{"id":"https://openalex.org/A5111404401","orcid":null,"observed_orcids":[],"display_name":"David Huy Trinh","raw_author_names":["David H. Trinh","David Huy Trinh"],"full_name":"David Huy Trinh","works_count":6,"cited_by_count":20,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":2,"i10_index":1},"ids":{"openalex":"https://openalex.org/A5111404401","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I102134673","ror":"https://ror.org/05ynxx418","display_name":"Link\u00f6ping University","country_code":"SE","type":"education","lineage":["https://openalex.org/I102134673"]},"years":[2007]}],"last_known_institutions":null,"topics":[{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","count":4,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13889","display_name":"Advanced Materials and Semiconductor Technologies","count":4,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10132","display_name":"Advanced ceramic materials synthesis","count":2,"subfield":{"id":"https://openalex.org/subfields/2503","display_name":"Ceramics and Composites"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10781","display_name":"Low-Pressure Plasma Processing and Diagnostics","count":2,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10396","display_name":"Fatigue and fracture mechanics","count":1,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T13889","display_name":"Advanced Materials and Semiconductor Technologies","value":3.02e-05,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","value":1.88e-05,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10626","display_name":"High-Temperature Coating Behaviors","value":5.1e-06,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10132","display_name":"Advanced ceramic materials synthesis","value":4.8e-06,"subfield":{"id":"https://openalex.org/subfields/2503","display_name":"Ceramics and Composites"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11062","display_name":"Gear and Bearing Dynamics Analysis","value":4.3e-06,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.7865715622901917},{"id":"19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","score":0.6863114833831787},{"id":"22423302","wikidata":"https://www.wikidata.org/wiki/Q898444","display_name":"Sputtering","score":0.6231110692024231},{"id":"191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","score":0.45593661069869995},{"id":"171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","score":0.2686924934387207}],"counts_by_year":[{"year":2006,"works_count":2,"oa_works_count":1,"cited_by_count":0},{"year":2007,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2008,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2009,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2015,"works_count":1,"oa_works_count":1,"cited_by_count":1},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":1}],"display_name_alternatives":["David H. Trinh","David Huy Trinh"],"block_key":"d trinh","works_api_url":"https://api.openalex.org/works?filter=author.id:A5111404401","awards_count":0,"updated_date":"2026-10-27T12:30:23","created_date":"2016-06-24T00:00:00"}