{"id":"https://openalex.org/A5111515364","orcid":null,"observed_orcids":[],"display_name":"Shih\u2010Han Lo","raw_author_names":["Shih-Han Lo","Shih-han Lo","Shih\u2010Han Lo"],"full_name":"Shih-Han Lo","works_count":12,"cited_by_count":7736,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":10,"i10_index":10},"ids":{"openalex":"https://openalex.org/A5111515364","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I111979921","ror":"https://ror.org/000e0be47","display_name":"Northwestern University","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]},"years":[2016,2014,2013,2012,2011]},{"institution":{"id":"https://openalex.org/I1282105669","ror":"https://ror.org/05gvnxz63","display_name":"Argonne National Laboratory","country_code":"US","type":"facility","lineage":["https://openalex.org/I1282105669","https://openalex.org/I1330989302","https://openalex.org/I39565521","https://openalex.org/I40347166"]},"years":[2014,2011]},{"institution":{"id":"https://openalex.org/I21370196","ror":"https://ror.org/02j61yw88","display_name":"Aristotle University of Thessaloniki","country_code":"GR","type":"education","lineage":["https://openalex.org/I21370196"]},"years":[2014]},{"institution":{"id":"https://openalex.org/I27837315","ror":"https://ror.org/00jmfr291","display_name":"University of Michigan","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]},"years":[2014,2013]},{"institution":{"id":"https://openalex.org/I87216513","ror":"https://ror.org/05hs6h993","display_name":"Michigan State University","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]},"years":[2014,2013,2011]}],"last_known_institutions":[{"id":"https://openalex.org/I111979921","ror":"https://ror.org/000e0be47","display_name":"Northwestern University","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]}],"topics":[{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","count":12,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","count":12,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","count":7,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12442","display_name":"Thermal Radiation and Cooling Technologies","count":4,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10857","display_name":"Advanced Electron Microscopy Techniques and Applications","count":1,"subfield":{"id":"https://openalex.org/subfields/1315","display_name":"Structural Biology"},"field":{"id":"https://openalex.org/fields/13","display_name":"Biochemistry, Genetics and Molecular Biology"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}}],"topic_share":[{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","value":8.23e-05,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","value":7.79e-05,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12442","display_name":"Thermal Radiation and Cooling Technologies","value":6.04e-05,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","value":5.53e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10857","display_name":"Advanced Electron Microscopy Techniques and Applications","value":5.4e-06,"subfield":{"id":"https://openalex.org/subfields/1315","display_name":"Structural Biology"},"field":{"id":"https://openalex.org/fields/13","display_name":"Biochemistry, Genetics and Molecular Biology"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8722977638244629},{"id":"63024428","wikidata":"https://www.wikidata.org/wiki/Q552456","display_name":"Thermoelectric effect","score":0.8495137095451355},{"id":"207365445","wikidata":"https://www.wikidata.org/wiki/Q15020929","display_name":"Thermoelectric materials","score":0.7809766530990601},{"id":"97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","score":0.2881013751029968},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.10750019550323486}],"counts_by_year":[{"year":2011,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":3,"oa_works_count":1,"cited_by_count":14},{"year":2013,"works_count":2,"oa_works_count":0,"cited_by_count":52},{"year":2014,"works_count":5,"oa_works_count":1,"cited_by_count":183},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":390},{"year":2016,"works_count":1,"oa_works_count":0,"cited_by_count":552},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":642},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":705},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":718},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":719},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":750},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":671},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":611},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":619},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":598},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":510}],"display_name_alternatives":["Shih-Han Lo","Shih-han Lo","Shih\u2010Han Lo"],"block_key":"s lo","works_api_url":"https://api.openalex.org/works?filter=author.id:A5111515364","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5111515364","updated_date":"2026-11-11T13:02:13","created_date":"2016-06-24T00:00:00"}