{"id":"https://openalex.org/W1481744587","doi":"https://doi.org/10.1063/1.2729555","title":"Tool Design and Manufacturing for Bulk Forming of Micro Components","display_name":"Tool Design and Manufacturing for Bulk Forming of Micro Components","publication_year":2007,"publication_date":"2007-01-01","ids":{"openalex":"https://openalex.org/W1481744587","doi":"https://doi.org/10.1063/1.2729555","mag":"1481744587"},"language":"en","primary_location":{"id":"doi:10.1063/1.2729555","doi":"https://doi.org/10.1063/1.2729555","is_oa":false,"landing_page_url":"https://doi.org/10.1063/1.2729555","pdf_url":null,"source":{"id":"https://openalex.org/S2764696622","display_name":"AIP conference proceedings","issn_l":"0094-243X","issn":["0094-243X","1551-7616","1935-0465"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310320257","host_organization_name":"American Institute of Physics","host_organization_lineage":["https://openalex.org/P4310320257"],"host_organization_lineage_names":["American Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"AIP Conference Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5023520147","display_name":"Rasmus Solmer Eriksen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210154794","display_name":"Instituttet for Produktudvikling (Denmark)","ror":"https://ror.org/054jcy957","country_code":"DK","type":"company","lineage":["https://openalex.org/I4210154794"]},{"id":"https://openalex.org/I96673099","display_name":"Technical University of Denmark","ror":"https://ror.org/04qtj9h94","country_code":"DK","type":"education","lineage":["https://openalex.org/I96673099"]}],"countries":["DK"],"is_corresponding":false,"raw_author_name":"R. S. Eriksen","raw_affiliation_strings":["*Department of Manufacturing Engineering and Management, Technical University of Denmark, DK\u20102800 Kgs. Lyngby, Denmark","\u2020IPU\u2010Production, Produktionstorvet, building 425, DK\u20102800 Lyngby, Denmark"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"*Department of Manufacturing Engineering and Management, Technical University of Denmark, DK\u20102800 Kgs. Lyngby, Denmark","institution_ids":["https://openalex.org/I96673099"]},{"raw_affiliation_string":"\u2020IPU\u2010Production, Produktionstorvet, building 425, DK\u20102800 Lyngby, Denmark","institution_ids":["https://openalex.org/I4210154794"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038508106","display_name":"Mogens Arentoft","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210154794","display_name":"Instituttet for Produktudvikling (Denmark)","ror":"https://ror.org/054jcy957","country_code":"DK","type":"company","lineage":["https://openalex.org/I4210154794"]},{"id":"https://openalex.org/I96673099","display_name":"Technical University of Denmark","ror":"https://ror.org/04qtj9h94","country_code":"DK","type":"education","lineage":["https://openalex.org/I96673099"]}],"countries":["DK"],"is_corresponding":false,"raw_author_name":"M. Arentoft","raw_affiliation_strings":["*Department of Manufacturing Engineering and Management, Technical University of Denmark, DK\u20102800 Kgs. Lyngby, Denmark","\u2020IPU\u2010Production, Produktionstorvet, building 425, DK\u20102800 Lyngby, Denmark"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"*Department of Manufacturing Engineering and Management, Technical University of Denmark, DK\u20102800 Kgs. Lyngby, Denmark","institution_ids":["https://openalex.org/I96673099"]},{"raw_affiliation_string":"\u2020IPU\u2010Production, Produktionstorvet, building 425, DK\u20102800 Lyngby, Denmark","institution_ids":["https://openalex.org/I4210154794"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5013363799","display_name":"Nikolas Aulin Paldan","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210154794","display_name":"Instituttet for Produktudvikling (Denmark)","ror":"https://ror.org/054jcy957","country_code":"DK","type":"company","lineage":["https://openalex.org/I4210154794"]},{"id":"https://openalex.org/I96673099","display_name":"Technical University of Denmark","ror":"https://ror.org/04qtj9h94","country_code":"DK","type":"education","lineage":["https://openalex.org/I96673099"]}],"countries":["DK"],"is_corresponding":false,"raw_author_name":"N. A. Paldan","raw_affiliation_strings":["*Department