{"id":"https://openalex.org/W1521088445","doi":null,"title":"A printed circuit board inspection system with defect classification capability","display_name":"A printed circuit board inspection system with defect classification capability","publication_year":2011,"publication_date":"2011-01-01","ids":{"openalex":"https://openalex.org/W1521088445","mag":"1521088445"},"language":"en","primary_location":{"id":"mag:1521088445","doi":null,"is_oa":false,"landing_page_url":"https://www.smtnet.com/library/files/upload/PCB-Inspection-System-With-Defect-Detection-Cpability.pdf","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null},"volume":null,"type":"article","is_traditional":true,"indexed_in":[],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5031515973","display_name":"S. A. R. Abu\u2013Bakar","orcid":"https://orcid.org/0000-0002-4360-6630","observed_orcids":["https://orcid.org/0000-0002-4360-6630"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"S. A. R. Abu\u2013Bakar","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0000-0002-4360-6630","affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5083191333","display_name":"Musa Mohd Mokji","orcid":"https://orcid.org/0000-0002-7590-8481","observed_orcids":["https://orcid.org/0000-0002-7590-8481"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Musa Mohd Mokji","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0000-0002-7590-8481","affiliations":[]},{"author_position":"middle","author":{"id":null,"display_name":"Ismail Ibrahim","orcid":"https://orcid.org/0000-0002-0805-8181","observed_orcids":["https://orcid.org/0000-0002-0805-8181"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Ismail Ibrahim","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0000-0002-0805-8181","affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023094953","display_name":"Jameel Abdulla Ahmed Mukred","orcid":"https://orcid.org/0000-0002-5283-8273","observed_orcids":["https://orcid.org/0000-0002-5283-8273"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Jameel Abdulla Ahmed Mukred","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0000-0002-5283-8273","affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028275994","display_name":"Zulkifli Md. Yusof","orcid":"https://orcid.org/0000-0003-1365-2609","observed_orcids":["https://orcid.org/0000-0003-1365-2609"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Zulkifli Md. Yusof","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0000-0003-1365-2609","affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030952292","display_name":"Zuwairie Ibrahim","orcid":"https://orcid.org/0000-0003-1641-3478","observed_orcids":["https://orcid.org/0000-0003-1641-3478"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Zuwairie Ibrahim","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0000-0003-1641-3478","affiliations":[]},{"author_position":"middle","author":{"id":null,"display_name":"Kamal Khalil","orcid":"https://orcid.org/0000-0003-0666-2219","observed_orcids":["https://orcid.org/0000-0003-0666-2219"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Kamal Khalil","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0000-0003-0666-2219","affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5085034566","display_name":"Mohd Saberi Mohamad","orcid":"https://orcid.org/0000-0002-1079-4559","observed_orcids":["https://orcid.org/0000-0002-1079-4559"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Mohd Saberi Mohamad","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0000-0002-1079-4559","affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.4242,"has_fulltext":false,"cited_by_count":13,"citation_normalized_percentile":{"value":0.83810715,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":97},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12169","display_name":"Non-Destructive Testing Techniques","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11606","display_name":"Infrastructure Maintenance and Monitoring","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/printed-circuit-board-inspection","display_name":"printed circuit board inspection","score":0.996999979019165},{"id":"https://openalex.org/keywords/automated-visual-inspection","display_name":"automated visual inspection","score":0.9810000061988831},{"id":"https://openalex.org/keywords/defect-classification","display_name":"defect classification","score":0.9380000233650208},{"id":"https://openalex.org/keywords/template-matching","display_name":"template matching","score":0.6579999923706055},{"id":"https://openalex.org/keywords/image-registration","display_name":"image registration","score":0.7649999856948853},{"id":"https://openalex.org/keywords/thresholding","display_name":"thresholding","score":0.7480000257492065},{"id":"https://openalex.org/keywords/median-filtering","display_name":"median