{"id":"https://openalex.org/keywords/die-attach","display_name":"die attach","description":"Die attach is the process of bonding a semiconductor chip to a substrate or package during electronic device assembly.","display_name_alternatives":["chip attachment","die attachment","die bonding"],"ids":{"openalex":"https://openalex.org/keywords/die-attach","wikidata":null},"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.6611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.6611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"works_count":3353,"cited_by_count":31001,"works_api_url":"https://api.openalex.org/works?filter=keywords.id:keywords/die-attach","updated_date":"2026-10-22T04:07:25","created_date":"2026-09-30T00:00:00"}