of Manufacturing Engineering and Management, Technical University of Denmark, DK\u20102800 Kgs. Lyngby, Denmark","\u2020IPU\u2010Production, Produktionstorvet, building 425, DK\u20102800 Lyngby, Denmark"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"*Department of Manufacturing Engineering and Management, Technical University of Denmark, DK\u20102800 Kgs. Lyngby, Denmark","institution_ids":["https://openalex.org/I96673099"]},{"raw_affiliation_string":"\u2020IPU\u2010Production, Produktionstorvet, building 425, DK\u20102800 Lyngby, Denmark","institution_ids":["https://openalex.org/I4210154794"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":3.0335,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.8869908,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"907","issue":null,"first_page":"457","last_page":"462"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11451","display_name":"Advanced Machining and Optimization Techniques","score":0.5971999764442444,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11451","display_name":"Advanced Machining and Optimization Techniques","score":0.5971999764442444,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10700","display_name":"Metal Forming Simulation Techniques","score":0.3774000108242035,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12080","display_name":"Injection Molding Process and Properties","score":0.00430000014603138,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bulk-forming","display_name":"bulk forming","score":0.7099999785423279},{"id":"https://openalex.org/keywords/microcomponents","display_name":"microcomponents","score":0.8989999890327454},{"id":"https://openalex.org/keywords/micro-electrical-discharge-machining","display_name":"micro electrical discharge machining","score":0.7400000095367432},{"id":"https://openalex.org/keywords/electroforming","display_name":"electroforming","score":0.9610000252723694},{"id":"https://openalex.org/keywords/micromachining","display_name":"micromachining","score":0.7519999742507935},{"id":"https://openalex.org/keywords/ejector","display_name":"ejector","score":0.6679999828338623},{"id":"https://openalex.org/keywords/punch","display_name":"punch","score":0.9729999899864197},{"id":"https://openalex.org/keywords/tool-geometry","display_name":"tool geometry","score":0.6209999918937683},{"id":"https://openalex.org/keywords/yield-strength","display_name":"yield strength","score":0.8240000009536743},{"id":"https://openalex.org/keywords/surface-roughness","display_name":"surface roughness","score":0.9990000128746033},{"id":"https://openalex.org/keywords/toolmaking","display_name":"tool manufacturing","score":0.593999981880188}],"concepts":[{"id":"https://openalex.org/C523214423","wikidata":"https://www.wikidata.org/wiki/Q192047","display_name":"Machining","level":2,"score":0.7115027904510498},{"id":"https://openalex.org/C2777571299","wikidata":"https://www.wikidata.org/wiki/Q3680646","display_name":"Grinding","level":2,"score":0.6609577536582947},{"id":"https://openalex.org/C179428855","wikidata":"https://www.wikidata.org/wiki/Q1069216","display_name":"Microscale chemistry","level":2,"score":0.6521942615509033},{"id":"https://openalex.org/C137808972","wikidata":"https://www.wikidata.org/wiki/Q5358014","display_name":"Electroforming","level":3,"score":0.6308479309082031},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.5603510737419128},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5464171767234802},{"id":"https://openalex.org/C107365816","wikidata":"https://www.wikidata.org/wiki/Q114817","display_name":"Surface roughness","level":2,"score":0.5212798118591309},{"id":"https://openalex.org/C71039073","wikidata":"https://www.wikidata.org/wiki/Q3439090","display_name":"Surface finish","level":2,"score":0.459097683429718},{"id":"https://openalex.org/C167740415","wikidata":"https://www.wikidata.org/wiki/Q2876213","display_name":"Aerospace","level":2,"score":0.45218485593795776},{"id":"https://openalex.org/C2780383046","wikidata":"https://www.wikidata.org/wiki/Q1760958","display_name":"Cutting