{"id":"https://openalex.org/A5111492865","orcid":null,"observed_orcids":[],"display_name":"Zhi-Cheng Hsiao","raw_author_names":["Zhi-Cheng Hsiao"],"full_name":"Zhi-Cheng Hsiao","works_count":19,"cited_by_count":244,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":10,"i10_index":10},"ids":{"openalex":"https://openalex.org/A5111492865","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I142066694","ror":"https://ror.org/04wwsbd59","display_name":"ITRI International","country_code":"US","type":"facility","lineage":["https://openalex.org/I142066694"]},"years":[2015,2014]},{"institution":{"id":"https://openalex.org/I4210148468","ror":"https://ror.org/05szzwt63","display_name":"Industrial Technology Research Institute","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]},"years":[2015,2014,2013,2012,2011,2010,2009,2008]}],"last_known_institutions":[{"id":"https://openalex.org/I142066694","ror":"https://ror.org/04wwsbd59","display_name":"ITRI International","country_code":"US","type":"facility","lineage":["https://openalex.org/I142066694"]},{"id":"https://openalex.org/I4210148468","ror":"https://ror.org/05szzwt63","display_name":"Industrial Technology Research Institute","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":18,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":15,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","count":9,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","count":4,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","count":3,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0002121,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","value":9.39e-05,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":8.46e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","value":3.43e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","value":1.35e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9193387031555176},{"id":"160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","score":0.870360255241394},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.6661615371704102},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.5773878693580627},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.2432800829410553}],"counts_by_year":[{"year":2008,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2009,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2011,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":5,"oa_works_count":0,"cited_by_count":26},{"year":2013,"works_count":1,"oa_works_count":0,"cited_by_count":15},{"year":2014,"works_count":4,"oa_works_count":0,"cited_by_count":16},{"year":2015,"works_count":2,"oa_works_count":0,"cited_by_count":22},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":22},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":17},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":18},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":12},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":14},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":12},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":18},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":13},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":13},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":7}],"display_name_alternatives":["Zhi-Cheng Hsiao"],"block_key":"z hsiao","works_api_url":"https://api.openalex.org/works?filter=author.id:A5111492865","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5111492865","updated_date":"2026-11-10T14:30:39","created_date":"2016-06-24T00:00:00"}