{"id":"https://openalex.org/A5111948705","orcid":null,"observed_orcids":[],"display_name":"Cheng-Ta Ko","raw_author_names":["Cheng-Ta Ko","Cheng-ta Ko"],"full_name":"Cheng-ta Ko","works_count":88,"cited_by_count":1433,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":22,"i10_index":43},"ids":{"openalex":"https://openalex.org/A5111948705","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I142066694","ror":"https://ror.org/04wwsbd59","display_name":"ITRI International","country_code":"US","type":"facility","lineage":["https://openalex.org/I142066694"]},"years":[2015,2014]},{"institution":{"id":"https://openalex.org/I148366613","ror":"https://ror.org/00se2k293","display_name":"National Yang Ming Chiao Tung University","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]},"years":[2015,2014,2013,2012,2010]},{"institution":{"id":"https://openalex.org/I4210113846","ror":"https://ror.org/01dp84930","display_name":"Indium Corporation (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I4210113846"]},"years":[2018]},{"institution":{"id":"https://openalex.org/I4210148468","ror":"https://ror.org/05szzwt63","display_name":"Industrial Technology Research Institute","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]},"years":[2015,2014,2013,2012,2011,2010,2009,2008,2007,2006,2005,2004]}],"last_known_institutions":null,"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":81,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":78,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","count":28,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","count":20,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":13,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0009604,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":0.0004426,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","value":0.0002091,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":0.0001287,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","value":7.02e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8675707578659058},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.6661615371704102},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.5977853536605835},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.5549997687339783},{"id":"119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","score":0.4063992500305176}],"counts_by_year":[{"year":2004,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2005,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2007,"works_count":5,"oa_works_count":0,"cited_by_count":0},{"year":2008,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2009,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2011,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":6,"oa_works_count":0,"cited_by_count":30},{"year":2013,"works_count":6,"oa_works_count":0,"cited_by_count":24},{"year":2014,"works_count":6,"oa_works_count":0,"cited_by_count":31},{"year":2015,"works_count":4,"oa_works_count":0,"cited_by_count":50},{"year":2016,"works_count":1,"oa_works_count":0,"cited_by_count":52},{"year":2017,"works_count":7,"oa_works_count":0,"cited_by_count":54},{"year":2018,"works_count":12,"oa_works_count":0,"cited_by_count":96},{"year":2019,"works_count":6,"oa_works_count":0,"cited_by_count":115},{"year":2020,"works_count":10,"oa_works_count":2,"cited_by_count":118},{"year":2021,"works_count":9,"oa_works_count":2,"cited_by_count":175},{"year":2022,"works_count":3,"oa_works_count":1,"cited_by_count":111},{"year":2023,"works_count":1,"oa_works_count":0,"cited_by_count":164},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":107},{"year":2025,"works_count":1,"oa_works_count":1,"cited_by_count":141},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":108}],"display_name_alternatives":["Cheng-Ta Ko","Cheng-ta Ko"],"block_key":"c ko","works_api_url":"https://api.openalex.org/works?filter=author.id:A5111948705","updated_date":"2026-11-06T12:48:51","created_date":"2016-06-24T00:00:00"}