{"id":"https://openalex.org/A5111686933","orcid":null,"observed_orcids":[],"display_name":"J. Jay McMahon","raw_author_names":["J. J. MCMAHON","J. J. McMahon","J. Jay McMahon","J.J. McMahon","J.\u2009J. McMahon","Jay McMahon"],"full_name":"J. Jay McMahon","works_count":42,"cited_by_count":691,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":14,"i10_index":20},"ids":{"openalex":"https://openalex.org/A5111686933","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I1282105669","ror":"https://ror.org/05gvnxz63","display_name":"Argonne National Laboratory","country_code":"US","type":"facility","lineage":["https://openalex.org/I1282105669","https://openalex.org/I1330989302","https://openalex.org/I39565521","https://openalex.org/I40347166"]},"years":[1988,1986]},{"institution":{"id":"https://openalex.org/I1332737386","ror":"https://ror.org/013msgt25","display_name":"General Electric (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I1332737386"]},"years":[2015,2012,2009]},{"institution":{"id":"https://openalex.org/I164389053","ror":"https://ror.org/03qnxaf80","display_name":"Fordham University","country_code":"US","type":"education","lineage":["https://openalex.org/I164389053"]},"years":[1988]},{"institution":{"id":"https://openalex.org/I165799507","ror":"https://ror.org/01rtyzb94","display_name":"Rensselaer Polytechnic Institute","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]},"years":[2012,2008,2007,2006,2005,2004,2003,1986,1985]},{"institution":{"id":"https://openalex.org/I4210134512","ror":"https://ror.org/03e06qt98","display_name":"GE Global Research (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I4210134512"]},"years":[2012,2008]},{"institution":{"id":"https://openalex.org/I58956616","ror":"https://ror.org/051fd9666","display_name":"Case Western Reserve University","country_code":"US","type":"education","lineage":["https://openalex.org/I58956616"]},"years":[1999]}],"last_known_institutions":[{"id":"https://openalex.org/I1332737386","ror":"https://ror.org/013msgt25","display_name":"General Electric (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I1332737386"]}],"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":27,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":18,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","count":10,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":10,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","count":8,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.00031,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":9.86e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":9.49e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","value":4.35e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","value":3.99e-05,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9290500283241272},{"id":"160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","score":0.8831387758255005},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.6665946841239929},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.558537483215332},{"id":"2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","score":0.5003519058227539}],"counts_by_year":[{"year":1985,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1986,"works_count":4,"oa_works_count":0,"cited_by_count":0},{"year":1988,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":1999,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2003,"works_count":4,"oa_works_count":0,"cited_by_count":0},{"year":2004,"works_count":4,"oa_works_count":0,"cited_by_count":0},{"year":2005,"works_count":6,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":6,"oa_works_count":0,"cited_by_count":0},{"year":2007,"works_count":5,"oa_works_count":1,"cited_by_count":0},{"year":2008,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2009,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2012,"works_count":2,"oa_works_count":1,"cited_by_count":50},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":29},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":31},{"year":2015,"works_count":2,"oa_works_count":0,"cited_by_count":19},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":19},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":28},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":17},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":12},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":19},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":21},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":21},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":24},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":16},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":7}],"display_name_alternatives":["J. J. MCMAHON","J. J. McMahon","J. Jay McMahon","J.J. McMahon","J.\u2009J. McMahon","Jay McMahon"],"block_key":"j mcmahon","works_api_url":"https://api.openalex.org/works?filter=author.id:A5111686933","updated_date":"2026-11-01T11:00:13","created_date":"2016-06-24T00:00:00"}