{"id":"https://openalex.org/A5111848926","orcid":null,"observed_orcids":[],"display_name":"Seung-Kyu Lim","raw_author_names":["Seung-Kyu Lim","Seung-kyu Lim","SeungKyu Lim","Seungkyu Lim"],"full_name":"Seung-Kyu Lim","works_count":17,"cited_by_count":79,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":5,"i10_index":2},"ids":{"openalex":"https://openalex.org/A5111848926","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I2250650973","ror":"https://ror.org/04w3jy968","display_name":"Samsung (South Korea)","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]},"years":[2017,2015]},{"institution":{"id":"https://openalex.org/I4405259277","ror":"https://ror.org/020m7t761","display_name":"Samsung Electronics (South Korea)","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973","https://openalex.org/I4405259277"]},"years":[2017,2015]},{"institution":{"id":"https://openalex.org/I848706","ror":"https://ror.org/04q78tk20","display_name":"Sungkyunkwan University","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]},"years":[2013,2012,2011,2009,2006]}],"last_known_institutions":[{"id":"https://openalex.org/I2250650973","ror":"https://ror.org/04w3jy968","display_name":"Samsung (South Korea)","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]},{"id":"https://openalex.org/I4405259277","ror":"https://ror.org/020m7t761","display_name":"Samsung Electronics (South Korea)","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973","https://openalex.org/I4405259277"]}],"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":7,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","count":6,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":5,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":4,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10049","display_name":"Magnetic properties of thin films","count":3,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":8.27e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":4.94e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","value":3.36e-05,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","value":2.37e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":2.27e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9308983087539673},{"id":"2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","score":0.7545673847198486},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.59743332862854},{"id":"191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","score":0.5436536073684692},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.07289600372314453}],"counts_by_year":[{"year":2006,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2009,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2011,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2012,"works_count":5,"oa_works_count":1,"cited_by_count":3},{"year":2013,"works_count":3,"oa_works_count":0,"cited_by_count":2},{"year":2014,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2015,"works_count":1,"oa_works_count":0,"cited_by_count":4},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":8},{"year":2017,"works_count":1,"oa_works_count":0,"cited_by_count":1},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":9},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":8},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":2}],"display_name_alternatives":["Seung-Kyu Lim","Seung-kyu Lim","SeungKyu Lim","Seungkyu Lim"],"block_key":"s lim","works_api_url":"https://api.openalex.org/works?filter=author.id:A5111848926","awards_count":0,"updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}