{"id":"https://openalex.org/keywords/semiconductor-packaging","display_name":"semiconductor packaging","description":"Semiconductor packaging is the process and technology of enclosing semiconductor devices to protect them and connect them to electronic systems.","display_name_alternatives":["semiconductor device packaging","microchip packaging","chip packaging","IC packaging"],"ids":{"openalex":"https://openalex.org/keywords/semiconductor-packaging","wikidata":"https://www.wikidata.org/wiki/Q759494"},"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.417,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.417,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.149,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"works_count":8394,"cited_by_count":30973,"works_api_url":"https://api.openalex.org/works?filter=keywords.id:keywords/semiconductor-packaging","updated_date":"2026-10-23T04:06:34","created_date":"2026-09-30T00:00:00"}