{"id":"https://openalex.org/A5111472662","orcid":null,"observed_orcids":[],"display_name":"Tung\u2010Yen Lai","raw_author_names":["T. Y. Lai","Tung-Yen Lai","Tung\u2010Yen Lai"],"full_name":"Tung-Yen Lai","works_count":18,"cited_by_count":238,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":9,"i10_index":9},"ids":{"openalex":"https://openalex.org/A5111472662","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I148366613","ror":"https://ror.org/00se2k293","display_name":"National Yang Ming Chiao Tung University","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]},"years":[2021,2020]},{"institution":{"id":"https://openalex.org/I4210166867","ror":"https://ror.org/05wcstg80","display_name":"National Institutes of Applied Research","country_code":"TW","type":"government","lineage":["https://openalex.org/I4210128167","https://openalex.org/I4210166867"]},"years":[2019,2015,2014,2013,2012]}],"last_known_institutions":[{"id":"https://openalex.org/I148366613","ror":"https://ror.org/00se2k293","display_name":"National Yang Ming Chiao Tung University","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"topics":[{"id":"https://openalex.org/T10212","display_name":"Electrochemical sensors and biosensors","count":4,"subfield":{"id":"https://openalex.org/subfields/1602","display_name":"Analytical Chemistry"},"field":{"id":"https://openalex.org/fields/16","display_name":"Chemistry"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":4,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","count":4,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","count":4,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11272","display_name":"Nanowire Synthesis and Applications","count":4,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":4.71e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12808","display_name":"Ferroelectric and Negative Capacitance Devices","value":4.35e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11272","display_name":"Nanowire Synthesis and Applications","value":4.27e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":3.95e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","value":2.45e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9225221872329712},{"id":"171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","score":0.6650197505950928},{"id":"119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","score":0.44062793254852295},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.4039672613143921},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.3550949692726135}],"counts_by_year":[{"year":2010,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2011,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":3,"oa_works_count":1,"cited_by_count":0},{"year":2013,"works_count":1,"oa_works_count":0,"cited_by_count":4},{"year":2014,"works_count":2,"oa_works_count":0,"cited_by_count":4},{"year":2015,"works_count":2,"oa_works_count":1,"cited_by_count":6},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":13},{"year":2017,"works_count":1,"oa_works_count":0,"cited_by_count":19},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2019,"works_count":2,"oa_works_count":0,"cited_by_count":17},{"year":2020,"works_count":1,"oa_works_count":1,"cited_by_count":18},{"year":2021,"works_count":4,"oa_works_count":3,"cited_by_count":37},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":22},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":13},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":36},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":18},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":22}],"display_name_alternatives":["T. Y. Lai","Tung-Yen Lai","Tung\u2010Yen Lai"],"block_key":"t lai","works_api_url":"https://api.openalex.org/works?filter=author.id:A5111472662","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5111472662","updated_date":"2026-11-10T14:30:39","created_date":"2016-06-24T00:00:00"}