{"id":"https://openalex.org/A5113725869","orcid":null,"observed_orcids":[],"display_name":"Tong Hong Wang","raw_author_names":["Tong Hong Wang"],"full_name":"Tong Hong Wang","works_count":54,"cited_by_count":597,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":14,"i10_index":23},"ids":{"openalex":"https://openalex.org/A5113725869","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I2799432993","ror":"https://ror.org/04rgfzt17","display_name":"Advanced Semiconductor Engineering (Taiwan)","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]},"years":[2026,2013,2012,2011,2010,2009,2008,2007,2006,2005,2004]},{"institution":{"id":"https://openalex.org/I91807558","ror":"https://ror.org/01b8kcc49","display_name":"National Cheng Kung University","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]},"years":[2009,2008,2007,2006]}],"last_known_institutions":[{"id":"https://openalex.org/I2799432993","ror":"https://ror.org/04rgfzt17","display_name":"Advanced Semiconductor Engineering (Taiwan)","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":41,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":29,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","count":11,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","count":10,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10780","display_name":"Reliability and Maintenance Optimization","count":9,"subfield":{"id":"https://openalex.org/subfields/2213","display_name":"Safety, Risk, Reliability and Quality"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0003427,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":0.0002324,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13463","display_name":"Nanoporous metals and alloys","value":0.0001086,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","value":5.03e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12340","display_name":"Anodic Oxide Films and Nanostructures","value":4.92e-05,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9286653995513916},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.7031612396240234},{"id":"204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","score":0.6486999988555908},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.3637199401855469},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.20264899730682373}],"counts_by_year":[{"year":2004,"works_count":5,"oa_works_count":0,"cited_by_count":0},{"year":2005,"works_count":4,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":9,"oa_works_count":0,"cited_by_count":0},{"year":2007,"works_count":8,"oa_works_count":1,"cited_by_count":0},{"year":2008,"works_count":10,"oa_works_count":0,"cited_by_count":0},{"year":2009,"works_count":8,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2011,"works_count":3,"oa_works_count":1,"cited_by_count":0},{"year":2012,"works_count":3,"oa_works_count":0,"cited_by_count":49},{"year":2013,"works_count":1,"oa_works_count":0,"cited_by_count":42},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":32},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":30},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":26},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":38},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":31},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":24},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":18},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":14},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":13},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":14},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":24},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":10},{"year":2026,"works_count":1,"oa_works_count":1,"cited_by_count":8}],"display_name_alternatives":["Tong Hong Wang"],"block_key":"h tong","works_api_url":"https://api.openalex.org/works?filter=author.id:A5113725869","awards_count":0,"updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}