{"id":"https://openalex.org/A5113674304","orcid":null,"observed_orcids":[],"display_name":"Un-Byoung Kang","raw_author_names":["U B Kang","U.-B. Kang","Un-Byoung Kang","Unbyoung Kang","Unbyoung. Kang"],"full_name":"Unbyoung. Kang","works_count":15,"cited_by_count":232,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":9,"i10_index":9},"ids":{"openalex":"https://openalex.org/A5113674304","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I2250650973","ror":"https://ror.org/04w3jy968","display_name":"Samsung (South Korea)","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]},"years":[2023,2022,2021]},{"institution":{"id":"https://openalex.org/I4405259277","ror":"https://ror.org/020m7t761","display_name":"Samsung Electronics (South Korea)","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973","https://openalex.org/I4405259277"]},"years":[2023,2022,2021,2011,2010]},{"institution":{"id":"https://openalex.org/I4575257","ror":"https://ror.org/046865y68","display_name":"Hanyang University","country_code":"KR","type":"education","lineage":["https://openalex.org/I4575257"]},"years":[2004,2003,2002,1999]}],"last_known_institutions":[{"id":"https://openalex.org/I2250650973","ror":"https://ror.org/04w3jy968","display_name":"Samsung (South Korea)","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]},{"id":"https://openalex.org/I4405259277","ror":"https://ror.org/020m7t761","display_name":"Samsung Electronics (South Korea)","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973","https://openalex.org/I4405259277"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":13,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":13,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":4,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","count":3,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","count":2,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0001536,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":7.37e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":3.95e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","value":2.37e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","value":2.09e-05,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8910480737686157},{"id":"160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","score":0.7925357818603516},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.5960379838943481},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.48044082522392273},{"id":"2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","score":0.4603419601917267}],"counts_by_year":[{"year":1999,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2002,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2003,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2004,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2011,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":0,"oa_works_count":0,"cited_by_count":16},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":14},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":12},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":8},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2021,"works_count":3,"oa_works_count":0,"cited_by_count":7},{"year":2022,"works_count":2,"oa_works_count":0,"cited_by_count":7},{"year":2023,"works_count":2,"oa_works_count":0,"cited_by_count":25},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":22},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":32},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":17}],"display_name_alternatives":["U B Kang","U.-B. Kang","Un-Byoung Kang","Unbyoung Kang","Unbyoung. Kang"],"block_key":"u kang","works_api_url":"https://api.openalex.org/works?filter=author.id:A5113674304","awards_count":0,"updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}