{"id":"https://openalex.org/W1511069660","doi":"https://doi.org/10.1109/apec.1992.228352","title":"Insulated metal substrates improve in performance and product implementation","display_name":"Insulated metal substrates improve in performance and product implementation","publication_year":2003,"publication_date":"2003-01-02","ids":{"openalex":"https://openalex.org/W1511069660","doi":"https://doi.org/10.1109/apec.1992.228352","mag":"1511069660"},"language":"en","primary_location":{"id":"doi:10.1109/apec.1992.228352","doi":"https://doi.org/10.1109/apec.1992.228352","is_oa":false,"landing_page_url":"https://doi.org/10.1109/apec.1992.228352","pdf_url":null,"source":{"id":"https://openalex.org/S4210177957","display_name":"Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition","issn_l":"1048-2334","issn":["1048-2334","2470-6647"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"[Proceedings] APEC '92 Seventh Annual Applied Power Electronics Conference and Exposition","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"I. Fishbein","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"I. Fishbein","raw_affiliation_strings":["International Rectifier Corporation, El Segundo, CA, USA","Int. Rectifier Corp., El Segundo, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"International Rectifier Corporation, El Segundo, CA, USA","institution_ids":[]},{"raw_affiliation_string":"Int. Rectifier Corp., El Segundo, CA, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5018640188","display_name":"N.M. Abramowitz","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"N.M. Abramowitz","raw_affiliation_strings":["International Rectifier Corporation, El Segundo, CA, USA","Int. Rectifier Corp., El Segundo, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"International Rectifier Corporation, El Segundo, CA, USA","institution_ids":[]},{"raw_affiliation_string":"Int. Rectifier Corp., El Segundo, CA, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":{"value":0.02731825,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"633","last_page":"638"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.39820000529289246,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.39820000529289246,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.2847000062465668,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13116","display_name":"Heat Transfer and Numerical Methods","score":0.06019999831914902,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/insulated-metal-substrate","display_name":"insulated metal substrate","score":0.8700000047683716},{"id":"https://openalex.org/keywords/ceramic-substrates","display_name":"ceramic substrates","score":0.9599999785423279},{"id":"https://openalex.org/keywords/thermal-performance","display_name":"thermal performance","score":0.7129999995231628},{"id":"https://openalex.org/keywords/thermal-insulation","display_name":"thermal insulation","score":0.44999998807907104},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"electronic packaging","score":0.6779999732971191},{"id":"https://openalex.org/keywords/product-implementation","display_name":"product implementation","score":0.38499999046325684}],"concepts":[{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.7022890448570251},{"id":"https://openalex.org/C2776436953","wikidata":"https://www.wikidata.org/wiki/Q5163215","display_name":"Consistency (knowledge bases)","level":2,"score":0.6876195669174194},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5790324211120605},{"id":"https://openalex.org/C90673727","wikidata":"https://www.wikidata.org/wiki/Q901718","display_name":"Product (mathematics)","level":2,"score":0.5465843081474304},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.543500542640686},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.44122177362442017},{"id":"https://openalex.org/C544153396","wikidata":"https://www.wikidata.org/wiki/Q11426","display_name":"Metal","level":2,"score":0.4184894263744354},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3168884515762329},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25647976994514465},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.13155597448349},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.10338464379310608},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.09974613785743713},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/apec.1992.228352","doi":"https://doi.org/10.1109/apec.1992.228352","is_oa":false,"landing_page_url":"https://doi.org/10.1109/apec.1992.228352","pdf_url":null,"source":{"id":"https://openalex.org/S4210177957","display_name":"Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition","issn_l":"1048-2334","issn":["1048-2334","2470-6647"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"[Proceedings] APEC '92 Seventh Annual Applied Power Electronics Conference and Exposition","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5378999710083008,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W7125916577","https://openalex.org/W2127956887","https://openalex.org/W2996018809","https://openalex.org/W2113224786","https://openalex.org/W3032903960","https://openalex.org/W2085950202","https://openalex.org/W4388565372","https://openalex.org/W1997691696","https://openalex.org/W7164179437","https://openalex.org/W6987703831"],"abstract_inverted_index":{"The":[0],"authors":[1],"review":[2],"the":[3,30],"insulated":[4],"metal":[5],"substrate":[6],"(IMS)":[7],"technology":[8],"and":[9,14],"provide":[10,50],"comparisons":[11],"between":[12],"IMS":[13,44],"ceramic":[15,53],"substrates.":[16],"Results":[17],"show":[18],"a":[19,45],"reasonable":[20],"tradeoff":[21],"in":[22,35],"thermal":[23],"performance":[24],"with":[25],"improved":[26],"consistency":[27],"resulting":[28],"from":[29],"controlled":[31],"isolation":[32],"region.":[33],"Complexity":[34],"packaging":[36],"adds":[37],"tradeoffs":[38],"that":[39],"still":[40],"do":[41],"not":[42],"make":[43],"universal":[46],"material,":[47],"but":[48],"clearly":[49],"advantages":[51],"over":[52],"packages.>":[54]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":2},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2015,"cited_by_count":1}],"updated_date":"2026-10-26T11:51:55.731654","created_date":"2016-06-24T00:00:00"}