org/04rn3ph18","country_code":"US","type":"company","lineage":["https://openalex.org/I4210159451"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"E.J. Meisenzahl","raw_affiliation_strings":["Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","institution_ids":["https://openalex.org/I4210094723"]},{"raw_affiliation_string":"Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA","institution_ids":["https://openalex.org/I175669267","https://openalex.org/I4210159451"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065864174","display_name":"Robert H. Philbrick","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I175669267","display_name":"Carestream (United States)","ror":"https://ror.org/048m16q57","country_code":"US","type":"company","lineage":["https://openalex.org/I175669267"]},{"id":"https://openalex.org/I4210094723","display_name":"Kodak (Japan)","ror":"https://ror.org/00tee0349","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210094723","https://openalex.org/I4210159451"]},{"id":"https://openalex.org/I4210159451","display_name":"Kodak (United States)","ror":"https://ror.org/04rn3ph18","country_code":"US","type":"company","lineage":["https://openalex.org/I4210159451"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"R.H. Philbrick","raw_affiliation_strings":["Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","institution_ids":["https://openalex.org/I4210094723"]},{"raw_affiliation_string":"Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA","institution_ids":["https://openalex.org/I175669267","https://openalex.org/I4210159451"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5027427234","display_name":"G. Ting","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I175669267","display_name":"Carestream (United States)","ror":"https://ror.org/048m16q57","country_code":"US","type":"company","lineage":["https://openalex.org/I175669267"]},{"id":"https://openalex.org/I4210094723","display_name":"Kodak (Japan)","ror":"https://ror.org/00tee0349","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210094723","https://openalex.org/I4210159451"]},{"id":"https://openalex.org/I4210159451","display_name":"Kodak (United States)","ror":"https://ror.org/04rn3ph18","country_code":"US","type":"company","lineage":["https://openalex.org/I4210159451"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"G. Ting","raw_affiliation_strings":["Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microelectronics Technology Division, Eastman Kodak (Japan) Limited, Rochester, NY, USA","institution_ids":["https://openalex.org/I4210094723"]},{"raw_affiliation_string":"Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA","institution_ids":["https://openalex.org/I175669267","https://openalex.org/I4210159451"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.1268,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.72668686,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"352","last_page":"355"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10323","display_name":"Analog and Mixed-Signal Circuit Design","score":0.0006000000284984708,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bicmos-technology","display_name":"BiCMOS process","score":0.7929999828338623},{"id":"https://openalex.org/keywords/ccd-image-sensor","display_name":"CCD image sensor","score":0.8420000076293945},{"id":"https://openalex.org/keywords/on-chip-integration","display_name":"on-chip integration","score":0.7289999723434448},{"id":"https://openalex.org/keywords/cmos-integration","display_name":"CMOS integration","score":0.8349999785423279},{"id":"https://openalex.org/keywords/mixed-signal-integration","display_name":"mixed-signal integration","score":0.6000000238418579}],"concepts":[{"id":"https://openalex.org/C62427370","wikidata":"https://www.wikidata.org/wiki/Q173416","display_name":"BiCMOS","level":4,"score":0.8477814197540283},{"id":"https://openalex.org/C101468663","wikidata":"https://www.wikidata.org/wiki/Q1620158","display_name":"Modular design","level":2,"score":0.7635949850082397},{"id":"https://openalex.org/C76935873","wikidata":"https://www.wikidata.org/wiki/Q209121","display_name":"Image sensor","level":2,"score":0.7262676954269409},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6712108850479126},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5757750868797302},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.48842278122901917},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4768042266368866},{"id":"https://openalex.org/C77390884","wikidata":"https://www.wikidata.org/wiki/Q217302","display_name":"Application-specific integrated circuit","level":2,"score":0.45187562704086304},{"id":"https://openalex.org/C152213855","wikidata":"https://www.wikidata.org/wiki/Q189880","display_name":"Charge-coupled device","level":2,"score":0.4232787787914276},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.40720126032829285},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.3620942234992981},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.34452420473098755},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.326294481754303},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.32303130626678467},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.3149441182613373},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.23500052094459534},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.17909970879554749},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.14617982506752014},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/asic.1994.404542","doi":"https://doi.org/10.1109/asic.1994.404542","is_oa":false,"landing_page_url":"https://doi.org/10.1109/asic.1994.404542","pdf_url":null,"source":{"id":"https://openalex.org/S7407086705","display_name":"Annual IEEE International ASIC Conference and Exhibit","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings Seventh Annual IEEE International ASIC Conference and Exhibit","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W1590300563","https://openalex.org/W1979006344","https://openalex.org/W2096995644","https://openalex.org/W2118461024"],"related_works":["https://openalex.org/W2079242992","https://openalex.org/W1931637147","https://openalex.org/W826346906","https://openalex.org/W1979770066","https://openalex.org/W2284787720","https://openalex.org/W2135304521","https://openalex.org/W2119302896","https://openalex.org/W4229494811","https://openalex.org/W1480194070","https://openalex.org/W1559059997"],"abstract_inverted_index":{"A":[0],"2":[1,66],"/spl":[2,67],"mu/m":[3,68],"BiCMOS":[4,31],"process":[5,22],"module":[6],"has":[7],"been":[8],"developed":[9],"for":[10],"incorporation":[11],"into":[12],"existing":[13],"charge-coupled":[14],"device":[15],"(CCD)":[16],"image":[17,52],"sensor":[18],"processes.":[19],"The":[20],"modular":[21],"architecture":[23],"allows":[24],"integration":[25,42],"of":[26,43,62],"CMOS,":[27,69],"NPN":[28,74],"bipolar":[29],"or":[30],"circuits":[32],"without":[33],"affecting":[34],"the":[35,51,59,77],"baseline":[36],"CCD":[37],"characteristics,":[38],"and":[39,46,70],"enables":[40],"on-chip":[41],"desired":[44],"analog":[45],"digital":[47],"circuit":[48],"functions":[49],"with":[50],"sensor.":[53],"To":[54],"our":[55],"knowledge":[56],"this":[57],"is":[58],"first":[60],"demonstration":[61],"high":[63],"performance":[64],"CCD,":[65],"an":[71],"isolated":[72],"vertical":[73],"integrated":[75],"on":[76],"same":[78],"chip.>":[79]},"counts_by_year":[],"updated_date":"2026-10-05T09:50:58.205359","created_date":"2016-06-24T00:00:00"}