{"id":"https://openalex.org/A5114044448","orcid":null,"observed_orcids":[],"display_name":"Yuqi Cong","raw_author_names":["Yuqi Cong"],"full_name":"Yuqi Cong","works_count":6,"cited_by_count":58,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":4,"i10_index":2},"ids":{"openalex":"https://openalex.org/A5114044448","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I2799432993","ror":"https://ror.org/04rgfzt17","display_name":"Advanced Semiconductor Engineering (Taiwan)","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]},"years":[2011,2010,2009]}],"last_known_institutions":[{"id":"https://openalex.org/I2799432993","ror":"https://ror.org/04rgfzt17","display_name":"Advanced Semiconductor Engineering (Taiwan)","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":6,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":6,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":5,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","count":1,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":7.11e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":4.95e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":3.4e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","value":4.7e-06,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","score":0.8364288210868835},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.49142491817474365},{"id":"119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","score":0.23098325729370117},{"id":"165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","score":0.2190171182155609},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.16380199790000916}],"counts_by_year":[{"year":2009,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2011,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":2}],"display_name_alternatives":["Yuqi Cong"],"block_key":"y cong","works_api_url":"https://api.openalex.org/works?filter=author.id:A5114044448","awards_count":0,"updated_date":"2026-10-28T12:34:19","created_date":"2016-06-24T00:00:00"}