{"id":"https://openalex.org/A5113542555","orcid":null,"observed_orcids":[],"display_name":"Stephen Kenny","raw_author_names":["Stephen Kenny"],"full_name":"Kenny, Stephen T.","works_count":17,"cited_by_count":49,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":3,"i10_index":1},"ids":{"openalex":"https://openalex.org/A5113542555","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210098619","ror":"https://ror.org/014cg2q58","display_name":"Atotech (Germany)","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]},"years":[2013,2012,2011,2010,2009,2008]}],"last_known_institutions":[{"id":"https://openalex.org/I4210098619","ror":"https://ror.org/014cg2q58","display_name":"Atotech (Germany)","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":17,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","count":14,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":6,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":5,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","count":2,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":9.64e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","value":7.85e-05,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":7.09e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":4.94e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","value":1.85e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"51807945","wikidata":"https://www.wikidata.org/wiki/Q3503392","display_name":"Electroplating","score":0.8693298101425171},{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8075000047683716},{"id":"191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","score":0.635891318321228},{"id":"2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","score":0.6198999881744385},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.511900007724762}],"counts_by_year":[{"year":2008,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2009,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":4,"oa_works_count":2,"cited_by_count":0},{"year":2011,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":4,"oa_works_count":0,"cited_by_count":1},{"year":2013,"works_count":2,"oa_works_count":0,"cited_by_count":4},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":1}],"display_name_alternatives":["Stephen Kenny"],"block_key":"s kenny","works_api_url":"https://api.openalex.org/works?filter=author.id:A5113542555","updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}