{"id":"https://openalex.org/A5113874607","orcid":null,"observed_orcids":[],"display_name":"Takenao Nemoto","raw_author_names":["Takenao Nemoto"],"full_name":"Nemoto, Takenao","works_count":45,"cited_by_count":413,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":9,"i10_index":8},"ids":{"openalex":"https://openalex.org/A5113874607","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I114132059","ror":"https://ror.org/05gd76j39","display_name":"Tokyo Electron (Japan)","country_code":"JP","type":"company","lineage":["https://openalex.org/I114132059"]},"years":[2012,2011,2009,2007,1996]},{"institution":{"id":"https://openalex.org/I201537933","ror":"https://ror.org/01dq60k83","display_name":"Tohoku University","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]},"years":[2012,2011,2010,2009,2007,2006,2002,1996]},{"institution":{"id":"https://openalex.org/I4405287282","ror":"https://ror.org/04ps06597","display_name":"New Industry Creation Hatchery Center, Tohoku University","country_code":"JP","type":"facility","lineage":["https://openalex.org/I201537933","https://openalex.org/I4405287282"]},"years":[2012,2011,2009,2008]}],"last_known_institutions":[{"id":"https://openalex.org/I114132059","ror":"https://ror.org/05gd76j39","display_name":"Tokyo Electron (Japan)","country_code":"JP","type":"company","lineage":["https://openalex.org/I114132059"]},{"id":"https://openalex.org/I201537933","ror":"https://ror.org/01dq60k83","display_name":"Tohoku University","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]},{"id":"https://openalex.org/I4405287282","ror":"https://ror.org/04ps06597","display_name":"New Industry Creation Hatchery Center, Tohoku University","country_code":"JP","type":"facility","lineage":["https://openalex.org/I201537933","https://openalex.org/I4405287282"]}],"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":33,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":22,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","count":18,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":13,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","count":11,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":0.0003255,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0002592,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","value":0.0001408,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":7.33e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12092","display_name":"Erosion and Abrasive Machining","value":4e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.837581992149353},{"id":"191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","score":0.6706722974777222},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.6027100682258606},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.24461966753005981},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.1748649775981903}],"counts_by_year":[{"year":1993,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":1996,"works_count":2,"oa_works_count":1,"cited_by_count":0},{"year":2002,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":3,"oa_works_count":2,"cited_by_count":0},{"year":2007,"works_count":2,"oa_works_count":2,"cited_by_count":0},{"year":2008,"works_count":2,"oa_works_count":1,"cited_by_count":0},{"year":2009,"works_count":14,"oa_works_count":2,"cited_by_count":0},{"year":2010,"works_count":5,"oa_works_count":1,"cited_by_count":0},{"year":2011,"works_count":10,"oa_works_count":4,"cited_by_count":0},{"year":2012,"works_count":5,"oa_works_count":2,"cited_by_count":47},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":22},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":12},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":14},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":25},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":34},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":21},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":15},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":16},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":19},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":15},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":10},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":9},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":10},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":11}],"display_name_alternatives":["Takenao Nemoto"],"block_key":"t nemoto","works_api_url":"https://api.openalex.org/works?filter=author.id:A5113874607","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5113874607","updated_date":"2026-11-10T14:30:39","created_date":"2016-06-24T00:00:00"}