{"id":"https://openalex.org/A5113578268","orcid":null,"observed_orcids":[],"display_name":"Yu-Jiau Huang","raw_author_names":["Yu-Jiau Huang","Yuh-Jiau Huang"],"full_name":"Yu-Jiau Huang","works_count":5,"cited_by_count":87,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":3,"i10_index":3},"ids":{"openalex":"https://openalex.org/A5113578268","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210148468","ror":"https://ror.org/05szzwt63","display_name":"Industrial Technology Research Institute","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]},"years":[2012,2011,2003]}],"last_known_institutions":[{"id":"https://openalex.org/I4210148468","ror":"https://ror.org/05szzwt63","display_name":"Industrial Technology Research Institute","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":5,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":5,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","count":3,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","count":2,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":5.91e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","value":3.13e-05,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":2.83e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","value":1.12e-05,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8517168760299683},{"id":"160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","score":0.7805465459823608},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.5423378348350525},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.4697559177875519},{"id":"2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","score":0.4688865840435028}],"counts_by_year":[{"year":2003,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2011,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":3,"oa_works_count":0,"cited_by_count":18},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":9},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":8},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":1}],"display_name_alternatives":["Yu-Jiau Huang","Yuh-Jiau Huang"],"block_key":"y huang","works_api_url":"https://api.openalex.org/works?filter=author.id:A5113578268","awards_count":0,"updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}