{"id":"https://openalex.org/A5113856047","orcid":null,"observed_orcids":[],"display_name":"Tim Jensen","raw_author_names":["Jensen, Tim","Tim Jensen","Timothy Jensen"],"full_name":"Tim Jensen","works_count":36,"cited_by_count":29,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":3,"i10_index":0},"ids":{"openalex":"https://openalex.org/A5113856047","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210113846","ror":"https://ror.org/01dp84930","display_name":"Indium Corporation (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I4210113846"]},"years":[2026,2024,2023,2022,2020,2019,2018,2017,2016,2015,2014,2013,2012,2011,2010,2009,2008,2006,2004,2002]}],"last_known_institutions":[{"id":"https://openalex.org/I4210113846","ror":"https://ror.org/01dp84930","display_name":"Indium Corporation (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I4210113846"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":35,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","count":18,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","count":15,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","count":9,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13116","display_name":"Heat Transfer and Numerical Methods","count":5,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":0.0001984,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","value":9.74e-05,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14014","display_name":"Transportation Systems and Infrastructure","value":6.22e-05,"subfield":{"id":"https://openalex.org/subfields/1405","display_name":"Management of Technology and Innovation"},"field":{"id":"https://openalex.org/fields/14","display_name":"Business, Management and Accounting"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","value":6.17e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","value":4.17e-05,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.7208999991416931},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.6100000143051147},{"id":"204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","score":0.533961832523346},{"id":"78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","score":0.5054645538330078},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.49070000648498535}],"counts_by_year":[{"year":2002,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2004,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2008,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2009,"works_count":5,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2011,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2013,"works_count":2,"oa_works_count":0,"cited_by_count":2},{"year":2014,"works_count":1,"oa_works_count":0,"cited_by_count":1},{"year":2015,"works_count":1,"oa_works_count":0,"cited_by_count":2},{"year":2016,"works_count":4,"oa_works_count":0,"cited_by_count":2},{"year":2017,"works_count":4,"oa_works_count":0,"cited_by_count":2},{"year":2018,"works_count":1,"oa_works_count":0,"cited_by_count":3},{"year":2019,"works_count":2,"oa_works_count":0,"cited_by_count":1},{"year":2020,"works_count":2,"oa_works_count":0,"cited_by_count":2},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2022,"works_count":1,"oa_works_count":0,"cited_by_count":2},{"year":2023,"works_count":1,"oa_works_count":0,"cited_by_count":1},{"year":2024,"works_count":2,"oa_works_count":0,"cited_by_count":2},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2026,"works_count":1,"oa_works_count":1,"cited_by_count":3}],"display_name_alternatives":["Jensen, Tim","Tim Jensen","Timothy Jensen"],"block_key":"t jensen","works_api_url":"https://api.openalex.org/works?filter=author.id:A5113856047","awards_count":0,"updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}