{"id":"https://openalex.org/A5113937582","orcid":"https://orcid.org/0009-0003-7862-6302","observed_orcids":["https://orcid.org/0009-0003-7862-6302"],"display_name":"Yohei Sugawara","raw_author_names":["Sugawara, Yohei","Y. Sugawara","Yohei Sugawara"],"full_name":"Yohei Sugawara","works_count":24,"cited_by_count":374,"summary_stats":{"2yr_mean_citedness":1.8,"h_index":7,"i10_index":3},"ids":{"openalex":"https://openalex.org/A5113937582","orcid":"https://orcid.org/0009-0003-7862-6302","observed_orcids":["https://orcid.org/0009-0003-7862-6302"]},"affiliations":[{"institution":{"id":"https://openalex.org/I201537933","ror":"https://ror.org/01dq60k83","display_name":"Tohoku University","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]},"years":[2018,2017,2015,2014]},{"institution":{"id":"https://openalex.org/I4210166566","ror":"https://ror.org/05xeefy56","display_name":"Preferred Networks (Japan)","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210166566"]},"years":[2026,2025,2023,2021,2020,2019,2018]},{"institution":{"id":"https://openalex.org/I65143321","ror":"https://ror.org/02exqgm79","display_name":"Hitachi (Japan)","country_code":"JP","type":"company","lineage":["https://openalex.org/I65143321"]},"years":[2002]},{"institution":{"id":"https://openalex.org/I74801974","ror":"https://ror.org/057zh3y96","display_name":"The University of Tokyo","country_code":"JP","type":"education","lineage":["https://openalex.org/I74801974"]},"years":[2019]}],"last_known_institutions":[{"id":"https://openalex.org/I4210166566","ror":"https://ror.org/05xeefy56","display_name":"Preferred Networks (Japan)","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210166566"]}],"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":10,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":7,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","count":6,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10036","display_name":"Advanced Neural Network Applications","count":4,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10052","display_name":"Medical Image Segmentation Techniques","count":4,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0001181,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":6.91e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12303","display_name":"Tensor decomposition and applications","value":5.57e-05,"subfield":{"id":"https://openalex.org/subfields/2605","display_name":"Computational Mathematics"},"field":{"id":"https://openalex.org/fields/26","display_name":"Mathematics"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13702","display_name":"Machine Learning in Healthcare","value":2.96e-05,"subfield":{"id":"https://openalex.org/subfields/1702","display_name":"Artificial Intelligence"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","value":2.09e-05,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9224222898483276},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.9190999865531921},{"id":"154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","score":0.6756544709205627},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.6361123323440552},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.21598362922668457}],"counts_by_year":[{"year":2002,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2014,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2015,"works_count":4,"oa_works_count":0,"cited_by_count":0},{"year":2016,"works_count":1,"oa_works_count":0,"cited_by_count":3},{"year":2017,"works_count":1,"oa_works_count":0,"cited_by_count":1},{"year":2018,"works_count":3,"oa_works_count":1,"cited_by_count":3},{"year":2019,"works_count":3,"oa_works_count":3,"cited_by_count":10},{"year":2020,"works_count":1,"oa_works_count":1,"cited_by_count":11},{"year":2021,"works_count":1,"oa_works_count":1,"cited_by_count":47},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":54},{"year":2023,"works_count":2,"oa_works_count":2,"cited_by_count":65},{"year":2024,"works_count":1,"oa_works_count":1,"cited_by_count":74},{"year":2025,"works_count":2,"oa_works_count":2,"cited_by_count":69},{"year":2026,"works_count":2,"oa_works_count":2,"cited_by_count":35}],"display_name_alternatives":["Sugawara, Yohei","Y. Sugawara","Yohei Sugawara"],"block_key":"y sugawara","works_api_url":"https://api.openalex.org/works?filter=author.id:A5113937582","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5113937582","updated_date":"2026-11-10T14:30:39","created_date":"2016-06-24T00:00:00"}