{"id":"https://openalex.org/A5140420523","orcid":"https://orcid.org/0009-0007-7848-3857","observed_orcids":["https://orcid.org/0009-0007-7848-3857"],"display_name":"Jianbo Zhou","raw_author_names":["Jianbo Zhou"],"full_name":"Jianbo Zhou","works_count":3,"cited_by_count":4,"summary_stats":{"2yr_mean_citedness":1.3333333333333333,"h_index":1,"i10_index":0},"ids":{"openalex":"https://openalex.org/A5140420523","orcid":"https://orcid.org/0009-0007-7848-3857","observed_orcids":["https://orcid.org/0009-0007-7848-3857"]},"affiliations":[{"institution":{"id":"https://openalex.org/I14116566","ror":"https://ror.org/05w0e5j23","display_name":"Wuhan Polytechnic University","country_code":"CN","type":"education","lineage":["https://openalex.org/I14116566"]},"years":[2026]}],"last_known_institutions":[{"id":"https://openalex.org/I14116566","ror":"https://ror.org/05w0e5j23","display_name":"Wuhan Polytechnic University","country_code":"CN","type":"education","lineage":["https://openalex.org/I14116566"]}],"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","count":1,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10396","display_name":"Fatigue and fracture mechanics","count":1,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":1,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","count":1,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11442","display_name":"Titanium Alloys Microstructure and Properties","count":1,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T13312","display_name":"Mechanical and Thermal Properties Analysis","value":1.18e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11442","display_name":"Titanium Alloys Microstructure and Properties","value":6.5e-06,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":5.7e-06,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","value":5.3e-06,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12045","display_name":"Rice Cultivation and Yield Improvement","value":4.7e-06,"subfield":{"id":"https://openalex.org/subfields/1110","display_name":"Plant Science"},"field":{"id":"https://openalex.org/fields/11","display_name":"Agricultural and Biological Sciences"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9550999999046326},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.5144000053405762},{"id":"135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","score":0.4652000069618225},{"id":"66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","score":0.4065999984741211},{"id":"78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","score":0.31869998574256897}],"counts_by_year":[{"year":2026,"works_count":3,"oa_works_count":2,"cited_by_count":4}],"display_name_alternatives":["Jianbo Zhou"],"block_key":"j zhou","works_api_url":"https://api.openalex.org/works?filter=author.id:A5140420523","awards_count":0,"updated_date":"2026-11-03T12:34:24","created_date":"2026-07-03T00:00:00"}