filter","score":0.9990000128746033},{"id":"https://openalex.org/keywords/missing-holes","display_name":"missing holes","score":0.824999988079071},{"id":"https://openalex.org/keywords/pinholes","display_name":"pinholes","score":0.8450000286102295},{"id":"https://openalex.org/keywords/short-circuit","display_name":"short circuit","score":0.8669999837875366},{"id":"https://openalex.org/keywords/open-circuit","display_name":"open circuit","score":0.8029999732971191},{"id":"https://openalex.org/keywords/etching-defects","display_name":"etching defects","score":0.765999972820282}],"concepts":[{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.9138880968093872},{"id":"https://openalex.org/C191178318","wikidata":"https://www.wikidata.org/wiki/Q2256906","display_name":"Thresholding","level":3,"score":0.8231638669967651},{"id":"https://openalex.org/C168820333","wikidata":"https://www.wikidata.org/wiki/Q448889","display_name":"Visual inspection","level":2,"score":0.74205482006073},{"id":"https://openalex.org/C146920229","wikidata":"https://www.wikidata.org/wiki/Q2278114","display_name":"Automated X-ray inspection","level":4,"score":0.7407947182655334},{"id":"https://openalex.org/C164830781","wikidata":"https://www.wikidata.org/wiki/Q787330","display_name":"Automated optical inspection","level":2,"score":0.734189510345459},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5603325366973877},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5295760631561279},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.5237141251564026},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.4938884377479553},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.4201318323612213},{"id":"https://openalex.org/C9417928","wikidata":"https://www.wikidata.org/wiki/Q1070689","display_name":"Image processing","level":3,"score":0.3781816363334656},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.3669208884239197},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.33630549907684326},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.33548563718795776},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.13797321915626526},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0722443163394928},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"mag:1521088445","doi":null,"is_oa":false,"landing_page_url":"https://www.smtnet.com/library/files/upload/PCB-Inspection-System-With-Defect-Detection-Cpability.pdf","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W353573311","https://openalex.org/W1986529266","https://openalex.org/W2004241456","https://openalex.org/W2141832011","https://openalex.org/W2150537673"],"related_works":["https://openalex.org/W2892691346","https://openalex.org/W2141832011","https://openalex.org/W2259304700","https://openalex.org/W2789841922","https://openalex.org/W2542558339","https://openalex.org/W2133779627","https://openalex.org/W3012995819","https://openalex.org/W2132346196","https://openalex.org/W3033362782","https://openalex.org/W2358793477"],"abstract_inverted_index":{"An":[0],"automated":[1],"visual":[2],"printed":[3],"circuit":[4],"board":[5],"(PCB)":[6],"inspection":[7,29,124],"is":[8,126,195],"an":[9],"approach":[10,69],"used":[12],"to":[15,91,170,204],"counter":[17],"difficulties":[19],"occurred":[21],"in":[23,166,200],"human\u2019s":[25],"manual":[27],"that":[31],"can":[33],"elimin":[36],"ates":[37],"subjective":[39],"aspects":[41],"and":[43,53,81,159,176,243],"then":[45,129],"provides":[47],"fast,":[49],"quantitative,":[51],"dimens":[55],"ional":[56],"assessments.":[58],"In":[60],"this":[62],"study,":[64],"referentia":[66],"l":[67],"has":[71],"been":[73],"implemented":[75],"on":[77,97,120],"template":[79],"defective":[83],"PCB":[85,123],"images":[88],"detectnumerous":[93],"defects":[95,118,223],"bare":[99],"PCBs":[101],"before":[103],"etching":[105,111],"process,":[107],"since":[109],"usually":[114],"contributes":[115],"most":[116],"destructive":[117],"found":[119],"PCBs.":[121],"The":[122],"system":[125],"improved":[132],"by":[135],"incorporating":[138],"a":[141],"geometrical":[144],"image":[147],"registration,":[150],"minimum":[153],"thresholding":[154],"technique":[156],"median":[161],"filtering":[163],"order":[168,202],"solve":[172],"alignment":[174],"uneven":[178],"illumination":[181],"problem.":[183],"Finally,":[187],"defect":[189],"classification":[191],"operation":[193],"employed":[197],"identify":[207],"the":[210],"source":[212],"for":[214],"six":[216],"types":[219],"of":[221],"namely,":[225],"missing":[227],"hole,":[229,233],"pin":[231],"underetch,":[235],"short":[238],"-circuit,":[239],"mousebite,":[241],"open-":[244],"circuit.":[245]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2015,"cited_by_count":4},{"year":2014,"cited_by_count":2}],"updated_date":"2026-09-29T14:09:16.559479","created_date":"2016-06-24T00:00:00"}