tool","level":2,"score":0.42189300060272217},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3717186450958252},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3646392822265625},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.13661041855812073},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1103290319442749},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.1085003912448883},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C145420912","wikidata":"https://www.wikidata.org/wiki/Q853077","display_name":"Mathematics education","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1063/1.2729555","doi":"https://doi.org/10.1063/1.2729555","is_oa":false,"landing_page_url":"https://doi.org/10.1063/1.2729555","pdf_url":null,"source":{"id":"https://openalex.org/S2764696622","display_name":"AIP conference proceedings","issn_l":"0094-243X","issn":["0094-243X","1551-7616","1935-0465"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310320257","host_organization_name":"American Institute of Physics","host_organization_lineage":["https://openalex.org/P4310320257"],"host_organization_lineage_names":["American Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"AIP Conference Proceedings","raw_type":"proceedings-article"},{"id":"pmh:oai:pure.atira.dk:publications/0a1c6a45-b02d-4e8e-a54a-8f57ccfbf99b","doi":null,"is_oa":false,"landing_page_url":"https://orbit.dtu.dk/en/publications/0a1c6a45-b02d-4e8e-a54a-8f57ccfbf99b","pdf_url":null,"source":{"id":"https://openalex.org/S4306400705","display_name":"Technical University of Denmark, DTU Orbit (Technical University of Denmark, DTU)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I96673099","host_organization_name":"Technical University of Denmark","host_organization_lineage":["https://openalex.org/I96673099"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Eriksen , R S , Arentoft , M &amp; Paldan , N A 2007 , Tool Design and Manufacturing for Bulk Forming of Micro Components . in 10th ESAFORM conference proceedings . ESAFORM conference , Zaragoza, Spain , 01/01/2007 .","raw_type":"contributionToPeriodical"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W3154421116","https://openalex.org/W1656680151","https://openalex.org/W2962920543","https://openalex.org/W2158020128","https://openalex.org/W1972552764","https://openalex.org/W2504486884","https://openalex.org/W957150912","https://openalex.org/W2283617892","https://openalex.org/W1484671888","https://openalex.org/W2154343292"],"abstract_inverted_index":{"The":[0],"central":[1],"part":[2],"of":[3,21,44,61,79,90,122],"the":[4,9,13,31,40,119,123],"metal":[5],"forming":[6,10,63],"processes":[7],"are":[8,17],"tools.":[11,125],"In":[12],"macroscale,":[14],"these":[15],"tools":[16,64],"manufactured":[18,70,86],"by":[19],"means":[20],"machining\u2010":[22],"and":[23,26,56,81,92,104],"drilling":[24],"operations":[25],"subsequently":[27],"hardened.":[28],"Due":[29],"to":[30,117],"required":[32],"precision,":[33],"this":[34],"approach":[35],"is":[36],"not":[37],"possible":[38],"in":[39],"microscale.":[41],"An":[42],"investigation":[43],"alternative":[45],"tool":[46],"manufacturing":[47],"techniques":[48],"has":[49,68,107,114],"been":[50,69,85,108,115],"carried":[51],"out,":[52],"including":[53,98],"\u03bc\u2010EDM,":[54],"electroforming":[55],"machining":[57],"operations.":[58],"A":[59,77,110],"series":[60,78],"universal":[62],"for":[65],"simple":[66],"microcompoents":[67],"using":[71,87],"different":[72],"techniques,":[73],"allowing":[74],"side\u2010by\u2010side":[75],"comparison.":[76],"ejectors":[80],"punches":[82],"have":[83],"also":[84],"a":[88],"combination":[89],"grinding":[91],"\u03bc\u2010EDM":[93],"processing.":[94],"Critical":[95],"tooling":[96],"parameters":[97],"geometry,":[99],"yield":[100],"strength,":[101],"surface":[102],"roughness":[103],"production":[105],"time":[106],"recorded.":[109],"silicon":[111],"replica":[112],"method":[113],"utilized":[116],"measure":[118],"internal":[120],"geometry":[121],"microforming":[124]},"counts_by_year":[],"updated_date":"2026-10-29T09:56:32.521200","created_date":"2016-06-24T00:00:00"}
