{"id":"https://openalex.org/A5115841849","orcid":"https://orcid.org/0009-0008-0117-085X","observed_orcids":["https://orcid.org/0009-0008-0117-085X"],"display_name":"B\u00e9la B\u0151di","raw_author_names":["B\u00e9la Bodi","B\u00e9la B\u0151di"],"full_name":"B\u00e9la B\u0151di","works_count":5,"cited_by_count":6,"summary_stats":{"2yr_mean_citedness":1.2,"h_index":1,"i10_index":0},"ids":{"openalex":"https://openalex.org/A5115841849","orcid":"https://orcid.org/0009-0008-0117-085X","observed_orcids":["https://orcid.org/0009-0008-0117-085X"]},"affiliations":[{"institution":{"id":"https://openalex.org/I103356709","ror":"https://ror.org/00ax71d21","display_name":"Obuda University","country_code":"HU","type":"education","lineage":["https://openalex.org/I103356709"]},"years":[2026,2025,2024]}],"last_known_institutions":[{"id":"https://openalex.org/I103356709","ror":"https://ror.org/00ax71d21","display_name":"Obuda University","country_code":"HU","type":"education","lineage":["https://openalex.org/I103356709"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":5,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","count":4,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14128","display_name":"Metallurgical and Alloy Processes","count":4,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","count":1,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","count":1,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":2.82e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14128","display_name":"Metallurgical and Alloy Processes","value":1.48e-05,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","value":1.36e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","value":4.6e-06,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","value":3.1e-06,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","score":0.9175565838813782},{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.887499988079071},{"id":"191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","score":0.7260000109672546},{"id":"204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","score":0.45079851150512695},{"id":"114793014","wikidata":"https://www.wikidata.org/wiki/Q52109","display_name":"Geomorphology","score":0.0}],"counts_by_year":[{"year":2024,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2025,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2026,"works_count":2,"oa_works_count":1,"cited_by_count":6}],"display_name_alternatives":["B\u00e9la Bodi","B\u00e9la B\u0151di"],"block_key":"b bodi","works_api_url":"https://api.openalex.org/works?filter=author.id:A5115841849","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5115841849","updated_date":"2026-11-12T13:17:38","created_date":"2025-01-11T00:00:00"}