{"id":"https://openalex.org/A5111720149","orcid":null,"observed_orcids":[],"display_name":"Chun-Tang Lin","raw_author_names":["Chun-Tang Lin"],"full_name":"Chun-Tang Lin","works_count":13,"cited_by_count":100,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":5,"i10_index":2},"ids":{"openalex":"https://openalex.org/A5111720149","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I212038754","ror":"https://ror.org/010fp8b41","display_name":"Siliconware Precision Industries (Taiwan)","country_code":"TW","type":"company","lineage":["https://openalex.org/I212038754"]},"years":[2015,2014,2013,2012,2011]}],"last_known_institutions":[{"id":"https://openalex.org/I212038754","ror":"https://ror.org/010fp8b41","display_name":"Siliconware Precision Industries (Taiwan)","country_code":"TW","type":"company","lineage":["https://openalex.org/I212038754"]}],"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":12,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":11,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","count":5,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","count":2,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10732","display_name":"Laser Material Processing Techniques","count":1,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0001419,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":6.24e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","value":5.22e-05,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","value":1.42e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13312","display_name":"Mechanical and Thermal Properties Analysis","value":1.18e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8149261474609375},{"id":"68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","score":0.7223504781723022},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.7162659168243408},{"id":"2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","score":0.5035716891288757},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.35563042759895325}],"counts_by_year":[{"year":2011,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":3,"oa_works_count":0,"cited_by_count":1},{"year":2013,"works_count":4,"oa_works_count":0,"cited_by_count":5},{"year":2014,"works_count":2,"oa_works_count":0,"cited_by_count":8},{"year":2015,"works_count":1,"oa_works_count":0,"cited_by_count":5},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":9},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":20},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":8},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":9},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":5}],"display_name_alternatives":["Chun-Tang Lin"],"block_key":"c lin","works_api_url":"https://api.openalex.org/works?filter=author.id:A5111720149","updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}