{"id":"https://openalex.org/keywords/package-reliability","display_name":"package reliability","description":"The ability of an electronic package to maintain its mechanical, electrical, and thermal integrity during manufacture and service.","display_name_alternatives":["package level reliability","electronic package reliability","reliability of electronic packages"],"ids":{"openalex":"https://openalex.org/keywords/package-reliability","wikidata":null},"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.6749,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.6749,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.1597,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"works_count":2377,"cited_by_count":18985,"works_api_url":"https://api.openalex.org/works?filter=keywords.id:keywords/package-reliability","updated_date":"2026-10-21T04:06:17","created_date":"2026-09-30T00:00:00"}